Abstract: A semiconductor package having a thinner shape and including an antenna is provided. A semiconductor package comprises a first substrate, a second substrate on the first substrate and including a first face facing the first substrate and a second face opposite to the first face, a pillar extending from the second face of the second substrate to the first substrate, and a first semiconductor chip on the second face of the second substrate and connected to the pillar. The second substrate may include an antenna pattern, and the antenna pattern may be connected to the first semiconductor chip, and may be on the second face of the second substrate such that the antenna pattern is isolated from direct contact with the first semiconductor chip.

Abstract: A substrate treating method includes measuring an alignment state of a substrate placed on a hand of a transfer unit that transfers the substrate, transferring the substrate to a substrate alignment unit by the transfer unit when the alignment state of the substrate is faulty, aligning a location of the substrate by the substrate alignment unit, and temporarily correcting the location of the substrate before the substrate is loaded on the substrate alignment unit when it is measured in the measuring of the alignment state that the alignment state of the substrate exceeds a sensor reading range.

Abstract: A display device includes a display panel including a display surface having a Lambertian light emission distribution, and a viewing angle modulator disposed on the display panel. The viewing angle modulator includes a first refractive layer including a diffraction structure on a surface, a refractive index conversion layer disposed on the first refractive layer and including an electro-optical material having a refractive index that changes when a voltage is applied to the electro-optical material, and a second refractive layer disposed on the refractive index conversion layer. The refractive index conversion layer includes a base layer, and an optical structure disposed on the base layer that changes a path of light incident on a surface facing the second refractive layer.

Abstract: A message processing method and an electronic device for supporting the same are provided. The electronic device includes a communication interface configured to receive a message including a plurality of pages, and a control module configured to process the received message, wherein, if undefined data exists among data contained in a specific page of the plurality of pages, the control module combines at least a part of data contained in a next page that is sequential to the specific page with the undefined data.

Abstract: The present invention relates to a stripper composition for removing a photoresist in a process of manufacturing a semiconductor device. According to the present invention, it is possible to prevent corrosion of the underlying film while improving the peeling force for the photoresist, and to improve the stability of the composition over time.

Abstract: An image forming apparatus includes a print engine, a DC motor, a driving circuit, and a processor. The print engine forms an image. The DC motor drives the print engine. The driving circuit provides a current to the DC motor, and senses a variation of the current provided to the DC motor. The processor calculates a temperature of the DC motor based on the variation of the current flowing through the DC motor, and controls an operation of the image forming apparatus based on the calculated temperature.

Abstract: An image forming apparatus includes a printer engine, a sensor and a processor. The printer engine forms an image. The sensor outputs vibration information associated with a vibration of the printer engine. The processor determines whether at least one component of the printer engine has an abnormality based on the output vibration information.

Abstract: Disclosed is a semiconductor package comprising a first memory chip including a first semiconductor substrate and a first through structure that penetrates the first semiconductor substrate, a second memory chip that directly contacts a top surface of the first memory chip and includes a second semiconductor substrate and a second through structure that penetrates the second semiconductor substrate, a first dummy chip that directly contacts a top surface of the second memory chip and includes a first conductive via, a second dummy chip that directly contacts a top surface of the first dummy chip and includes a second conductive via, and a logic chip in direct contact with a top surface of the second dummy chip. The logic chip is electrically connected to the first through structure through the second conductive via, the first conductive via, and the second through structure.

Abstract: A semiconductor device may include a substrate, a first semiconductor chip buried in the substrate, a first antenna pattern, a second antenna pattern, and outer terminals. A bottom surface of the substrate may include first and second regions spaced apart from each other. The first semiconductor chip may have a first active surface that is directed to the top surface of a core portion of the substrate. The first antenna pattern may be provided on the top surface of the substrate and electrically connected to the first semiconductor chip. The outer terminals may be provided on the first region of the bottom surface of the substrate, and the second antenna pattern may be provided on the second region of the bottom surface of the substrate.

Abstract: A method of manufacturing a semiconductor device includes forming an interlayer insulating layer on a substrate, forming a first mask layer on the interlayer insulating layer, forming a second mask layer and a first spacer on the first mask layer, forming a photoresist pattern on the second mask layer, forming a second mask pattern by patterning the second mask layer through a first etching process, forming a first mask pattern by patterning the first mask layer through a second etching process, forming a trench by etching a portion of the interlayer insulating layer through a third etching process, and forming an interconnection pattern within the trench. A width of the first mask pattern after the second etching process is less than a width of the photoresist pattern.

Abstract: An image forming apparatus and an image forming method are provided. The image forming apparatus includes a printing engine to form an image, a step motor to drive the printing engine, a driving circuit to provide a constant current to the step motor and sense a voltage corresponding to a magnitude of the constant current provided to the step motor, and a processor to calculate a temperature of the step motor based on the voltage sensed by the driving circuit during an excitation period of the step motor and control an operation of the image forming apparatus based on the calculated temperature.

Abstract: A display device includes an optical combiner including a first surface; a second surface disposed at a first side of the first surface; and a third surface disposed at a second side of the first surface; a diffractive optical element disposed on the first surface of the optical combiner; a first display panel disposed on the second surface of the optical combiner and displaying a first color image; and a second display panel disposed on the third surface of the optical combiner and displaying a second color image.

Abstract: The present disclosure relates to a carbon nanotube fiber having improved physical properties and a method for manufacturing the same. The method according to the present disclosure comprises the steps of: spinning carbon nanotubes with a purity of 90% by weight or more to obtain a first carbon nanotube fiber; and heat-treating the first carbon nanotube fiber at 500 to 3,000° C. under an inert gas atmosphere to obtain a second carbon nanotube fiber, wherein the second carbon nanotube fiber has a density of 1.0 to 2.5 g/cm3.

Abstract: A display device includes a display panel including a display surface having a Lambertian light emission distribution, and a viewing angle modulator disposed on the display panel. The viewing angle modulator includes a first refractive layer including a diffraction structure on a surface, a refractive index conversion layer disposed on the first refractive layer and including an electro-optical material having a refractive index that changes when a voltage is applied to the electro-optical material, and a second refractive layer disposed on the refractive index conversion layer. The refractive index conversion layer includes a base layer, and an optical structure disposed on the base layer that changes a path of light incident on a surface facing the second refractive layer.

Abstract: A head mounted display device includes a lens assembly which changes a path of light; a main display module which outputs a main image and is positioned in front of the lens assembly; a main optical block which shields at least a portion of a light representing the main image such that the light representing the main image faces the lens assembly; a sub-display module disposed on a side of the main optical block and which outputs a sub-image; a sub-optical block positioned on the side of the main optical block and which shields at least a portion of a light representing the sub-image; and a light path converter positioned in the sub-optical block and which changes a path of the light representing the sub-image such that the light representing the sub-image faces the lens assembly.

Abstract: A semiconductor device may include a substrate, a first semiconductor chip buried in the substrate, a first antenna pattern, a second antenna pattern, and outer terminals. A bottom surface of the substrate may include first and second regions spaced apart from each other. The first semiconductor chip may have a first active surface that is directed to the top surface of a core portion of the substrate. The first antenna pattern may be provided on the top surface of the substrate and electrically connected to the first semiconductor chip. The outer terminals may be provided on the first region of the bottom surface of the substrate, and the second antenna pattern may be provided on the second region of the bottom surface of the substrate.

Abstract: The inventive concept relates to a substrate treating method including measuring an alignment state of a substrate placed on a hand of a transfer unit that transfers the substrate, transferring the substrate to a substrate alignment unit by the transfer unit when the alignment state of the substrate is faulty, and aligning a location of the substrate by the substrate alignment unit, wherein the substrate treating method includes temporarily correcting the location of the substrate before the substrate is loaded on the substrate alignment unit when it is measured in the measuring of the alignment state that the alignment state of the substrate exceeds a sensor reading range.

Abstract: An image forming apparatus is provided. The image forming apparatus includes a print engine to be used to perform an image forming job, a motor to start the print engine, a driving circuit to supply a power to the motor and to include a sensor to sense a size of current of the power supplied to the motor during an operation to perform the image forming job, and a processor to detect an occurrence of jam based on a size of current sensed by the sensor in a first time interval while the motor is driven and a size of current sensed by the sensor after a determined time from the first time interval.

Abstract: An example operating method of an image forming apparatus includes detecting a position change of a beam with respect to a certain color in a main scanning direction, based on a change in a detection time at which the beam with respect to the certain color is detected by a beam detecting apparatus in the main scanning direction, detecting a position change of the beam with In respect to the certain color in a sub-scanning direction, based on a change in a detection time at which the beam with respect to the certain color is detected by the beam detecting apparatus in the sub-scanning direction, and correcting a value of at least one parameter used for alignment between an image of a reference color and an image of the certain color, based on the position changes of the beam in the main scanning direction and the sub-scanning direction.

Abstract: A display device includes a light source part including a first light source and a second light source, a collimation lens that collimates light incident from the light source part, a wave guide that guides and diffracts the light incident from the collimation lens, a spatial light modulator that modulates the light passing through the wave guide so as to form a holographic pattern for reproducing a holographic image, a focusing optical system that focuses the holographic image on a space, and a light separating plate disposed between the light source part and the collimation lens, the light separating plate separating light of the first light source and light of the second light source from each other.