Patents by Inventor Hong Shi

Hong Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9099999
    Abstract: An integrated circuit in a multi-chip package is provided. The integrated circuit may include adjustable interface circuitry configured to interface with other off-chip components. In particular, the adjustable interface circuitry may include a microbump input-output buffer operable to drive signals off of the integrated circuit and operable to receive signals from other integrated circuits in the multi-chip package via a microbump. The microbump input-output buffer may include output buffers and input buffers. The output buffers may have programmable drive strengths and may each be selectively switched in and out of use depending on the desired application. Each output buffer may include a level shifter, a buffer circuit, and multiple inverter-like circuits each of which can be turned on or off to adjust the drive strength of that output buffer.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: August 4, 2015
    Assignee: Altera Corporation
    Inventors: Bonnie I. Wang, Chiakang Sung, Joseph Huang, Khai Nguyen, Tony Ngai, Zhe Li, Hong Shi
  • Publication number: 20150212751
    Abstract: Embodiments of the present disclosure provide a method and apparatus for storage control. The method comprises: in response to having received a data deletion command on sensitive data, marking a storage medium page where the sensitive data is located as invalid, and putting a storage medium block where the storage medium page is located in a garbage collection queue, wherein the storage medium block is a minimum unit of storage medium erasure in a SSD; determining a secure deletion time corresponding to the sensitive data; in response to a remaining time to a next garbage collection being longer than the secure deletion time corresponding to the sensitive data, setting a value of the remaining time as the secure deletion time; and triggering a garbage collection according to the remaining time. Using the solution according to the embodiment of the present disclosure, the security of the SSD can be enhanced.
    Type: Application
    Filed: January 27, 2015
    Publication date: July 30, 2015
    Inventors: Yong Hong Shi, Qian Su, Yu Sun, Wei You
  • Patent number: 9078354
    Abstract: Provided is an integrated circuit system and method for biasing the same that features bifurcating a power distribution network to provide a bias voltage to the integrated circuit system. One of the branches of the power distribution network attenuates an impedance in the power distribution network that supplies transient currents and the remaining branch supplies a substantially steady-state currents.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: July 7, 2015
    Assignee: Altera Corporation
    Inventor: Hong Shi
  • Patent number: 9046393
    Abstract: A method is provided for measuring remaining hydrogen capacity of hydrogen storage canister incorporating tag information. An information identification tag is attached to a hydrogen storage canister. The information identification tag contains therein at least one record of tag information indicating the hydrogen storage quantity of the hydrogen storage canister. Once the hydrogen storage quantity is read from the tag information of the information identification tag and hydrogen consumption quantity supplied from the hydrogen storage canister is detected, the hydrogen storage quantity is operated by subtracting the hydrogen consumption quantity therefrom to calculate a hydrogen residue, which is then used to update the tag information of the information identification tag or is stored for subsequent use.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: June 2, 2015
    Assignee: ASIA PACIFIC FUEL CELL TECHNOLOGIES, LTD.
    Inventors: Jefferson YS Yang, Feng-Hsiang Hsiao, Hong-Shi Chang, Chih-Hsueh Chen
  • Patent number: 8944119
    Abstract: A method and system of gas refilling management for gas storage canister utilizing identification accessing control includes an identification information transmission device, a control device, and a gas refilling equipment, which are applicable for management of refilling of at least one storage canister. The storage canister is provided with an information identification label, which contains at least one record of canister information. By using the identification information transmission device to first read the information contained in the label of a storage canister, the control device may then set a refilling condition based on which the gas refilling equipment carries out a refilling operation to the storage canister, so as to suit for management of refilling various types of gas storage canisters to provide the best performance in a practical application.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: February 3, 2015
    Assignee: Asia Pacific Fuel Cell Technologies Ltd.
    Inventors: Jefferson Ys Yang, Feng-Hsiang Hsiao, Hong-Shi Chang, Chih-Hsueh Chen
  • Patent number: 8923417
    Abstract: Embodiments disclosed herein relate to apparatus and methods of transceiver power noise reduction. One embodiment relates to a method of serial data communication. At a transmitter, data may be encoded by a communication protocol encoder, and the protocol-encoded data may be serialized. The serialized data may be encoded for power-delivery-network noise reduction (PNR) so as to generate PNR-encoded serial data, and the PNR-encoded serial data may be driven onto a communication channel. Other embodiments, aspects, and features are also disclosed.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: December 30, 2014
    Assignee: Altera Corporation
    Inventors: Zhe Li, Hong Shi
  • Publication number: 20140374877
    Abstract: An integrated circuit includes a decoupling capacitor and an internal circuit. The decoupling capacitor is coupled to a first external terminal of the integrated circuit. The internal circuit in the integrated circuit is coupled to a second external terminal of the integrated circuit. The decoupling capacitor is coupled to provide supply voltage current to the internal circuit through the first and the second external terminals and through external conductors. The external conductors are outside the integrated circuit.
    Type: Application
    Filed: June 21, 2013
    Publication date: December 25, 2014
    Applicant: Altera Corporation
    Inventors: Kyung Suk Oh, Bonnie Wang, Hong Shi, Hui Liu, Sergey Shumarayev, Sunitha Chandra, Weiqi Ding, Kundan Chand
  • Patent number: 8841561
    Abstract: In one embodiment, a printed circuit board (PCB) comprises one or more signal contact pads on a surface of the PCB and a plurality of ground planes embedded in the PCB with at least the ground plane closest to the signal contact pads) having gaps in line with the trace(s). In another embodiment, a PCB comprises one or more signal traces on a first surface of the PCB, a plurality of ground planes embedded in the PCB, and at least one blind via interconnecting the ground planes. In still another embodiment, a PCB comprises one or more signal contact pads on a first surface of the PCB, a plurality of ground planes embedded in the PCB with at least the ground plane closest to the signal contact pad(s) having a gap in line with the signal contact pad(s), and at least one blind via interconnecting the ground planes. In still another embodiment, signal contact pads may be formed on both major surfaces of the PCB.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: September 23, 2014
    Assignee: Altera Corporation
    Inventors: Xiaohong Jiang, Hong Shi
  • Patent number: 8723293
    Abstract: An integrated circuit with an on-die compensation network is presented. The compensation network includes a compensation inductor that has one terminal coupled to a bump pad of the die. Another terminal of the inductor is connected to a metal layer underneath the compensation inductor, forming a pi-configuration with the bump pad. The metal layer routes input and output signals from the integrated circuit. The invention can be used in either flip chip or wire bond applications.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: May 13, 2014
    Assignee: Altera Corporation
    Inventors: Xiaohong Jiang, Hong Shi
  • Patent number: 8716898
    Abstract: An improved power distribution network comprises a substrate, an integrated circuit mounted on the substrate, a first tunable decoupling capacitor mounted on the substrate, and a second tunable decoupling capacitor formed in the integrated circuit. The power supply pin is connected to both the first and second capacitors by a low frequency path and a DC path, respectively, and the first and second capacitors are connected by a high frequency path.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: May 6, 2014
    Assignee: Altera Corporation
    Inventors: Hui Liu, Hong Shi
  • Patent number: 8502386
    Abstract: Broadly speaking, the embodiments of the present invention fill the need for methods of designing vertical transmission lines for optimal signal transition in multi-layer BGA packages. By controlling the impedance and geometry continuity of micro vias in each micro via layer in the package to follow smooth impedance and geometry curves from layer to layer, the return loss and insertion loss of the transmission line can be reduced or controlled to within acceptable ranges.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: August 6, 2013
    Assignee: Altera Corporation
    Inventors: Xiaohong Jiang, Hong Shi
  • Patent number: 8498129
    Abstract: An improved power distribution network for an integrated circuit package that reduces the number of power supply pins that are used in the pin array and achieves better operating performance. In a preferred embodiment, the ratio of power supply pins to input/output (I/O) pins is in the range of approximately 1 to 24 to approximately 1 to 52. In this embodiment, the integrated circuit package comprises a substrate, an integrated circuit mounted on the substrate, a first decoupling capacitor mounted on the substrate, and a second decoupling capacitor formed in the integrated circuit. The package is formed by coupling a power supply pin to both the first and second capacitors by a low frequency path and a DC path, respectively, and the first and second capacitors are coupled by a high frequency path.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: July 30, 2013
    Assignee: Altera Corporation
    Inventors: Hui Liu, Hong Shi, Yuanlin Xie
  • Patent number: 8368174
    Abstract: An integrated circuit with an on-die compensation network is presented. The compensation network includes a compensation inductor that has one terminal coupled to a bump pad of the die. Another terminal of the inductor is connected to a metal layer underneath the compensation inductor, forming a pi-configuration with the bump pad. The metal layer routes input and output signals from the integrated circuit. The invention can be used in either flip chip or wire bond applications.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: February 5, 2013
    Assignee: Altera Corporation
    Inventors: Xiaohong Jiang, Hong Shi
  • Patent number: 8294259
    Abstract: In one embodiment, signaling and ground contacts are located in at least two parallel, rectilinear rows along at least one edge of an interconnect package such as a BGA package. In one row, each of a plurality of ground contacts is located between two pairs of contacts for receiving differential signals. In the second row, each of a plurality of ground contacts is located between two pairs of contacts for transmitting differential signals and the ground contacts in the second row are offset by one column from the ground contacts in the first row. As a result, the ratio of signaling pairs to ground contacts is 2:2. Additional pairs of rows may also be used. In other embodiments, signaling and ground contacts are located in three parallel, rectilinear rows along at least one edge of the package.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: October 23, 2012
    Assignee: Altera Corporation
    Inventors: Xiaohong Jiang, Hong Shi
  • Publication number: 20120176185
    Abstract: Provided is an integrated circuit system and method for biasing the same that features bifurcating a power distribution network to provide a bias voltage to the integrated circuit system. One of the branches of the power distribution network attenuates an impedance in the power distribution network that supplies transient currents and the remaining branch supplies a substantially steady-state currents.
    Type: Application
    Filed: March 23, 2012
    Publication date: July 12, 2012
    Inventor: Hong Shi
  • Patent number: 8164916
    Abstract: Provided is an integrated circuit system and method for biasing the same that features bifurcating a power distribution network to provide a bias voltage to the integrated circuit system. One of the branches of the power distribution network attenuates an impedance in the power distribution network that supplies transient currents and the remaining branch supplies a substantially steady-state currents.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: April 24, 2012
    Assignee: Altera Corportation
    Inventor: Hong Shi
  • Patent number: 8112045
    Abstract: A Radio Frequency RF transmitter includes a translational loop architecture that supports non-constant envelope modulation types and includes by adjusting the envelope of the translational loop at the translational loop output. The RF transmitter includes an Intermediate Frequency (IF) modulator, a translational loop, an envelope time delay adjust block, an envelope adjust block, and a time delay calibration block. The IF modulator receives a modulated baseband signal and produces a modulated IF signal having a non-constant envelope. The translational loop receives the modulated IF signal and produces a modulated RF signal having a constant envelope. The envelope time delay adjust block receives an envelope signal corresponding to the original modulated signal and produces a time delayed envelope signal based upon a time delay control signal. The envelope adjust block adjusts the modulated RF signal based upon the time delayed envelope signal to produce an envelope adjusted modulated RF signal.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: February 7, 2012
    Assignee: Broadcom Corporation
    Inventors: Hong Shi, Henrik T. Jensen
  • Publication number: 20120026672
    Abstract: The present invention relates to a folding structure comprising a storage device with an electronic component at least and a plurality of metal contacts and is configured with electronic component(s), metal contacts, and a plug board or a folding kit to embody the present invention's space effectively used and saved, match the present product's design requirements for lightness, thinness, shortness, and smallness, and integrate with other relevant products to become a combinational product with both multiple functions and its shape advantageous to lightness, thinness, shortness, and smallness.
    Type: Application
    Filed: September 8, 2010
    Publication date: February 2, 2012
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventors: Hong-Shi Yu, Mao-Ting Chang
  • Publication number: 20110227742
    Abstract: A method is provided for measuring remaining hydrogen capacity of hydrogen storage canister incorporating tag information. An information identification tag is attached to a hydrogen storage canister. The information identification tag contains therein at least one record of tag information indicating the hydrogen storage quantity of the hydrogen storage canister. Once the hydrogen storage quantity is read from the tag information of the information identification tag and hydrogen consumption quantity supplied from the hydrogen storage canister is detected, the hydrogen storage quantity is operated by subtracting the hydrogen consumption quantity therefrom to calculate a hydrogen residue, which is then used to update the tag information of the information identification tag or is stored for subsequent use.
    Type: Application
    Filed: December 22, 2010
    Publication date: September 22, 2011
    Applicant: ASIA PACIFIC FUEL CELL TECHNOLOGIES LTD.
    Inventors: JEFFERSON YS YANG, FENG-HSIANG HSIAO, HONG-SHI CHANG, CHIH-HSUEH CHEN
  • Publication number: 20110226382
    Abstract: A method and system of gas refilling management for gas storage canister utilizing identification accessing control includes an identification information transmission device, a control device, and a gas refilling equipment, which are applicable for management of refilling of at least one storage canister. The storage canister is provided with an information identification label, which contains at least one record of canister information. By using the identification information transmission device to first read the information contained in the label of a storage canister, the control device may then set a refilling condition based on which the gas refilling equipment carries out a refilling operation to the storage canister, so as to suit for management of refilling various types of gas storage canisters to provide the best performance in a practical application.
    Type: Application
    Filed: December 22, 2010
    Publication date: September 22, 2011
    Applicant: ASIA PACIFIC FUEL CELL TECHNOLOGIES LTD.
    Inventors: JEFFERSON YS YANG, FENG-HSIANG HSIAO, HONG-SHI CHANG, CHIH-HSUEH CHEN