Abstract: A method of manufacturing polymer-coated particles is useful for chemical mechanical polishing magnetic, optical, semiconductor or silicon substrates. First it provides a dispersion of particle cores in a non-aqueous solvent. Then introducing a polymeric precursor into the dispersion to react the polymeric precursor forms a polymer. The polymer coats at least a portion of the surface of the particle cores with the polymer and forms the polymer-coated particles having a solid outer polymeric shell. Substituting the non-aqueous solvent with water forms an aqueous mixture containing the polymer-coated particles. And it forms an aqueous chemical mechanical polishing formulation with the polymer-coated particles without drying the polymer-coated particles.

Abstract: The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by weight copolymer of acrylic acid and methacrylic acid, and balance water, wherein the copolymer of acrylic acid and methacrylic acid has a monomer ratio (acrylic acid/methacrylic acid) in the range of 1:30 to 30:1 and the copolymer has a molecular weight in the range of 1K to 1000K.

Abstract: The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.

Abstract: A method for manufacturing an article for use in a high-temperature environment, and an article for use in such an environment, are presented. The method comprises providing a substrate; selecting a desired vertical crack density for a protective coating to be deposited on the substrate; providing a powder, wherein the powder has a size range selected to provide a coating having the desired vertical crack density; and applying a thermal-sprayed coating to the substrate, the coating having the desired vertical crack density, wherein the powder is used as a raw material for the coating.

Abstract: Compositions and methods are provided for modulating the level of phytate in plants. More specifically, the invention relates to methods of modulating the level of phytate utilizing nucleic acids comprising myo-inositol kinase (MIK) nucleotide sequences to modulate the expression of MIK(s) in a plant of interest. The compositions and methods of the invention find use in agriculture for improving the nutritional quality of food and feed by reducing the levels of phytate and/or increasing the levels of non-phytate phosphorus in food and feed. The invention also finds use in reducing the environmental impact of animal waste.

Abstract: The present invention provides an aqueous composition useful for polishing copper interconnects on a semiconductor wafer comprising by weight percent up to 25 oxidizer, 0.05 to 1 inhibitor for a nonferrous metal, 0.01 to 5 complexing agent for the nonferrous metal, 0.01 to 5 modified cellulose, and balance water, wherein the composition is free of polyacrylic acid, the amount of modified cellulose providing a copper removal function and a wafer clear of copper.

Abstract: This invention relates to newly identified polynucleotides and polypeptides in the phytic acid biosynthetic pathway, fragments, variants and derivatives of same; methods for making the polynucleotides, polypeptides, fragments, variants, derivatives and antagonists. In particular the invention relates to polynucleotides and polypeptides of the inositol 1,3,4-trisphosphate 5/6-kinase gene family. In particular this invention relates to using the newly identified polynucleotides and polypeptides to modulate the phytic acid biosynthesis in such a way as to decrease phytate and/or increase non-phytate phosphorous, especially in corn or soy animal feedstuffs.

Abstract: The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer at a down force pressure of at least less than 20.68 kPa, comprising by weight percent 1 to 15 oxidizer, 0.1 to 1 inhibitor for a nonferrous metal, 0.05 to 3 complexing agent for the nonferrous metal, 0.01 to 5 carboxylic acid polymer, 0.01 to 5 modified cellulose, 0.05 to 10 phosphorus-containing compound and 0 to 10 abrasive, wherein the phosphorus-containing compound increases removal of the copper.

Abstract: An aqueous polishing slurry is suitable for chemical mechanical polishing semiconductor substrates. The slurry comprises, by weight percent, 0.1 to 40 weight percent metal oxide particles, the metal oxide particles having a surface and a positive surface charge; at least 0.001 polynaphthalene surfactant for adsorption with at least a portion of the surface of the metal oxide particles in situ and for reducing scratching of the semiconductor substrates; and a balance of water with the slurry having a pH of less than 10.

Abstract: A method for manufacturing an article for use in a high-temperature environment, and an article for use in such an environment, are presented. The method comprises providing a substrate; selecting a desired vertical crack density for a protective coating to be deposited on the substrate; providing a powder, wherein the powder has a size range selected to provide a coating having the desired vertical crack density; and applying a thermal-sprayed coating to the substrate, the coating having the desired vertical crack density, wherein the powder is used as a raw material for the coating.

Abstract: A method and apparatus for filling preforms with resin or slurry includes a tank for holding the slurry and an autoclave for holding the preforms. The tank and autoclave have a common vacuum system connected thereto, and the tank is disposed above the autoclave. This arrangement provides a compact casting system which utilizes a vacuum and gravity to transfer slurry from the tank to the preforms within the autoclave.

Abstract: A process of depositing a coating system suitable for use as an environmental barrier coating on various substrate materials, particularly those containing silicon and intended for high temperature applications such as the hostile thermal environment of a gas turbine engine. The process comprises depositing a first coating layer containing mullite, and preferably a second coating layer of an alkaline earth aluminosilicate, such as barium-strontium-aluminosilicate (BSAS), by thermal spraying while maintaining the substrate at a temperature of 800° C. or less, preferably 500° C. or less, by which a substantially crack-free coating system is produced with desirable mechanical integrity.

Abstract: A process of depositing a coating system suitable for use as an environmental barrier coating on various substrate materials, particularly those containing silicon and intended for high temperature applications such as the hostile thermal environment of a gas turbine engine. The process comprises depositing a first coating layer containing mullite, and preferably a second coating layer of an alkaline earth aluminosilicate, such as barium-strontium-aluminosilicate (BSAS), by thermal spraying while maintaining the substrate at a temperature of 800° C. or less, preferably 500° C. or less, by which a substantially crack-free coating system is produced with desirable mechanical integrity.

Abstract: A process for depositing a ceramic coating system for Si-containing materials, particularly those for articles exposed to high temperatures. The process is particularly applicable to depositing a compositionally-graded coating system comprising multiple ceramic layers with differing compositions, including a dense, strain-tolerant, vertically-cracked YSZ-containing ceramic layer deposited on a ceramic layer having a composition that is a mixture of YSZ and either mullite or BSAS. The process entails depositing the YSZ-containing ceramic layer using a plasma spraying technique while maintaining the substrate at a temperature so as not to form horizontal cracks in the coating system, but still maintain the dense vertically-cracked structure of the YSZ-containing ceramic layer for strain tolerance.

Abstract: A method for manufacturing an article for use in a high-temperature environment, and an article for use in such an environment, are presented. The method comprises providing a substrate; selecting a desired vertical crack density for a protective coating to be deposited on the substrate; providing a powder, wherein the powder has a size range selected to provide a coating having the desired vertical crack density; and applying a thermal-sprayed coating to the substrate, the coating having the desired vertical crack density, wherein the powder is used as a raw material for the coating.

Abstract: A process for depositing a ceramic coating system for Si-containing materials, particularly those for articles exposed to high temperatures. The process is particularly applicable to depositing a compositionally-graded coating system comprising multiple ceramic layers with differing compositions, including a dense, strain-tolerant, vertically-cracked YSZ-containing ceramic layer deposited on a ceramic layer having a composition that is a mixture of YSZ and either mullite or BSAS. The process entails depositing the YSZ-containing ceramic layer using a plasma spraying technique while maintaining the substrate at a temperature so as not to form horizontal cracks in the coating system, but still maintain the dense vertically-cracked structure of the YSZ-containing ceramic layer for strain tolerance.

Abstract: A method of forming an article. The method comprises forming a silicon-based substrate that is oxidizable by reaction with an oxidant to form at least one gaseous product and applying an intermediate layer/coating onto the substrate, wherein the intermediate layer/coating is oxidizable to a nongaseous product by reaction with the oxidant in preference to reaction of the silicon-containing substrate with the oxidant.

Abstract: The polishing composition of this invention is useful for chemical-mechanical polishing of substrates containing noble metals such as platinum and comprises up to about 50% by weight of a adjuvant wherein said adjuvant is s elected from a group consisting of a metal-anion compound, a metal-cation compound or mixtures thereof; abrasive particles at about 0.5% to about 55% by weight of the polishing composition; and water-soluble organic additives up to about 10% by weight of the polishing composition. The abrasive particles are selected from the group consisting of alumina, ceria, silica, diamond, germania, zirconia, silicon carbide, boron nitride, boron carbide or mixtures thereof. The organic additives generally improve dispersion of the abrasive particles and also enhance metal removal rates and selectivity for metal removal by stabilizing the pH of the polishing composition and suppressing the dielectric removal rate.

Abstract: An article includes a silicon-containing substrate and a modified mullite coating. The modified mullite coating comprises mullite and a modifier component that reduces cracks in the modified mullite coating. The article can further comprise a thermal barrier coating applied to the modified mullite coating. The modified mullite coating functions as a bond coating between the external environmental/thermal barrier coating and the silicon-containing substrate. In a method of forming an article, a silicon-containing substrate is formed and a modified mullite coating is applied. The modified mullite coating comprises mullite and a modifier component that reduces cracks in the modified mullite coating.

Abstract: Improved adhesion of thermal barrier coating systems to nonmetallic substrates using a layer of silica on an underlying nonmetallic substrate that includes a silicon containing material is described. The improved adhesion occurs because the improved thermal barrier system improves the temperature capability of the system by providing a layer adjacent the substrate that has improved thermal performance and that is not subject to deterioration. The application of a silica layer of predetermined thickness adjacent the substrate also forms a diffusion barrier for oxygen while eliminating the need to transform an external layer of the substrate by a pre-oxidation step. This diffusion barrier prevents any oxidizable component of the substrate from decomposing.