Abstract: A metal complex represented by the following Formula (1): (wherein M represents palladium or platinum; L represents a ligand selected from carbon monoxide, an olefin compound, an amine compound, a phosphine compound, an N-heterocyclic carbene compound, a nitrile compound and an isocyanide compound; n represents an integer of 0 to 2 showing the number of the ligand; and each of R1 to R4 represents an organic group). The metal complex described above can be fixed on an inorganic oxide while maintaining a skeletal structure thereof to obtain a supported metal complex, which makes it possible to allow the supported metal complex to maintain the same catalytic activity as that of the original metal complex. Also, calcining the supported metal complex obtained in the manner described above makes it possible to obtain a supported metal catalyst improved in catalytic activity to a greater extent than conventional supported metal catalysts.

Abstract: A data processing device in which, on a screen where an MS spectrum for a retention time designated by the analyst is displayed in the upper area and an MS2 spectrum for a precursor ion selected automatically based on the MS spectrum is displayed in the lower area, when an “On” button in a precursor parameter display selection frame in the top part is clicked, excluded ion and priority ion information for that retention time is collected and the m/z ranges and are displayed in a specified display color on the MS spectrum. As a result, it becomes possible to see at a glance whether the precursor ion indicated by upward arrow corresponds to an excluded ion or priority ion.

Abstract: A mass spectrometry is equipped with a liquid specimen supply part which supplies a liquid specimen sandwiched between bubbles, an ion source part ionizes the specimen, and a mass spectrometry part which detects ions separated in accordance with mass. In particular the ion source part is configured so as to include a liquid supply tube for transporting a specimen from the liquid specimen supply part, a degassing/liquid retention part in which bubbles are removed, a spraying part which ionizes the specimen, and a high-voltage power supply part which applies a high voltage to the spraying part. The device is further characterized in that after removing the bubbles, a Taylor cone is formed from the resultant pre-solution, and the specimen is ionized thereafter. Thus, the ionization of an intended specimen is stabilized, and the measurement reproducibility is improved.

Abstract: The invention is adhesive material for a wafer processing used for temporarily bonding a supporting substrate to wafer having a front surface includes circuit formed thereon and a back surface to be processed, including first temporary adhesive layer composed of a layer of a silicone-modified styrene base thermoplastic elastomer, and second temporary adhesive layer composed of a thermosetting polymer layer on first temporary adhesive layer, wherein layer is capable of releasably adhering to front surface of wafer, and layer is capable of releasably adhering to the supporting substrate. Thereby, it provides a temporary adhesive material for wafer processing, wafer processing lamination, and method for manufacturing thin wafer using same, which facilitates temporary adhesion between supporting substrate and wafer having a circuit, is highly compatible with steps of forming TSV and forming wiring on back surface of wafer, allows easy delamination, and is capable of increasing productivity of thin wafers.

Abstract: Provided is a display device that allows a user to perform a variety of input operations. The display device (1) includes a device body (20) and a cover glass (10). The device body (20) includes a principal surface (21), a first side surface (22), and a second side surface (23). The cover glass (10) includes a front portion (11) and a first side portion (12). The front portion (11) covers the principal surface (12). The first side portion (12) covers the first side surface (22). The device body (20) further includes a display portion (21a) and a second touch sensor surface (22a). The display portion (21a) is provided on the principal surface (21). The display portion (21a) forms a first touch sensor surface. The second touch sensor surface (22a) is provided on the first side surface (22). At least an outside surface of a junction of the first side portion (12) with the front portion (11) is formed of a curved surface.

Abstract: A wafer processing laminate is provided comprising a support (3), a temporary adhesive layer (2), and a wafer (1). The temporary adhesive layer (2) has a trilayer structure consisting of a first temporary bond layer (A) of thermoplastic siloxane bond-free polymer, a second temporary bond layer (B) of thermoplastic siloxane polymer, and a third temporary bond layer (C) of thermosetting modified siloxane polymer. In a peripheral region, the second layer (B) is removed so that the first layer (A) is in close contact with the third layer (C).

Abstract: Provided is a mass analysis method that prevents quantitative precision from decreasing. This mass analysis method uses an analysis system including a mass analysis device and a subdetector connected to each other, the subdetector displaying intensity and detection time relating to constituents of a sample at a preceding stage of the mass analysis device, the method comprising: (a) after injection of a sample, analyzing the sample with an analyzing apparatus including the subdetector, and after the sample has passed through the subdetector, injecting the sample into the mass analysis device; (b) acquiring data from both the subdetector and the mass analysis device; and (c) determining which of peaks that the subdetector and the mass analysis device have detected is to be analyzed, based on whether overlapping peaks are present and whether the same peak between data from the subdetector and the mass analysis device is present.

Abstract: A chemically amplified positive resist composition comprising (A) 100 pbw of a base resin which is normally alkali insoluble or substantially insoluble, (B) 0.05-20 pbw of a photoacid generator, (C) 0.1-50 pbw of a thermal crosslinker, and (D) 50-5,000 pbw of an organic solvent is coated to form a thick film having a high sensitivity and resolution.

Abstract: A supporting unit structure of a vehicle seat includes: a rubber elastic body; a seat-connected member; and a floor-connected member. An inner peripheral portion of the rubber elastic body is fastened to either one of the seat-connected member or the floor-connected member by a fastening member that penetrates the inner peripheral portion, and an outer peripheral portion of the rubber elastic body is fastened to the other one of the seat-connected member or the floor-connected member. The other one of the seat-connected member or the floor-connected member is provided with a stopper portion that abuts the fastening member in a radial direction of the fastening member when the seat-connected member and the floor-connected member are relatively displaced by more than a predetermined distance.

Abstract: A seat elastic support structure includes: a slide adjuster; a foot member; and an elastic support body interposed between the slide adjuster and the foot member and having an outer tube member, an inner tube member arranged inside the outer tube member, and an elastic body interposed between the outer tube member and the inner tube member, wherein: an end portion on a (?X, ?Z) side in an axis line direction of the inner tube member is in contact with the slide adjuster; the foot member is provided with a through hole (30) into which the outer tube member (51) is inserted; and an inner peripheral surface of the through hole and an outer peripheral surface of the outer tube member are joined to each other.

Abstract: A data processing device in which, on a screen where an MS spectrum for a retention time designated by the analyst is displayed in the upper area and an MS2 spectrum for a precursor ion selected automatically based on the MS spectrum is displayed in the lower area, when an “On” button in a precursor parameter display selection frame in the top part is clicked, excluded ion and priority ion information for that retention time is collected and the m/z ranges and are displayed in a specified display color on the MS spectrum. As a result, it becomes possible to see at a glance whether the precursor ion indicated by upward arrow corresponds to an excluded ion or priority ion.

Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.

Abstract: Disclosed is a wafer process body, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is provided with a first temporary adhesive layer including a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable and a second temporary adhesive layer comprised of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer and adhered to the supporting body so as to be detachable. Thus, temporary adhesion of a wafer with a supporting body may become easy, process conformity with the TSV formation process and with the wafer-back surface-wiring process may become high, and removal may be done easily, with high productivity.

Abstract: A chemically amplified positive resist composition is provided comprising an alkali-insoluble or substantially alkali-insoluble polymer having an acid labile group-protected acidic functional group, an alkyl vinyl ether polymer, a photoacid generator, and a benzotriazole compound in a solvent. The composition forms on a substrate a resist film of 5-100 ?m thick which can be briefly developed to form a pattern at a high sensitivity and a high degree of removal or dissolution to bottom.

Abstract: In a chemically amplified positive resist composition comprising a base resin and an acid generator in a solvent, the base resin contains both an alkali-insoluble or substantially alkali-insoluble polymer having an acid labile group-protected acidic functional group having a Mw of 1,000-500,000 and an alkyl vinyl ether polymer having a Mw of 10,000-500,000. The composition forms on a substrate a resist film of 5-100 ?m thick which can be briefly developed to form a pattern at a high sensitivity and a high degree of removal or dissolution to bottom.

Abstract: A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.

Abstract: A temporary adhesive material for a wafer includes a first temporary adhesive layer of a silicone-containing polymer layer containing a photo base generator and a second temporary adhesive layer of a silicone-containing polymer layer which is laminated on the first temporary adhesive layer, does not contain the photo base generator, and is different from the polymer layer. Thereby, there can be formed a temporary adhesive layer having high thickness uniformity, even on a wafer having a step. Because of the thickness uniformity, a thin wafer having a uniform thickness of 50 ?m or less can be easily obtained. When a thin wafer is produced and then delaminated from a support, the wafer can be delaminated from the support by exposure at a low exposure dose without stress. Therefore, a brittle thin wafer can be easily handled without causing damage, and a thin wafer can be easily produced.

Abstract: A chemically amplified positive resist composition comprising (A) 100 pbw of a base resin which is normally alkali insoluble or substantially insoluble, (B) 0.05-20 pbw of a photoacid generator, (C) 0.1-50 pbw of a thermal crosslinker, and (D) 50-5,000 pbw of an organic solvent is coated to form a thick film having a high sensitivity and resolution.

Abstract: A mass spectrometer is provided including: a collision chamber of generating fragment ions by superimposingly applying an AC voltage and a first DC voltage between linear multipolar electrodes, and accelerating the fragment ions by applying a second DC voltage between a front stage electrode and a later stage electrode; a mass spectrometer unit of carrying out mass separation of the fragment ions; and a control unit of determining the second DC voltage based on the mass-to-charge ratios such that the rates of the fragment ions in the collision chamber become equal regardless of the mass-to-charge ratios. Herein, the control unit increases the second DC voltage as the mass-to-charge ratios selected by the mass spectrometer unit become larger. This allows the mass window to be wider even when a DC electric field is generated in order to solve a crosstalk drawback, in the movement direction of the molecular ions.

Abstract: The present invention provides a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III): (I) a siloxane unit (T unit) represented by R1SiO3/2: 40 to 99 mol %; (II) a siloxane unit (D unit) represented by R2R3SiO2/2: 59 mol % or less; and (III) a siloxane unit (M unit) represented by R4R5R6SiO1/2: 1 to 30 mol %. There can be an organopolysiloxane, which is soluble in a nonpolar organic solvent so that the organopolysiloxane can be peeled in a short time, and which is hardly soluble in a polar organic solvent to be exemplarily used upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom so that the organopolysiloxane is not peeled from the supporting substrate upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom.