Abstract: Provided herein are novel compounds, for example, compounds having a Formula (I), or a pharmaceutically acceptable N salt thereof. Also provided herein are methods of preparing the compounds and methods of using the compounds, for example, in inhibiting TYK2, and/or function of IL-12, IL-23 and/or INF-alpha, and/or in treating various associated diseases or disorders.

Abstract: A semiconductor device system comprises an integrated circuit (IC) die. The IC die is configured to operate in a first operating mode during a first period, and a second operating mode during a second period. The first period is associated with enabling an element of the IC die and a first amount of voltage droop. The second period occurs after the first period and is associated with a second amount of voltage droop. The second amount of voltage droop is less than the first amount of voltage droop.

Abstract: The present disclosure provides a direct current (DC) transformer error detection apparatus for a pulsating harmonic signal, including a DC and pulsating harmonic current output module and an external detected input module, where the DC and pulsating harmonic current output module outputs a DC and a DC superimposed pulsating harmonic current to an internal sampling circuit and a self-calibrated standard resistor array; and the internal sampling circuit converts the input DC and the input DC superimposed pulsating harmonic current into a voltage signal, and sends the voltage signal to an analog-to-digital (AD) sampling and measurement component through a front-end conditioning circuit and a detected input channel. The DC transformer error detection apparatus can complete self-calibration for measurement of the DC and the pulsating harmonic signal on a test site.

Abstract: A display device, comprising: a flexible display module (4), a fixing frame (11) and a bending frame (12). The flexible display module comprises a first planar region (41), a second planar region (43), and a first bending region (42) between the first planar region and the second planar region. The fixing frame comprises a first frame (111) for fixing the first planar region and a second frame (112) for fixing the second planar region. The bending frame comprises a first deformation frame (31), a first bending frame (121), a second deformation frame (32), a second bending frame (122), and a bending mechanism (123) between the first bending frame and the second bending frame, the first bending frame being fixed to the first frame by means of first deformation frame, second bending frame being fixed to the second frame by means of second deformation frame.

Abstract: Provided are a driver controller integrated board, a control system, and a robot. The driver controller integrated board includes a control module (1), a drive module (2), and a first substrate (3). The control module (1) and the drive module (2) are disposed on the first substrate (3), and the control module (1) is electrically connected to the drive module (2).

Abstract: An organic field-effect transistor and a fabrication method therefor, including: providing a gate; depositing polymer material onto the gate to form a dielectric layer; performing supercritical fluids treatment on the gate having the dielectric layer deposited; depositing organic semiconductor layer material on the dielectric layer having been processed, to form an organic semiconductor layer; depositing electrode layer material on the organic semiconductor layer and forming an electrode layer. The dielectric properties of the dielectric layer after adopting the supercritical fluids treatment have been significantly improved. While the hysteresis effect of the dielectric layers in the OFET devices has been basically eliminated, the sub-threshold slope of the OFET is also significantly reduced, the carrier mobility is effectively improved. Additionally, an OFET switching rate after being processed is improved, and, by connecting the LEDs in series, the switching rate of the LED is increased.

Abstract: A chip package and method for fabricating the same are provided that includes embedded off-die inductors coupled in series. One of the off-die inductors is disposed in a redistribution layer formed on a bottom surface of an integrated circuit (IC) die. The other of the series connected off-die inductors is disposed in a substrate of the chip package. The substrate may be either an interposer or a package substrate.

Abstract: Disclosed are an online analysis system and method for a line loss of a transmission line. The system includes: a terminal extension and a terminal host, where time information synchronization between the terminal extension and the terminal host and between terminal extensions is performed by a clock synchronization module, and communication between the terminal extension and the terminal host and between the terminal extensions is performed by a communications module; and a line loss management platform, configured to receive measurement data of the terminal extension and the terminal host, match time information in the measurement data, and if time information in the measurement data of the terminal extension and the terminal host is matched, and time information in measurement data of the terminal extensions is matched, determine corresponding line loss information based on corresponding measurement information.

Abstract: Disclosed herein is a chip package and method for fabricating the same are provided that includes a redistribution layer (RDL) with a plurality of loop and void structures. The chip package includes an integrated circuit (IC) die, and a package substrate. The RDL is disposed between the IC die and the package substrate. The RDL has RDL circuitry that connects the IC die to the package substrate. The RDL circuitry includes a first coil formed in a first metal layer and a second coil formed in a second metal layer. A first end of the second coil is coupled to a second end of the first coil by a first via. A second end of the second coil is the IC die.

Abstract: A package device comprises a first transceiver comprising a first integrated circuit (IC) die and transmitter circuitry, and a second transceiver comprising a second IC die and receiver circuitry. The receiver circuitry is coupled to the transmitter circuitry via a channel. The package device further comprises an interconnection device connected to the first IC die and the second IC die. The interconnection device comprises a channel connecting the transmitter circuitry with the receiver circuitry, and a passive inductive element disposed external to the first IC die and the second IC die and along the channel.

Abstract: A chip package and method for fabricating the same are provided that includes a near-die integrated passive device. The near-die integrated passive device is disposed between a package substrate and an integrated circuit die of a chip package. Some non-exhaustive examples of an integrated passive device that may be disposed between the package substrate and the integrated circuit die include a resistor, a capacitor, an inductor, a coil, a balum, or an impedance matching element, among others.

Abstract: Various noise isolation structures and methods for fabricating the same are presented. In one example, a substrate for chip package is provided. The substrate includes a core region, top build-up layers and bottom build-up layers. The top build-up layers are formed on a first side of the core region and the bottom build-up layers are formed on a second side of the core region that is opposite the first side. Routing circuitry formed in the bottom build-up layers is coupled to routing circuitry formed in the top build-up layers by vias formed through the core region. A void is formed in the bottom build-up layers. The void is configured as a noise isolation structure. The void has a sectional area that is different in at least two different distances from the core region.

Abstract: The present invention provides methods for increasing expression of ICOS on an effector T cell comprising contacting said effector T cell with an anti-PD-1 antibody. The present invention also provides methods for decreasing expression of ICOS on a regulatory T cell comprising contacting said regulatory T cell with an anti-PD-1 antibody. The present invention provides methods for increasing sensitivity to an agent directed to ICOS in a human comprising administering to the human an anti-PD1 antibody. The present invention also provides methods of treating cancer in a human in need thereof comprising administering an anti-PD-1 antibody and an anti-ICOS antibody to said human, wherein the anti-PD-1 antibody increases T cell sensitivity to the ICOS antibody.

Abstract: A package device comprises a first transceiver comprising a first integrated circuit (IC) die and transmitter circuitry, and a second transceiver comprising a second IC die and receiver circuitry. The receiver circuitry is coupled to the transmitter circuitry via a channel. The package device further comprises an interconnection device connected to the first IC die and the second IC die. The interconnection device comprises a channel connecting the transmitter circuitry with the receiver circuitry, and a passive inductive element disposed external to the first IC die and the second IC die and along the channel.

Abstract: Disclosed are methods of identifying pathogens and determining their antimicrobial susceptibility. The methods comprise detecting biomarkers in a test sample, locating the sample in a phylogenetic tree based on biomarker information, obtaining drug susceptibility prediction rules based on the phylogenetic tree positioning of the sample, and determining the drug susceptibility of a pathogen according to the prediction rules. Further disclosed are an application of the phylogenetic tree in the preparation of pathogen identification and/or drug susceptibility diagnostic product, and a pathogen identification and drug susceptibility diagnostic kit.

Abstract: Disclosed are an online analysis system and method for a line loss of a transmission line. The system includes: a terminal extension and a terminal host, where time information synchronization between the terminal extension and the terminal host and between terminal extensions is performed by a clock synchronization module, and communication between the terminal extension and the terminal host and between the terminal extensions is performed by a communications module; and a line loss management platform, configured to receive measurement data of the terminal extension and the terminal host, match time information in the measurement data, and if time information in the measurement data of the terminal extension and the terminal host is matched, and time information in measurement data of the terminal extensions is matched, determine corresponding line loss information based on corresponding measurement information.

Abstract: A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular stack to be utilized in a large number of different chip package assembly designs, resulting much faster development times at a fraction of the overall solution cost.

Abstract: A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular stack to be utilized in a large number of different chip package assembly designs, resulting much faster development times at a fraction of the overall solution cost.

Abstract: Techniques for electrostatic discharge (ESD) protection in integrated circuit (IC) chip packages methods for testing the same are described that are configured to directs the risk of ESD events through ground and power interconnects preferentially over I/O interconnects to enhance ESD protection in chip packages. In one example, a chip package is provided that includes an IC die, a substrate, and a plurality of interconnects. The plurality of interconnects are exposed on a side of the substrate opposite the IC die. The interconnects provide terminations for substrate circuitry formed within the substrate. At least one of the last 5 interconnects of the plurality of interconnects respectively comprising rows and columns of interconnects disposed along the edges of the substrate that closest to each corner of substrate project farther from the substrate than interconnects within those rows and columns that are configured as I/O interconnects.

Abstract: Examples of the present disclosure provide example Chip Scale Packages (CSPs). In some examples, a structure includes a first integrated circuit die, a shim die that does not include active circuitry thereon, an encapsulant at least laterally encapsulating the first integrated circuit die and the shim die, and a redistribution structure on the first integrated circuit die, the shim die, and the encapsulant. The redistribution structure includes one or more metal layers electrically connected to the first integrated circuit die.