Patents by Inventor Hongyu Wang

Hongyu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090043770
    Abstract: A method may be used in a multi-threading non-volatile memory file system. The method comprises creating a data structure to store progress information on one or more concurrent operations to access a file system of a non-volatile memory; and executing the one or more concurrent operations based on the progress info.
    Type: Application
    Filed: October 24, 2005
    Publication date: February 12, 2009
    Inventor: Hongyu Wang
  • Publication number: 20080285332
    Abstract: Methods and apparatuses for storage of data in bit-alterable, non-volatile memories. In some embodiments, an array of memory locations implemented as bit-alterable, non-volatile memory configured as a plurality of blocks of memory locations; and control circuitry coupled with the array of memory locations to cause a block of data to be stored in the array of memory spanning a boundary between a first block of memory locations and a second block of memory locations. One or more processors access system data during initialization of an electronic system by retrieving data from a pre-selected location in a bit-alterable, non-volatile memory without scanning multiple memory locations to locate the system data.
    Type: Application
    Filed: December 30, 2005
    Publication date: November 20, 2008
    Inventors: Cheng Zheng, Hongyu Wang
  • Patent number: 7435356
    Abstract: An aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an amphiphilic polymer, the amphiphilic polymer having an ionic hydrophilic portion with a carbon number of 2 to 250 and water.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: October 14, 2008
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Tirthankar Ghosh, Robert D. Solomon, Hongyu Wang
  • Patent number: 7425442
    Abstract: This invention relates to newly identified polynucleotides and polypeptides in the phytic acid biosynthetic pathway, fragments, variants and derivatives of same; methods for making the polynucleotides, polypeptides, fragments, variants, derivatives and antagonists. In particular the invention relates to polynucleotides and polypeptides of the inositol 1,3,4-trisphosphate 5/6-kinase gene family. In particular this invention relates to using the newly identified polynucleotides and polypeptides to modulate the phytic acid biosynthesis in such a way as to decrease phytate and/or increase non-phytate phosphorous, especially in corn or soy animal feedstuffs.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: September 16, 2008
    Assignee: Pioneer Hi-Bred International, Inc.
    Inventors: Jinrui Shi, Hongyu Wang, Yunsheng Wu
  • Publication number: 20080162782
    Abstract: A method of writing a file to a flash memory is disclosed in which the file includes a number of data fragments and at least one sequence table. The method comprises writing the data fragments to a non-volatile memory; writing the at least one sequence table including sequence table entries which identifies locations of the data fragment written to the non-volatile memory to a volatile memory, and writing the sequence table from the volatile memory to the non-volatile memory if the sequence table is full or if writing the data fragments of the file is completed.
    Type: Application
    Filed: June 15, 2005
    Publication date: July 3, 2008
    Inventors: Nagarajan Suresh, Hongyu Wang
  • Patent number: 7384871
    Abstract: The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by weight copolymer of acrylic acid and methacrylic acid, and balance water, wherein the copolymer of acrylic acid and methacrylic acid has a monomer ratio (acrylic acid/methacrylic acid) in the range of 1:30 to 30:1 and the copolymer has a molecular weight in the range of 1K to 1000K.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: June 10, 2008
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Francis J. Kelley, John Quanci, Joseph K. So, Hongyu Wang
  • Publication number: 20080066720
    Abstract: A fuel injector for a gas turbine engine is disclosed. The fuel injector includes an injector housing having a longitudinal axis. The injector housing includes one or more fuel inlets, one or more fuel galleries annularly disposed about the longitudinal axis, and an air inlet. The fuel injector also includes a premix barrel having a proximal end and a distal end circumferentially disposed about the longitudinal axis. The premix barrel is fluidly coupled to the fuel galleries and the air inlet at the proximal end, and configured to mechanically couple to a combustor of the gas turbine engine at the distal end. The fuel injector also includes a pilot assembly disposed radially inwards of the premix barrel. The pilot assembly may include a first end and a second end. The second end is removably coupled to the injector housing, and the first end is proximate the distal end of the premix barrel. The pilot assembly is fluidly coupled to the fuel galleries, the air inlet, and the combustor.
    Type: Application
    Filed: September 13, 2007
    Publication date: March 20, 2008
    Inventors: James Scott Piper, Hongyu Wang
  • Publication number: 20080020123
    Abstract: Compositions and methods are provided for modulating the level of phytate in plants. More specifically, the invention relates to methods of modulating the level of phytate utilizing nucleic acids comprising myo-inositol kinase (MIK) nucleotide sequences to modulate the expression of MIK(s) in a plant of interest. The compositions and methods of the invention find use in agriculture for improving the nutritional quality of food and feed by reducing the levels of phytate and/or increasing the levels of non-phytate phosphorus in food and feed. The invention also finds use in reducing the environmental impact of animal waste.
    Type: Application
    Filed: August 15, 2007
    Publication date: January 24, 2008
    Applicant: Pioneer Hi-Bred International, Inc.
    Inventors: Jinrui Shi, David Ertl, Lisa Hagen, Hongyu Wang
  • Patent number: 7303993
    Abstract: The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: December 4, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Francis J. Kelley, John Quanci, Joseph K. So, Hongyu Wang
  • Patent number: 7270762
    Abstract: The polishing composition of this invention is useful for chemical-mechanical polishing of substrates containing noble metals such as platinum and comprises up to about 50% by weight of a adjuvant wherein said adjuvant is s elected from a group consisting of a metal-anion compound, a metal-cation compound or mixtures thereof; abrasive particles at about 0.5% to about 55% by weight of the polishing composition; and water-soluble organic additives up to about 10% by weight of the polishing composition. The abrasive particles are selected from the group consisting of alumina, ceria, silica, diamond, germania, zirconia, silicon carbide, boron nitride, boron carbide or mixtures thereof. The organic additives generally improve dispersion of the abrasive particles and also enhance metal removal rates and selectivity for metal removal by stabilizing the pH of the polishing composition and suppressing the dielectric removal rate.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: September 18, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Hongyu Wang, Terence M. Thomas, Qianqiu Ye, Heinz F. Reinhardt, Vikas Sachan
  • Publication number: 20070074517
    Abstract: A fuel nozzle for a turbine engine is disclosed. The fuel nozzle has a common axis, a body portion disposed about the common axis, a barrel portion located radially outward from the body portion. The fuel nozzle also has at least one swirler vane disposed between the body portion and the barrel portion and a liquid fuel jet disposed within the at least one swirler vane. The at least one swirler vane is configured to radially redirect an axial flow of air. The liquid fuel jet is configured to inject liquid fuel in a radial direction relative to the common axis.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Inventors: Thomas Chipman Rogers, Chris Twardochleb, Hongyu Wang
  • Patent number: 7182798
    Abstract: The polishing composition is suitable for chemical mechanical polishing magnetic, optical, semiconductor or silicon substrates. The polishing composition includes abrasive particles in a liquid media. The abrasive particles have a particle core, the particle core having a hardness and a polymeric shell physisorbed to and encapsulating the particle core. The polymeric shell has a solid structure and a hardness lower than the hardness of the particle core. The abrasive particles have an average particle size of less than or equal to about 2 micrometers dispersed in the liquid media.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: February 27, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Richard E. Partch, Nathaniel A. Barney, Hongyu Wang, John Quanci
  • Publication number: 20060272046
    Abstract: This invention relates to newly identified polynucleotides and polypeptides in the phytic acid biosynthetic pathway, variants and derivatives of same; methods for making the polynucleotides, polypeptides, variants, derivatives and antagonists. In particular the invention relates to polynucleotides and polypeptides of the inositol polyphosphate kinase gene family. In particular this invention relates to using the newly identified polynucleotides and polypeptides to modulate phytic acid biosynthesis in such a way as to decrease phytate and/or increase non-phytate phosphorous in plants.
    Type: Application
    Filed: May 24, 2006
    Publication date: November 30, 2006
    Inventors: Jinrui Shi, Hongyu Wang
  • Patent number: 7086935
    Abstract: An aqueous composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 weight percent phosphorus compound, 0.005 to 10 weight percent of a water miscible organic solvent, and water.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: August 8, 2006
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Hongyu Wang
  • Publication number: 20060143728
    Abstract: Compositions and methods are provided for modulating the level of phytate in plants. More specifically, the invention relates to methods of modulating the level of phytate utilizing nucleic acids comprising multidrug resistance-associated protein (MRP) nucleotide sequences to modulate the expression of MRP(s) in a plant of interest. The compositions and methods of the invention find use in agriculture for improving the nutritional quality of food and feed by reducing the levels of phytate and/or increasing the levels of non-phytate phosphorus in food and feed. The invention also finds use in reducing the environmental impact of animal waste.
    Type: Application
    Filed: May 19, 2005
    Publication date: June 29, 2006
    Applicants: Pioneer Hi-Bred International, Inc., E.I. duPont de Nemours and Company
    Inventors: Jinrui Shi, David Ertl, Hongyu Wang, Bailin Li, Marianna Faller, Kathleen Schellin
  • Patent number: 7067720
    Abstract: This invention relates to newly identified polynucleotides and polypeptides in the phytic acid biosynthetic pathway, variants and derivatives of same; methods for making the polynucleotides, polypeptides, variants, derivatives and antagonists. In particular the invention relates to polynucleotides and polypeptides of the inositol polyphosphate kinase gene family. In particular this invention relates to using the newly identified polynucleotides and polypeptides to modulate the phytic acid biosynthesis in such a way as to decrease phytate and/or increase non-phytate phosphorous, especially in corn or soy animal feedstuffs.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: June 27, 2006
    Assignees: Pioneer Hi-Bred International, Inc.
    Inventors: Jinrui Shi, Hongyu Wang, Larry R. Beach, Jan Antoni Rafalski, Rebecca E. Cahoon
  • Publication number: 20060111024
    Abstract: An aqueous composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 weight percent phosphorus compound, 0.005 to 10 weight percent of a water miscible organic solvent, and water.
    Type: Application
    Filed: November 24, 2004
    Publication date: May 25, 2006
    Inventor: Hongyu Wang
  • Publication number: 20060110924
    Abstract: An aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an amphiphilic polymer, the amphiphilic polymer having an ionic hydrophilic portion with a carbon number of 2 to 250 and water.
    Type: Application
    Filed: November 24, 2004
    Publication date: May 25, 2006
    Inventors: Tirthankar Ghosh, Robert Solomon, Hongyu Wang
  • Patent number: 7005200
    Abstract: A method for manufacturing an article for use in a high-temperature environment, and an article for use in such an environment, are presented. The method comprises providing a substrate; selecting a desired vertical crack density for a protective coating to be deposited on the substrate; providing a powder, wherein the powder has a size range selected to provide a coating having the desired vertical crack density; and applying a thermal-sprayed coating to the substrate, the coating having the desired vertical crack density, wherein the powder is used as a raw material for the coating.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: February 28, 2006
    Assignee: General Electric Company
    Inventors: Hongyu Wang, David Joseph Mitchell, Yuk-Chiu Lau, Arnold Thomas Henry
  • Publication number: 20060032146
    Abstract: The polishing composition is suitable for chemical mechanical polishing magnetic, optical, semiconductor or silicon substrates. The polishing composition includes abrasive particles in a liquid media. The abrasive particles have a particle core, the particle core having a hardness and a polymeric shell physisorbed to and encapsulating the particle core. The polymeric shell has a solid structure and a hardness lower than the hardness of the particle core. The abrasive particles have an average particle size of less than or equal to about 2 micrometers dispersed in the liquid media.
    Type: Application
    Filed: July 29, 2004
    Publication date: February 16, 2006
    Inventors: Richard Partch, Nathaniel Barney, Hongyu Wang, John Quanci