Abstract: A fluoride phosphor includes fluoride particles represented by AxMFy:Mnz4+ where A is at least one selected from lithium (Li), sodium (Na), potassium (K), rubidium (Rb), and cesium (Cs), M is at least one selected from silicon (Si), titanium (Ti), zirconium (Zr), hafnium (Hf), germanium (Ge) and tin (Sn), a compositional ratio x of A satisfies 2?x?3, and a compositional ratio y of F satisfies 4?y?7; and an organic material physically adsorbed onto surfaces of the fluoride particles to allow the fluoride particles to have hydrophobicity. The fluoride particles have a concentration of Mn4+ gradually reduced from respective centers to respective surfaces of the fluoride particles.

Abstract: An integrated circuit device includes a substrate having a fin-type active region that extends in a first direction, a gate structure that intersects the fin-type active region on the substrate and extends in a second direction perpendicular to the first direction and parallel to an upper surface of the substrate, a guide pattern that extends on the gate structure in the second direction and has an inclined side surface that extends in the second direction, source/drain regions disposed on both sides of the gate structure, and a first contact that is electrically connected to one of the source/drain regions and in which an upper portion contacts the inclined side surface of the guide pattern. The width of an upper portion of the guide pattern in the first direction is less than the width of a lower portion of the guide pattern in the first direction.

Abstract: A semiconductor device includes a lower interlayer insulating film including a first trench and a second trench adjacent each other; a first gate structure within the first trench and extending in a first direction; a second gate structure within the second trench and extending in the first direction; a source/drain adjacent the first gate structure and the second gate structure; an upper interlayer insulating film on the lower interlayer insulating film; and a contact connected to the source/drain, the contact in the upper interlayer insulating film and the lower interlayer insulating film, wherein the contact includes a first side wall and a second side wall, the first side wall of the contact and the second side wall of the contact are asymmetric with each other, and the contact does not vertically overlap the first gate structure and the second gate structure.

Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

Abstract: A package substrate includes a substrate including a circuit region, a dummy region surrounding the circuit region, and a lower circuit pattern at the dummy region, the circuit region including unit regions arranged in a matrix shape, and solders on the lower circuit pattern, at least one of the solders electrically connected to the lower circuit pattern.

Abstract: A backlight unit includes: a light source unit including a point light source; and a light guide plate disposed on a path of light emitted from the light source unit, where a plurality of split patterns is defined in the light guide plate. The plurality of split patterns transmits a part of the light emitted from the light source unit and reflects a remaining part thereof, and the plurality of split patterns is concentrically arranged on the light guide plate and around the light source unit.

Abstract: A holographic head-up display device includes: a light source portion that emits coherent light; an optical modulation portion that modulates the coherent light; a relay optical system that focuses the modulated light; a filter mirror that includes a reflection area disposed at a focal position of the relay optical system and reflecting light incident through the relay optical system and an absorption area disposed at the periphery of the reflection area and absorbing light incident through the relay optical system; and a transflective mirror that partially transmits and partially reflects light reflected by the filter mirror.

Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

Abstract: An image forming apparatus may include an engine portion used to perform an image forming job, a step motor configured to start the engine portion, a driver including a resistor that measures current that flows to a coil of the step motor and is configured to provide a predetermined constant current to the step motor, and a drive controller configured to measure a load level of the step motor based on a voltage value of the resistor and to control the driver to provide the constant current that corresponds to the measured load level.

Abstract: A semiconductor device includes an active fin extended in a first direction on a substrate. A gate structure extends in a second direction, wherein the gate structure intersects the active fin and covers an upper portion of the active fin. A source/drain region is positioned on the active fin adjacent to the gate structure. A silicide layer is on the source/drain region. A contact plug is connected to the source/drain region. A void is present between the silicide layer and the contact plug.

Abstract: A liquid crystal display device is provided. The liquid crystal display device includes an over driving data generator that compares a gray level of a data signal of a present frame with a gray level of a data signal of a previous frame to output an over driving data signal. The data signal has a bit number of n. A data drive IC generates level voltages having a number of more than 2n and outputs one of the level voltages of the over driving data signal. A liquid crystal panel includes a pixel applied with the one of the level voltages.

Abstract: A package substrate includes a substrate including a circuit region, a dummy region surrounding the circuit region, and a lower circuit pattern at the dummy region, the circuit region including unit regions arranged in a matrix shape, and solders on the lower circuit pattern, at least one of the solders electrically connected to the lower circuit pattern.

Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.

Abstract: A semiconductor device includes a substrate having a plurality of fins protruding therefrom and an active region on the fins. The device further includes a contact including a conductive region having a concave portion defining an upper portion and a lower portion of the conductive region, an interlayer insulating layer on the active region, and a side insulating layer interposed between the interlayer insulating layer and the lower portion of the conductive region.

Abstract: A semiconductor device includes an active fin extended in a first direction on a substrate. A gate structure extends in a second direction, wherein the gate structure intersects the active fin and covers an upper portion of the active fin. A source/drain region is positioned on the active fin adjacent to the gate structure. A silicide layer is on the source/drain region. A contact plug is connected to the source/drain region. Avoid is present between the silicide layer and the contact plug.

Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.

Abstract: Disclosed is a method and apparatus for IP-based hybrid 3DTV content transmission and reception. According to one aspect of the present disclosure, an IP-based hybrid 3DTV content reception apparatus includes: a receiving unit receiving multiplexed 3DTV content information; an additional data obtaining unit obtaining service layer signaling information from the received 3DTV content information, and obtaining additional data based on the obtained service layer signaling information; a decoding unit decoding the received 3DTV content information by using the obtained additional data; and a playing back unit playing back the decoded 3DTV content.

Abstract: An image forming apparatus is provided. The image forming apparatus includes an image former configured to perform an image formation; a brushless DC (BLDC) motor configured to start the image former; and a motor controller configured to receive a plurality of driving information from the BLDC motor and to perform a feedback control for the BLDC motor based on at least one of the plurality of received driving information, wherein the motor controller confirms a plurality of error items for the BLDC motor based on the plurality of received driving information.

Abstract: A package substrate includes a substrate including a circuit region, a dummy region surrounding the circuit region, and a lower circuit pattern at the dummy region, the circuit region including unit regions arranged in a matrix shape, and solders on the lower circuit pattern, at least one of the solders electrically connected to the lower circuit pattern.

Abstract: Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.