Patents by Inventor Ho You

Ho You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220053096
    Abstract: An image forming apparatus includes a printer engine, a sensor and a processor. The printer engine forms an image. The sensor outputs vibration information associated with a vibration of the printer engine. The processor determines whether at least one component of the printer engine has an abnormality based on the output vibration information.
    Type: Application
    Filed: March 11, 2020
    Publication date: February 17, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kiho Park, Minkeun Song, SaeJin Park, Yong-Ho You, Sungdae Kim
  • Publication number: 20220043268
    Abstract: A display device includes: a display unit including a plurality of display panels which displays images of different colors, a lens unit on the display unit, an optical path controller on the lens unit, where the optical path controller generates a composite image by superimposing the images displayed by the plurality of display panels with each other, and an output unit through which the composite image is displayed. The optical path controller controls optical paths of light incident on a first surface of the optical path controller facing the lens unit and light incident on a second surface of the optical path controller, which is opposite to the first surface, and provides the composite image to the output unit.
    Type: Application
    Filed: August 5, 2021
    Publication date: February 10, 2022
    Inventors: Young Chan KIM, Jae Ho YOU
  • Publication number: 20220046140
    Abstract: An image forming apparatus includes a print engine, a DC motor, a driving circuit, and a processor. The print engine forms an image. The DC motor drives the print engine. The driving circuit provides a current to the DC motor, and senses a variation of the current provided to the DC motor. The processor calculates a temperature of the DC motor based on the variation of the current flowing through the DC motor, and controls an operation of the image forming apparatus based on the calculated temperature.
    Type: Application
    Filed: March 13, 2020
    Publication date: February 10, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Ji-Young Ji-Young, Hyoungil Kim, Yong-Ho You
  • Publication number: 20210405370
    Abstract: A head mounted display device includes a lens assembly which changes a path of light; a main display module which outputs a main image and is positioned in front of the lens assembly; a main optical block which shields at least a portion of a light representing the main image such that the light representing the main image faces the lens assembly; a sub-display module disposed on a side of the main optical block and which outputs a sub-image; a sub-optical block positioned on the side of the main optical block and which shields at least a portion of a light representing the sub-image; and a light path converter positioned in the sub-optical block and which changes a path of the light representing the sub-image such that the light representing the sub-image faces the lens assembly.
    Type: Application
    Filed: February 11, 2021
    Publication date: December 30, 2021
    Inventors: Cheon Myeong LEE, Young Chan KIM, Jae Ho YOU, Min Gyeong JO, Joo Woan CHO
  • Publication number: 20210398924
    Abstract: A semiconductor package having a thinner shape and including an antenna is provided. A semiconductor package comprises a first substrate, a second substrate on the first substrate and including a first face facing the first substrate and a second face opposite to the first face, a pillar extending from the second face of the second substrate to the first substrate, and a first semiconductor chip on the second face of the second substrate and connected to the pillar. The second substrate may include an antenna pattern, and the antenna pattern may be connected to the first semiconductor chip, and may be on the second face of the second substrate such that the antenna pattern is isolated from direct contact with the first semiconductor chip.
    Type: Application
    Filed: February 10, 2021
    Publication date: December 23, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Se Ho YOU, Hyeong Seob KIM, Seung Kon MOK
  • Patent number: 11186776
    Abstract: The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: November 30, 2021
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hong Jin Lim, Nam Ho You, Seokhoon Ahn, Munju Goh, Se Gyu Jang, Myung Jong Kim
  • Patent number: 11176430
    Abstract: A card socket for mounting a SIM card and an SD card for a mobile communication terminal includes a housing and a shell. The housing includes a first terminal portion having a first terminal disposed therein, a second terminal portion having a second terminal and a third terminal disposed therein, and a switch portion. The shell includes an upper wall and a sidewall. The shell includes a sensing portion extended from the upper wall to detect insertion of a card tray into the card socket. The sensing portion has a shape which is extended downward from the upper wall in the height direction and then is extended upward in the height direction. The switch portion includes a stopper which is configured to come into contact with an upper surface of the sensing portion and to prevent the sensing portion from being lifted up in the height direction.
    Type: Grant
    Filed: February 23, 2020
    Date of Patent: November 16, 2021
    Assignee: Molex, LLC
    Inventors: In Chull Yang, In Ho You, Byung Kyu Bae
  • Publication number: 20210335734
    Abstract: A semiconductor device may include a substrate, a first semiconductor chip buried in the substrate, a first antenna pattern, a second antenna pattern, and outer terminals. A bottom surface of the substrate may include first and second regions spaced apart from each other. The first semiconductor chip may have a first active surface that is directed to the top surface of a core portion of the substrate. The first antenna pattern may be provided on the top surface of the substrate and electrically connected to the first semiconductor chip. The outer terminals may be provided on the first region of the bottom surface of the substrate, and the second antenna pattern may be provided on the second region of the bottom surface of the substrate.
    Type: Application
    Filed: December 15, 2020
    Publication date: October 28, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: SE-HO YOU, SEONGHO SHIN, BANGWEON LEE
  • Publication number: 20210208531
    Abstract: An image forming apparatus is provided. The image forming apparatus includes a print engine to perform an image forming job, a motor to drive the print engine, a driving circuit, to supply a power to the motor, and including a sensor to sense an amount of current of the power supplied to the motor, and a processor to analyze a frequency component of the current supplied to the motor by using the amount of current sensed by the sensor for a predetermined time, and to determine an occurrence of a jam based on the analyzed frequency component.
    Type: Application
    Filed: June 12, 2019
    Publication date: July 8, 2021
    Inventors: Yong-Ho YOU, Hyoungil KIM, Kiho PARK, Minkeun SONG
  • Publication number: 20210175838
    Abstract: An image forming apparatus and an image forming method are provided. The image forming apparatus includes a printing engine to form an image, a step motor to drive the printing engine, a driving circuit to provide a constant current to the step motor and sense a voltage corresponding to a magnitude of the constant current provided to the step motor, and a processor to calculate a temperature of the step motor based on the voltage sensed by the driving circuit during an excitation period of the step motor and control an operation of the image forming apparatus based on the calculated temperature.
    Type: Application
    Filed: August 12, 2019
    Publication date: June 10, 2021
    Inventors: Ji-Young BYUN, Yong-Ho YOU, Hyoungil KIM
  • Publication number: 20210167040
    Abstract: Disclosed is a semiconductor package comprising a first memory chip including a first semiconductor substrate and a first through structure that penetrates the first semiconductor substrate, a second memory chip that directly contacts a top surface of the first memory chip and includes a second semiconductor substrate and a second through structure that penetrates the second semiconductor substrate, a first dummy chip that directly contacts a top surface of the second memory chip and includes a first conductive via, a second dummy chip that directly contacts a top surface of the first dummy chip and includes a second conductive via, and a logic chip in direct contact with a top surface of the second dummy chip. The logic chip is electrically connected to the first through structure through the second conductive via, the first conductive via, and the second through structure.
    Type: Application
    Filed: June 19, 2020
    Publication date: June 3, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: SE-HO YOU, KYUNG SUK OH, SUNKYOUNG SEO
  • Patent number: 10991601
    Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: April 27, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Hwangsoo Park, Jun Ho You, Doo Young Oh, Jaehun Jeong
  • Publication number: 20210120143
    Abstract: An image forming apparatus is provided. The image forming apparatus includes a print engine to be used to perform an image forming job, a motor to start the print engine, a driving circuit to supply a power to the motor and to include a sensor to sense a size of current of the power supplied to the motor during an operation to perform the image forming job, and a processor to detect an occurrence of jam based on a size of current sensed by the sensor in a first time interval while the motor is driven and a size of current sensed by the sensor after a determined time from the first time interval.
    Type: Application
    Filed: July 5, 2019
    Publication date: April 22, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Minkeun SONG, Kiho PARK, Yong-Ho YOU, Hyoungil KIM
  • Patent number: 10975307
    Abstract: Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: April 13, 2021
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Munju Goh, Hyeonuk Yeo, Nam Ho You, Se Gyu Jang, Seokhoon Ahn, Young Soo Kim
  • Publication number: 20210105234
    Abstract: A message processing method and an electronic device for supporting the same are provided. The electronic device includes a communication interface configured to receive a message including a plurality of pages, and a control module configured to process the received message, wherein, if undefined data exists among data contained in a specific page of the plurality of pages, the control module combines at least a part of data contained in a next page that is sequential to the specific page with the undefined data.
    Type: Application
    Filed: December 17, 2020
    Publication date: April 8, 2021
    Inventors: Kyu Hyun KIM, Min O KIM, In Soo KIM, Jun Ho YOU, Sang Min BAE
  • Patent number: 10969700
    Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig supported on the rotating support plate. In the vessel cleaning step, the jig is located such that the center of the jig is offset from the center of the support plate.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: April 6, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Hwangsoo Park, Jun Ho You
  • Patent number: 10873549
    Abstract: A message processing method and an electronic device for supporting the same are provided. The electronic device includes a communication interface configured to receive a message including a plurality of pages, and a control module configured to process the received message, wherein, if undefined data exists among data contained in a specific page of the plurality of pages, the control module combines at least a part of data contained in a next page that is sequential to the specific page with the undefined data.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: December 22, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyu Hyun Kim, Min O Kim, In Soo Kim, Jun Ho You, Sang Min Bae
  • Patent number: 10862833
    Abstract: A message processing method and an electronic device for supporting the same are provided. The electronic device includes a communication interface configured to receive a message including a plurality of pages, and a control module configured to process the received message, wherein, if undefined data exists among data contained in a specific page of the plurality of pages, the control module combines at least a part of data contained in a next page that is sequential to the specific page with the undefined data.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: December 8, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyu Hyun Kim, Min O Kim, In Soo Kim, Jun Ho You, Sang Min Bae
  • Patent number: 10851294
    Abstract: There is provided a fluoride phosphor composite including: fluoride phosphor core particles that may be expressed by the empirical formula AxMFy:Mn4+, wherein A may be at least one selected from the group consisting of Li, Na, K, Rb, and Cs, M may be at least one selected from the group consisting of Si, Ti, Zr, Hf, Ge, and Sn, the composition ratio (x) of A may satisfy 2?x?3, the composition ratio (y) of F may satisfy 4?y?7, each fluoride phosphor composite particle may be coated with a Mn-free fluoride coating. The Mn-free fluoride coating may have a thickness less than or equal to 35% of the size of each fluoride phosphor composite particle.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: December 1, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Ho You, In Hyung Lee, Tae Hoon Kim, Jong Won Park, Chul Soo Yoon, Chi Woo Lee
  • Publication number: 20200363642
    Abstract: A holographic head-up display device includes: a light source portion that emits coherent light; an optical modulation portion that modulates the coherent light; a relay optical system that focuses the modulated light; a filter mirror that includes a reflection area disposed at a focal position of the relay optical system and reflecting light incident through the relay optical system and an absorption area disposed at the periphery of the reflection area and absorbing light incident through the relay optical system; and a transflective mirror that partially transmits and partially reflects light reflected by the filter mirror.
    Type: Application
    Filed: August 5, 2020
    Publication date: November 19, 2020
    Inventors: Hye Sog LEE, Byung Choon YANG, Jae Ho YOU