Abstract: A polishing pad capable of removing waviness of a surface of a polishing target having a curved surface is provided. A polishing pad (10) includes a structure (40, 50) including a polishing surface (30) formed of a hard resin layer (40), the structure (40, 50) allowing the polishing surface (30) to follow a curved surface of a polishing target (90).

Abstract: Provided is a composition for polishing a titanium alloy material, which enables polishing of a titanium alloy material at a high polishing speed and can provide a polished titanium alloy material having excellent surface smoothness and having a highly glossy surface after polishing. The composition for polishing a titanium alloy material is a composition that is intended for polishing a titanium alloy material and comprises a compound having a function of dissolving at least one metal element other than titanium, which exists at a content of more than 0.5% by mass with respect to the total mass of the titanium alloy material, at a higher degree of solubility than that of titanium; and abrasive grains.

Abstract: Provided is an article having a metal oxide coating employing a novel configuration exhibiting both color and metallic luster. The article having a metal oxide coating disclosed herein is provided with a base material including a metal material and a metal oxide coating including a metal oxide coated onto the surface of the base material. The metal oxide coating is formed by polishing the surface of the base material, using particles composed of the metal oxide.

Abstract: A metal oxide film suitable for protection of metals, composed mainly of aluminum. A metal oxide film includes a film of an oxide of a metal composed mainly of aluminum, having a thickness of 10 nm or greater, and exhibiting a moisture release rate from the film of 1E18 mol./cm2 or less. Further, there is provided a process for producing a metal oxide film, wherein a metal composed mainly of aluminum is subjected to anodic oxidation in a chemical solution of 4 to 10 pH value so as to obtain a metal oxide film.

Abstract: A polishing device includes a polishing member, a tool, and a contact mechanism. The polishing member includes a polishing surface that is shaped in conformance with the shape of an end of a workpiece. The tool functions as a shape-processing cutting tool or a surface modifying tool that has the same shape as the shape of the end. The shape-processing cutting tool processes the polishing surface of the polishing member to be shaped in conformance with the shape of the end. The surface modifying tool modifies the polishing surface to be shaped in conformance with the shape of the portion to be polished. The contact mechanism brings the tool into contact with the polishing surface of the polishing member.

Abstract: A polishing device includes a motor movement mechanism and a second motor that rotates a workpiece. The motor movement mechanism moves the workpiece in a direction tangential to a radially outer circumferential surface of a polishing member and moves the workpiece in a direction orthogonal to a rotational axis of the polishing member.

Abstract: [Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. [Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect.

Abstract: The present invention relates to a polishing method using a polishing tool provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to efficiently and uniformly polish the curved surface of the object. A polishing tool of the present invention is provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object. The polishing pad preferably has a Shore A hardness of 5 or greater. A polishing method of the present invention uses a polishing tool including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object and polish the curved surface of the object.

Abstract: Provided is a polishing composition which can polish a sapphire substrate having a non-polar plane or a semi-polar plane at a high polishing rate. The invention is a polishing composition used in an application to polish a sapphire substrate having a non-polar plane or a semi-polar plane, the polishing composition containing colloidal silica particles and water, in which a value obtained by dividing a specific surface area (unit: m2/g) of the colloidal silica particles by a number average particle diameter (unit: nm) of the colloidal silica particles, that is, (specific surface area/number average particle diameter) is 0.5 or more and 3.0 or less.

Abstract: An alloy material polishing method of the present invention is a method for polishing an alloy material containing a main component and 0.5% by mass or more of an accessory component element having a Vickers hardness (HV) different from that of the main component by 5 or more. The polishing method is characterized by polishing a surface of the alloy material using a polishing composition containing abrasive grains and an oxoacid-based oxidizing agent. The main component of the alloy material is preferably at least one selected from aluminum, titanium, iron, nickel, and copper. The main component of the alloy material is preferably aluminum, and the accessory component element is preferably at least one selected from silicon, magnesium, iron, copper, and zinc. The polishing method preferably includes preliminarily polishing the alloy material using a preliminary polishing composition before the polishing of the alloy material using the polishing composition.

Abstract: Provided is an article having a novel surface with a texture different from conventional kinds. The article having a metal oxide-containing coating provided by the present invention comprises a substrate and a metal oxide-containing coating provided to the substrate surface. The metal oxide-containing coating has a Vickers hardness of 350 or higher, a surface roughness Ra of 300 nm or less, and a 20° gloss value of 50 or higher.

Abstract: Provided is a polishing composition with which a high glossy surface is achieved by enhancing smoothness of a surface of an alloy material while maintaining a sufficiently high polishing speed for the alloy material. The present invention relates to a polishing composition used for an application of polishing an alloy material, which contains silica particles having a primary particle average aspect ratio of at least 1.10 and a pH controlling agent.

Abstract: A polishing composition which is able to decrease a difference in polishing rate between the alloy material and the resin, and to polish both the alloy material and the resin at a high polishing rate when polishing a substrate which contains an alloy material and a resin on the surface and has a ratio of the alloy material area to the total polishing area in a specific range is provided. To provide the polishing composition used to polish a substrate which contains an alloy material and a resin on a surface thereof and has a ratio of an alloy material area to a total polishing area of from 60 to 95%, the polishing composition containing crystalline abrasive grains having a cumulative 50% particle size (D50) based on a volume-based particle size distribution of 5.0 ?m or more, an acid or a salt thereof and a water-soluble polymer.

Abstract: A polishing composition contains colloidal silica. The colloidal silica satisfies the expression A×D×E×F?350,000 where “A” denotes the average aspect ratio (dimensionless) of the colloidal silica, “D” denotes the average particle diameter (units: nm) of the colloidal silica, “E” denotes the standard deviation of the particle size (units: nm) of the colloidal silica, and “F” denotes the volume fraction (units: %) of particles having a diameter of 1 to 300 nm in the colloidal silica. The volume fraction of particles having a diameter of 1 to 300 nm in the colloidal silica is 90% or greater.

Abstract: A filtration method, that includes: (A) filtering a liquid having particles with a resin media filter; and (B) applying ultrasonic waves at a frequency of at least 30 kHz to the resin media filter during the filtering (A) or after completion of the filtering (A) to regenerate the resin media filter, where: i) a material of the resin media filter is nylon, polycarbonate, polytetrafluoroethylene (PTFE), polysulfone, polyether sulfone, and/or cellulose, ii) for the regeneration of the resin media filter, the applying results in a filter regeneration ratio of at least 0.40; iii) on a surface of the resin media filter, a support material comprising a mesh resin layer is disposed; and iv) the resin media filter is present in a filter housing having a three-dimensional shape and an ultrasonic vibrator, which generates the ultrasonic waves, is present on a lateral side of said filter housing.

Abstract: The polishing method polishes an alloy material using a polishing pad and a polishing composition supplied to the polishing pad. The polishing composition contains an abrasive of silica or alumina, and a surface temperature of the polishing pad at the end of polishing is 20° C. or below. The method for producing an alloy material comprises a polishing step of polishing an alloy material using a polishing pad and a polishing composition supplied to the polishing pad. The polishing composition contains an abrasive of silica or alumina, and a surface temperature of the polishing pad at the end of polishing is 20° C. or below.

Abstract: A polishing composition contains abrasive grains, a surface adsorptive agent, and water, and is used for polishing an object formed of a crystalline metallic compound. The polishing composition reduces defects on a polished surface of the object compared to a composition obtained by excluding the surface adsorptive agent from the polishing composition.

Abstract: Provided is a metal alloy material polishing composition used for polishing a metal alloy material. The metal alloy material contains a first metal species as a main component and a second metal species that is of a different kind from the first metal species and has a standard electrode potential higher than that of the first metal species. The metal alloy material polishing composition contains a compound having a functional group bonded to carbon and capable of trapping the second metal species.

Abstract: A cleaning agent for an alloy material is provided. The cleaning agent has a pH in a range between 1.5 and 4, inclusive, and contains an anionic surfactant having an SO3M group (where M represents a counter ion). It is preferable that the cleaning agent for an alloy material further contains an organic acid. A method for producing an alloy material is also provided. The method includes a step for cleaning the alloy material using the cleaning agent for an alloy material.

Abstract: A polishing composition contains colloidal silica particles having protrusions on the surfaces thereof. The average of values respectively obtained by dividing the height of a protrusion on the surface of each particle belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles by the width of a base portion of the same protrusion is no less than 0.245. Preferably, the part of the colloidal silica particles that has larger particle diameter than the volume average particle diameter of the colloidal silica particles has an average aspect ratio of no less than 1.15. Preferably, the protrusions on the surfaces of particles belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles have an average height of no less than 3.5 nm.