Abstract: A highly efficient method for cleaning a substrate, whereby in the cleaning of the substrate, {circle around (1)} in a short time, {circle around (2)} both particle contaminants and metal contaminants can be removed, and {circle around (3)} a problem associated therewith, such as re-deposition of contaminants or a dimensional change due to etching, can be remarkably reduced, and which has the following characteristics. A method for cleaning a surface of a substrate, which comprises at least the following steps (1) and (2), wherein the step (2) is carried out after carrying out the step (1): Step (1): A cleaning step of cleaning the surface of the substrate with an alkaline cleaning agent containing a completing agent, and Step (2): A cleaning step employing a cleaning agent having a hydrofluoric acid content C (wt %) of from 0.03 to 3 wt %, wherein the cleaning time t (seconds) of the substrate with said cleaning agent is at most 45 seconds, and C and t satisfy the relationship of 0.25?tC1.29?5.

Abstract: A cleaning solution for cleaning a substrate for semiconductor devices and a cleaning method using the said cleaning solution, which comprises at least the following components (A), (B) and (C): (A) an ethyleneoxide-type surfactant containing a hydrocarbon group which may have a substituent group except for phenyl, and a polyoxyethylene group in which a ratio (m/n) of a number (m) of carbon atoms contained in the hydrocarbon group to a number (n) of oxyethylene groups contained in the polyoxyethylene group is in the range of 1 to 1.5, the number (m) of carbon atoms is not less than 9, and the number (n) of oxyethylene groups is not less than 7; (B) water; and (C) alkali or an organic acid. The cleaning solution highly clean the surface of the substrate without occurrence of corrosion by removing fine particles and organic contaminants which are adhered onto the surface of the substrate.

Abstract: A highly efficient method for cleaning a substrate, whereby in the cleaning of the substrate, {circle over (1)} in a short time, {circle over (2)} both particle contaminants and metal contaminants can be removed, and {circle over (3)} a problem associated therewith, such as re-deposition of contaminants or a dimensional change due to etching, can be remarkably reduced, and which has the following characteristics.

Abstract: A substrate surface cleaning liquid medium and a cleaning method using the cleaning liquid medium are capable of removing finely particulate contaminants more efficiently than conventional techniques from substrates for devices in the production of semiconductor devices, display devices, etc., which cleaning liquid medium contains the following ingredients (A), (B), (C), and (D), has a pH of 9 or higher, and a content of ingredient (C) of 0.

Abstract: A method for treating the surface of a substrate with a surface treatment composition, wherein the surface treatment composition comprises a liquid medium containing a complexing agent as a metal deposition preventive, the complexing agent comprising at least one member selected from Group A complexing agents and at least one member selected from Group B complexing agents as defined hereinafter.

Abstract: A method for treating the surface of a substrate with a surface treatment composition, wherein the surface treatment composition comprises a liquid medium containing a complexing agent as a metal deposition preventive, the complexing agent comprising at least one member selected from Group A complexing agents and at least one member selected from Group B complexing agents as defined hereinafter.

Abstract: A method for treating the surface of a substrate with a surface treatment composition, wherein the surface treatment composition comprises a liquid medium containing a complexing agent as a metal deposition preventive, the complexing agent comprising at least one member selected from Group A complexing agents and at least one member selected from Group B complexing agents defined hereinafter.

Abstract: A surface treatment composition containing a complexing agent as a metal deposition preventive in a liquid medium, in which the complexing agent is an ethylenediaminephenol derivative of the following general formula (1) or its salt: wherein X1 and X2 are hydroxyl groups; Y1 to Y8 are respectively independently a hydrogen atom, a hydroxyl group, a halogen atom, a carboxyl group, a phosphonic acid group, a sulfonic acid group, a carbonyl group, a nitro group, a nitroso group, an amino group, an imino group, a nitrilo group, a nitrile group, a thiocyanate group, a hydroxyamino group, a hydroxyimino group, or an alkyl or alkoxy group which may have a substituent, provided that at least one of Y1 to Y8 is not a hydrogen atom; Z1 to Z4 are respectively independently a hydrogen atom, a carboxyl group or a sulfonic acid group; and R1 to R4 are respectively independently a hydrogen atom or an alkyl group which may have a substituent.

Abstract: A surface treatment composition containing a complexing agent as a metal deposition preventive in a liquid medium, in which the complexing agent is an ethylenediaminephenol derivative of the following general formula (1) or its salt: ##STR1## wherein X.sub.1 and X.sub.2 are hydroxyl groups; Y.sub.1 to Y.sub.8 are respectively independently a hydrogen atom, a hydroxyl group, a halogen atom, a carboxyl group, a phosphonic acid group, a sulfonic acid group, a carbonyl group, a nitro group, a nitroso group, an amino group, an imino group, a nitrilo group, a nitrile group, a thiocyanate group, a hydroxyamino group, a hydroxyimino group, or an alkyl or alkoxy group which may have a substituent, provided that at least one of Y.sub.1 to Y.sub.8 is not a hydrogen atom; Z.sub.1 to Z.sub.4 are respectively independently a hydrogen atom, a carboxyl group or a sulfonic acid group; and R.sub.1 to R.sub.4 are respectively independently a hydrogen atom or an alkyl group which may have a substituent.

Abstract: A method for treating the surface of a substrate with a surface treatment composition, wherein the surface treatment composition comprises a liquid medium containing a complexing agent as a metal deposition preventive.

Abstract: The present invention relates to a polishing composition comprising water, alumina, and a chelating agent. It may optionally be incorporated with an aluminum salt and/or boehmite. The present composition permits efficient polishing and gives a polished surface having superior surface properties. The composition is suitable for polishing a memory hard disk.

Abstract: A multi-port fiberoptic rotary joint comprising a trapezoid prism provided between a rotative member and a fixed member of the rotary joint so as to be rotatable relative to the rotative member and coaxial with said rotative member, a speed change gear mechanism for transmitting the rotation of the rotative member to the trapezoid prism so as to rotate the trapezoid prism at an angular velocity half the angular velocity of the rotative member, rhomboid prisms provided on the entrance side of the trapezoid prism so as to optically guide the light coming from a region outside an aperture of the trapezoid prism to the trapezoid prism as the light parallel to the axis of the trapezoid prism within the aperture thereof, and the rhomboid prisms provided on the exit side of the trapezoid prism so as to optically guide the light emanating from the trapezoid prism to a region outside the aperture of the trapezoid prism, a plurality of pairs of convergent lenses respectively provided to the rotative member and the fixe

Abstract: A rotary joint for polarization plane maintaining optical fibers which can couple two polarization plane maintaining optical fibers to each other while maintaining the polarization plane maintaining property. The rotary joint comprises a rotary member, a fixed member, two optical fiber collimators and a 1/2 wavelength plate for coupling a polarization plane maintaining optical fiber connected to the rotary member with another polarization plane maintaining optical fiber connected to the fixed member, and gears for rotating the 1/2 wavelength plate at a speed equal to one half the rotational speed of the polarization plane maintaining optical fiber on the rotary member side.