Patents by Inventor Homayoun Talieh

Homayoun Talieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110239450
    Abstract: Described in one embodiment is a system that has a multiple number of different stations for forming solar cell modules. Described in another embodiment is a system that includes a cutting station, a setting station, and an interconnection station to create different series-connected flexible solar cell modules. Described in still another embodiment is a monolithically integrated multi-module power supply.
    Type: Application
    Filed: October 18, 2010
    Publication date: October 6, 2011
    Inventors: Bulent M. Basol, Jalal Ashjaee, Douglas Young, Homayoun Talieh
  • Publication number: 20100147677
    Abstract: A roll to roll system for depositing a material on a workpiece is provided. In one embodiment, the system includes a drum, which rotates about an axis that is transverse to a process direction, and a number of PVD deposition units. The drum further includes a peripheral surface that includes a groove having a recessed workpiece contact surface that is parallel to the axis and disposed between a first side wall and a second side wall. A portion of the recessed workpiece contact surface supports a section of the workpiece and the first and second side walls maintain the section of the workpiece on the portion of the recessed workpiece contact surface as the workpiece is moved along the process direction. The PVD deposition units are disposed across from some of the portion of the peripheral surface and continuously deposit the material across a width of some of the section of the workpiece.
    Type: Application
    Filed: October 28, 2009
    Publication date: June 17, 2010
    Inventors: Mustafa Pinarbasi, Homayoun Talieh, Bulent M. Basol
  • Patent number: 7704880
    Abstract: A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: April 27, 2010
    Assignee: Novellus Systems, Inc.
    Inventors: Cyprian E. Uzoh, Bulent M. Basol, Hung-Ming Wang, Homayoun Talieh
  • Patent number: 7648622
    Abstract: A method and apparatus for electropolishing a conductive surface of a semiconductor wafer. The apparatus includes a polisher having at least one first electrode and at least one second electrode separated from one another by an isolation region. A moving mechanism rotates the wafer while the conductive surface of the wafer is moved linearly and parallel to a first direction, which varies an exposure of the relative surface areas of the conductive surface to the at least one first electrode and the at least one second electrode.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: January 19, 2010
    Assignee: Novellus Systems, Inc.
    Inventors: Bulent M. Basol, Homayoun Talieh
  • Patent number: 7578923
    Abstract: The present invention provides a process for electropolishing a conductive surface of a semiconductor wafer. During the process, a contact electrode in a contact solution contacts a contact region on surface of the conductive layer with the contact solution. Further, during the process a process electrode in a process solution contacts a process region on the conductive surface with the process solution while applying an electrical potential between the contact electrode and the process electrode to electropolish the surface of the conductive layer of the process region.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: August 25, 2009
    Assignee: Novellus Systems, Inc.
    Inventors: Bulent M. Basol, Homayoun Talieh
  • Patent number: 7572354
    Abstract: The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: August 11, 2009
    Assignee: Novellus Systems, Inc.
    Inventors: Cyprian Emeka Uzoh, Homayoun Talieh, Bulent Basol, Douglas W. Young
  • Patent number: 7491308
    Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: February 17, 2009
    Assignee: Novellus Systems, Inc.
    Inventors: Homayoun Talieh, Cyprian Uzoh, Bulent M. Basol
  • Patent number: 7476304
    Abstract: Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: January 13, 2009
    Assignee: Novellus Systems, Inc.
    Inventors: Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh, Cyprian Uzoh
  • Patent number: 7427337
    Abstract: An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: September 23, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Bulent M. Basol, Jalal Ashjaee, Boris Govzman, Homayoun Talieh, Bernard M. Frey
  • Patent number: 7425250
    Abstract: A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential difference between conductive surface and an electrode and establishing relative motion between the belt pad and the conductive surface result in material removal from the conductive surface. Electrical contact to the surface is provided through either contacts embedded in the belt pad or contacts placed adjacent the belt pad.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: September 16, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Bulent M. Basol, Homayoun Talieh
  • Patent number: 7416975
    Abstract: A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.
    Type: Grant
    Filed: September 21, 2005
    Date of Patent: August 26, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Cyprian E. Uzoh, Bulent M. Basol, Hung-Ming Wang, Homayoun Talieh
  • Patent number: 7378004
    Abstract: An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member contains a plurality of channels, each forming a passage from the top surface to the bottom surface, and each allowing the electrolyte and electric field flow therethrough. A pad is attached to the rigid member via a fastener. The pad also allows for electrolyte and electric field flow therethrough to the substrate.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: May 27, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Cyprian Uzoh, Bulent Basol, Homayoun Talieh
  • Publication number: 20080099344
    Abstract: The present invention provides a process for electropolishing a conductive surface of a semiconductor wafer. During the process, a contact electrode in a contact solution contacts a contact region on surface of the conductive layer with the contact solution. Further, during the process a process electrode in a process solution contacts a process region on the conductive surface with the process solution while applying an electrical potential between the contact electrode and the process electrode to electropolish the surface of the conductive layer of the process region.
    Type: Application
    Filed: March 18, 2003
    Publication date: May 1, 2008
    Inventors: Bulent Basol, Homayoun Talieh
  • Patent number: 7341649
    Abstract: The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: March 11, 2008
    Assignee: Novellus Systems, Inc.
    Inventor: Homayoun Talieh
  • Patent number: 7329335
    Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: February 12, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Homayoun Talieh, Cyprian Uzoh, Bulent M. Basol
  • Patent number: 7311811
    Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: December 25, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Homayoun Talieh, Cyprian Uzoh, Bulent M. Basol
  • Patent number: 7309413
    Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: December 18, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Homayoun Talieh, Cyprian Uzoh, Bulent M. Basol
  • Patent number: 7309407
    Abstract: The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stored in a reservoir and pump through an inlet channel to the liquid chamber. The liquid conductor is injected into a liquid chamber such that the liquid conductor makes contact with the outer surface of the workpiece. An inflatable tube is also provided to prevent the liquid conductor from reaching the back face of the workpiece. A plating solution can be applied to the front face of the workpiece where a retaining ring/seal further prevents the plating solution and the liquid conductor from making contact with each other. In an alternative embodiment, electrical contacts may be formed using an inflatable tube that has either been coated with a conductive material or contains a conductive object.
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: December 18, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Homayoun Talieh, Bulent Basol
  • Patent number: 7309406
    Abstract: The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used for plating/depositing the conductive material and another chamber can be used for polishing the semiconductor substrate. The plating/depositing process can be performed using brush plating or electro chemical mechanical deposition and the polishing process can be performed using electropolishing or chemical mechanical polishing. The present invention further provides a method and apparatus for intermittently applying the conductive material to the semiconductor substrate and also intermittently polishing the substrate when such conductive material is not being applied to the substrate.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: December 18, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Homayoun Talieh, Cyprian Emeka Uzoh
  • Patent number: 7282124
    Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: October 16, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Homayoun Talieh, Cyprian Uzoh, Bulent M. Basol