Patents by Inventor Hongyu Yu

Hongyu Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060081064
    Abstract: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
    Type: Application
    Filed: August 4, 2005
    Publication date: April 20, 2006
    Inventors: Tzung Hsiai, Gopikrishnan Soundararajan, E. Kim, Hongyu Yu, Mahsa Rouhanizadeh, Tiantian Lin
  • Publication number: 20050285208
    Abstract: A gate electrode for semiconductor devices, the gate electrode comprising a mixture of a metal having a work function of about 4 eV or less and a metal nitride.
    Type: Application
    Filed: June 10, 2005
    Publication date: December 29, 2005
    Inventors: Chi Ren, Hongyu Yu, Siu Hung Daniel Chan, Ming-Fu Li, Dim-Lee Kwong