Patents by Inventor Hoon Oh

Hoon Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250132365
    Abstract: The present disclosure relates to a reinforced composite membrane for a fuel cell, comprising a porous support and a hydrogen ion-conductive polymer; a manufacturing method therefor; and a membrane-electrode assembly comprising same, the reinforced composite membrane having the hydrogen ion-conductive polymer impregnated into the porous support, or comprising, on at least one surface of the porous support, an electrolyte layer comprising the hydrogen ion-conductive polymer, wherein the porous support further comprises a compound capable of trapping metal ions.
    Type: Application
    Filed: November 24, 2022
    Publication date: April 24, 2025
    Inventors: Jung Hwa PARK, Dong Hoon LEE, Kum Suck SONG, Sung Hyun YUN, Seung Jib YUM, Chang Hoon OH, Hye Song LEE, Eun Su LEE
  • Patent number: 12282674
    Abstract: Disclosed herein are an evidence collection guidance method and apparatus for file selection. The evidence collection guidance method includes generating pieces of preliminary analysis information that are pieces of collection target information, setting levels of the pieces of preliminary analysis information based on predefined rules, and generating and outputting notification information including summary description information and follow-up measure items related to the pieces of preliminary analysis information corresponding to the levels.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: April 22, 2025
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jung-Hoon Oh, Hyun-Uk Hwang, Seung-Yong Lee, Jun-Su Kim, Joong-Soo Han, Hye-Jin Jeong
  • Patent number: 12278121
    Abstract: The inventive concept provides a support unit for supporting a substrate. The support unit includes a support plate that has an interior space and on which the substrate is placed, a heating member that is provided in the interior space and that heats the substrate placed on the support plate, a heat insulating plate provided in the interior space and disposed under the heating member, a reflective plate provided in the interior space and disposed under the heat insulating plate, and a heat dissipation plate provided in the interior space and disposed under the a reflective plate.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: April 15, 2025
    Assignee: SEMES CO., LTD.
    Inventors: Kangseop Yun, Seung Hoon Oh, Ye Jin Choi, Youngil Lee, Byungsun Bang, Jungbong Choi, Gui Su Park
  • Patent number: 12272543
    Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: April 8, 2025
    Assignee: SEMES CO., LTD.
    Inventors: Yong Hyun Choi, Young Hun Lee, Seung Hoon Oh, Mi So Park, Tae Jong Choi, Yong Sun Ko, Jin Woo Jung
  • Patent number: 12272655
    Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: April 8, 2025
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee, Min Jae Kong
  • Publication number: 20250100658
    Abstract: A life-saving robot includes a housing having a round ring shape, a buoyancy generator disposed at an upper portion of the housing, a thrust generator disposed at a lower portion of the housing and configured to provide propulsive force, a driver configured to provide power to the thrust generator, and a guard portion that is disposed at the lower portion of the housing and covers the thrust generator. An exterior of the life-saving robot is substantially spherical and defined by a combination of the buoyancy generator, the housing, and the guard portion.
    Type: Application
    Filed: September 18, 2024
    Publication date: March 27, 2025
    Inventors: Sung Jun KIM, Dong Hoon OH, Jin Wook KIM
  • Publication number: 20250100342
    Abstract: An embodiment discloses a vehicle heating device connected to an air conditioning unit to radiate heat, including a housing connected to the air conditioning unit, a heating module arranged inside the housing, and a cover coupled to the housing, wherein the cover comprises a cover body and guides configured to direct air passing through the cover body, the guides having a predetermined separation distance from the heating module. Accordingly, the vehicle heating device can enhance the heating performance, efficiency, and quality of the vehicle interior through convection or radiant heating using the heating unit.
    Type: Application
    Filed: March 21, 2023
    Publication date: March 27, 2025
    Inventor: Dong Hoon OH
  • Publication number: 20250096221
    Abstract: An embodiment all-solid-state battery includes an anode current collector, a double layer disposed on the anode current collector, a solid electrolyte layer disposed on the double layer, the solid electrolyte layer including a solid electrolyte, a cathode layer disposed on the solid electrolyte layer, the cathode layer including a cathode active material, and a cathode current collector disposed on the cathode layer, wherein the double layer includes a protective layer disposed on the anode current collector and a metal alloy layer disposed on the protective layer, wherein the protective layer includes a reaction product of a conductive material containing a first functional group and a binder containing a second functional group, and wherein the metal alloy layer includes a metal capable of forming an alloy with lithium.
    Type: Application
    Filed: March 8, 2024
    Publication date: March 20, 2025
    Inventors: Ji Young Kim, Sam Ick Son, Ki Yoon Bae, Jang Wook Choi, Ji Hoon Oh
  • Publication number: 20250096845
    Abstract: A system for performing magnetic field communication is disclosed. According to one embodiment of the present disclosure, a system for performing magnetic field communication may include a first current mode power supply having a voltage and one or more inductors connected thereto; a power amplifier connected to the first current mode power supply; a first matching impedance unit including a first capacitor connected to the power amplifier; and a first magnetic field antenna including a coil and a resistor connected in parallel with the first matching impedance unit.
    Type: Application
    Filed: September 18, 2024
    Publication date: March 20, 2025
    Inventors: Kye Seok YOON, In Kui CHO, Jung Hoon OH, Jang Yeol KIM, Hyun Joon LEE
  • Patent number: 12252169
    Abstract: In accordance with an embodiment, a mobile infant care device includes a carrier having an inner space configured to hold an infant positioned therein, and driving wheels provided at a lower part of the carrier; a monitoring system affixed to the carrier and configured to monitor a state of the infant positioned in the inner space of the carrier; a driving system coupled to the driving wheels, the driving system configured to move a position of the carrier by driving the driving wheels; a communication system configured to wirelessly transmit a monitoring result of the monitoring system to a user terminal device or to wirelessly receive an operation input from the user terminal device; and a controller configured to cause the driving system to move the carrier based on the monitoring result of the monitoring system or the operation input received through the communication system.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: March 18, 2025
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Yong Pyo Hong, Hyuk Lee, Ji Hoon Oh
  • Publication number: 20250087617
    Abstract: The technical idea of the present invention provides a semiconductor package having improved performance and reliability while simplifying a process. The semiconductor package according the technical idea of the present invention includes a first package including a first semiconductor chip, a first encapsulation layer covering a side surface of the first semiconductor chip, and a first redistribution pattern connected to a pad of the first semiconductor chip, and a second package provided on the first package and including a second semiconductor chip, a second encapsulation layer covering the second semiconductor chip, and a second redistribution pattern connected to a pad of the second semiconductor chip, wherein the first redistribution pattern is connected to the second redistribution pattern through the first encapsulation layer.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 13, 2025
    Inventors: Dong Hoon OH, Yong Tae KWON, Seong Hyuk LEE, Seong Hwan HAN, Hyeon Jun LEE
  • Publication number: 20250074151
    Abstract: A heating device provides heat for heating in various modes, such as an air flow direction control mode, a radiant heat specialized mode, and a convective heat specialized mode, through rotation of thermally conductive plates depending on user's requirements, thereby increasing user satisfaction. The thermally conductive plates increase heating efficiency by ensuring thermal efficiency according to a mode corresponding to the purpose of use.
    Type: Application
    Filed: March 12, 2024
    Publication date: March 6, 2025
    Inventors: Gyeong Nam Cho, Su Yeon Kang, Myung Hoe Kim, Dong Won Yeon, Dong Hoon Oh, Sae Dong Eom, Yun Hwan Yang
  • Publication number: 20250074161
    Abstract: A vehicular air conditioning system having an air inlet and an air outlet includes a first heating heat exchanger configured to heat air introduced through the air inlet, a second heating heat exchanger configured to heat air passing through the first heating heat exchanger or bypassing the first heating heat exchanger, and a control part configured to control the first heating heat exchanger and the second heating heat exchanger according to a passenger room heating load so that when the heating load decreases to below a preset value in a heating mode in which the first heating heat exchanger and the second heating heat exchanger are operated simultaneously, the first heating heat exchanger is first turned off and only the second heating heat exchanger is operated.
    Type: Application
    Filed: April 11, 2023
    Publication date: March 6, 2025
    Inventors: Dong Hoon OH, Young Min KIM, Dae Bok KEON
  • Patent number: 12234555
    Abstract: An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: February 25, 2025
    Assignee: SEMES CO., LTD.
    Inventors: Jin Mo Jae, Seung Hoon Oh, Young Seop Choi, Mi So Park, Jong Hyeon Woo
  • Publication number: 20250060212
    Abstract: An epoxy molding compound thickness measurement method and the measurement device are disclosed, and the epoxy molding compound thickness measurement method and the measurement device capable of measuring in a non-contact manner the thickness of an epoxy molding compound applied on a semiconductor chip during semiconductor packaging only with reflected light are disclosed.
    Type: Application
    Filed: August 12, 2024
    Publication date: February 20, 2025
    Applicant: ACTRO CO., LTD
    Inventor: Seong Hoon OH
  • Publication number: 20250055006
    Abstract: A reinforced composite membrane with improved ion conductivity and wettability is provided. Provided in one embodiment of the present disclosure is a reinforced composite membrane comprising a porous support and an ionomer layer, which comprises an ion conductor filling the pores inside the porous support, wherein the porous support comprises a first surface and a second surface opposite to the first surface, and the first surface is reformed to contain a first hydrophilic functional group.
    Type: Application
    Filed: November 23, 2022
    Publication date: February 13, 2025
    Inventors: Jung Hwa PARK, Dong Hoon LEE, Kum Suck SONG, Sung Hyun YUN, Seung Jib YUM, Chang Hoon OH, Hye Song LEE, Eun Su LEE
  • Patent number: 12213241
    Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: January 28, 2025
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Qiuming Li, Colden Niles Eldridge, Ming Lei, Yibo Liu, Md Rashidul Islam, Sung Hoon Oh
  • Patent number: 12206177
    Abstract: An operation method of a first communication node may comprise: receiving one or more polarized radio signals transmitted from a second communication node included in the communication system through one or more receive polarized antennas included in the first communication node; performing a receive polarized antenna alignment state adjustment operation so that a detection result for a magnitude of an electric field excited by the one or more polarized radio signals is maximized; and receiving a first polarized signal transmitted from the second communication node through at least part of the one or more receive polarized antennas based on a result of the receive polarized antenna alignment state adjustment operation.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: January 21, 2025
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jung Hoon Oh, Jang Yeol Kim, Jae Ho Lee, Hyun Joon Lee, In Kui Cho
  • Patent number: 12205904
    Abstract: A semiconductor package includes a semiconductor chip including a chip pad, a first insulating layer provided on the semiconductor chip and including a first via hole, a first wiring pattern provided on the first insulating layer and connected to the chip pad through the first via hole of the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring pattern and including a second via hole, and a second wiring pattern provided on the second insulating layer and connected to the first wiring pattern through the second via hole of the second insulating layer, wherein the first insulating layer includes a first upper surface in contact with the second insulating layer and a first lower surface opposite to the first upper surface, and the first upper surface of the first insulating layer has surface roughness greater that the first lower surface of the first insulating layer.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: January 21, 2025
    Assignee: Nepes Co., Ltd.
    Inventors: Yong Tae Kwon, Jun Kyu Lee, Dong Hoon Oh, Su Yun Kim, Kyeong Rok Shin
  • Publication number: 20250022608
    Abstract: The present invention relates to a method and device for predicting aneurysm rupture using artificial intelligence based on morphological and hemodynamic factors of aneurysms. The method for predicting aneurysm rupture according to one embodiment of the present disclosure may comprises acquiring an image of a blood vessel; deriving moment of inertia based on the image of the blood vessel; acquiring a hemodynamic factor; outputting the rupture risk when the moment of inertia and the hemodynamic factor are inputted to a pre-trained artificial neural network; and predicting the possibility of rupture as possible when the rupture risk is greater than a predetermined rupture threshold value, and predicting the possibility of rupture as absent when the rupture risk is not greater than the predetermined rupture threshold value.
    Type: Application
    Filed: September 30, 2024
    Publication date: January 16, 2025
    Inventors: Je Hoon OH, Hyeondong YANG, Yong Bae KIM, Jung-Jae KIM, Kwang-Chun CHO