Patents by Inventor Hoon Oh

Hoon Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12198997
    Abstract: A semiconductor package includes an upper structure including a semiconductor chip and a first molding layer for molding the semiconductor chip, a lower structure provided on the upper structure, the lower structure including a conductive post and a second molding layer for molding the conductive post, and a redistribution structure provided between the upper structure and the lower structure, the redistribution structure including a wiring pattern for electrically connecting a pad of the semiconductor chip to the conductive post, in which a thermal expansion coefficient of the second molding layer is different from a thermal expansion coefficient of the first molding layer.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: January 14, 2025
    Assignee: NEPES CO., LTD.
    Inventors: Su Yun Kim, Dong Hoon Oh, Yong Tae Kwon, Jun Kyu Lee, Kyeong Rok Shin, Yong Woon Yeo
  • Patent number: 12194789
    Abstract: The present disclosure relates to a vehicle system and a method for determining a location of a tire pressure sensor. An exemplary embodiment of the present disclosure provides a vehicle system including: a plurality of tire pressure sensors configured to sense air pressure of a tire of a vehicle including a double wheel; a plurality of wheel speed sensors configured to sense a speed of each wheel of the vehicle; and a tire pressure sensor location determining apparatus configured to determine locations of the tire pressure sensors using wheel pulse counter values inputted from the wheel speed sensors whenever the tire pressure sensors transmit tire pressure detection signals.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: January 14, 2025
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventor: Jung Hoon Oh
  • Publication number: 20250010504
    Abstract: Proposed is razor blade coating by a physical vapor deposition method, by forming a hard coating layer as a thin coating layer in which chromium boride, which is a nanocrystalline structure having high hardness, is dispersed in an amorphous mixture of chromium and boron, thereby improving the strength and hardness of the thin coating layer and securing the bonding force by chromium in the amorphous mixture between the hard coating layer and a blade substrate on which an edge of the razor blade is formed.
    Type: Application
    Filed: September 16, 2024
    Publication date: January 9, 2025
    Inventors: Min Joo PARK, Sung Hoon OH, Seong Won JEONG
  • Publication number: 20250015342
    Abstract: An all-solid-state battery and a method of manufacturing an all solid-state battery are disclosed. The all solid-state battery includes a metal oxide and a metal capable of alloying with lithium, thus uniformly depositing lithium during charging and enabling operation at room temperature (e.g., 20-25° C.).
    Type: Application
    Filed: December 6, 2023
    Publication date: January 9, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Seoul National University R&DB Foundation
    Inventors: Ji Young Kim, Kyu Joon Lee, Ga Hyeon Im, Ki Yoon Bae, Yun Sung Kim, Sam Ick Son, Jang Wook Choi, Ji Eun Lee, Ye Eun Sohn, Ji Hoon Oh, Tae Guen Lee, Noh Joon Lee
  • Publication number: 20250015328
    Abstract: The present disclosure relates to a polymer electrolyte membrane including an ion conductor wherein the polymer electrolyte membrane contains an antioxidant-releasing material.
    Type: Application
    Filed: November 16, 2022
    Publication date: January 9, 2025
    Inventors: Jung Hwa PARK, Donghoon LEE, Kum Suck SONG, Sung Hyun YUN, Seung Jib YUM, Chang Hoon OH, Hye Song LEE, Eun Su LEE
  • Patent number: 12183704
    Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: December 31, 2024
    Assignees: NEPES CO., LTD., NEPES LAWEH CORPORATION
    Inventors: Byung Cheol Kim, Yong Tae Kwon, Hyo Gi Jo, Dong Hoon Oh, Jae Cheon Lee, Hyung Jin Shin, Mary Maye Melgo Galimba
  • Publication number: 20240378609
    Abstract: Disclosed is a method for use in a transmission of a virtual asset from a sender having a sending account at a sending virtual asset service provider (sending VASP) to a recipient having a receiving account at a receiving virtual asset service provider (receiving VASP). The method involves subsequent to verification that the receiving account at the receiving VASP is valid, determining, by a verification node, if the transmission has been recorded on a blockchain network; and subsequent to determination that the transmission has been recorded on the blockchain network, sending, by the verification node to the receiving VASP, a request to update the receiving account at the receiving VASP about the transmission of the virtual asset from the sender to the recipient. In the method, the verification node does not belong to either the sending VASP or the receiving VASP.
    Type: Application
    Filed: July 22, 2024
    Publication date: November 14, 2024
    Inventors: Jae Hoon OH, Hyeok CHOI
  • Publication number: 20240375304
    Abstract: The present disclosure provides a razor blade coating by a physical vapor deposition method through performing a deposition with a single composite target composed of dissimilar materials with their area ratio defined to be varied in the single composite target in the direction of transferring the razor blade subject to the deposition, thereby forming a single layer in which the composition ratio of the dissimilar materials gradually changes in the thickness direction of the coating layer to improve the durability of the razor blade coating layer
    Type: Application
    Filed: July 24, 2024
    Publication date: November 14, 2024
    Inventors: Min Joo PARK, Sung Hoon OH, Seong Won JEONG
  • Patent number: 12131918
    Abstract: A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: October 29, 2024
    Assignee: SEMES CO., LTD.
    Inventors: Sang Min Lee, Seung Hoon Oh, Yong Joon Im, Hyo Won Yang
  • Patent number: 12121940
    Abstract: A cassette for ultra-thin glass includes a pair of plates spaced apart from and facing each other, and a plurality of supports mounted between the pair of plates and including a plurality of mounting grooves that support sides of sheets of ultra-thin glass. Each of the plurality of mounting grooves includes an inclined portion inclined toward a middle of each of the plurality of mounting grooves, and a straight portion extending from the inclined portion and having a constant width in an axial direction of the plurality of supports. A height of the straight portion in a radial direction of the plurality of supports is equal to or greater than a height of the inclined portion in the radial direction.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: October 22, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jung Hoon Oh, Ki Taek Kim, Chang Min Lee
  • Patent number: 12125775
    Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: October 22, 2024
    Assignees: NEPES CO., LTD., NEPES LAWEH CORPORATION
    Inventors: Byung Cheol Kim, Yong Tae Kwon, Hyo Gi Jo, Dong Hoon Oh, Jae Cheon Lee, Hyung Jin Shin, Mary Maye Melgo Galimba
  • Patent number: 12115692
    Abstract: The present disclosure provides an improvement to razor blade coating by a physical vapor deposition method, by forming a hard coating layer as a thin coating layer in which chromium boride, which is a nanocrystalline structure having high hardness, is dispersed in an amorphous mixture of chromium and boron, thereby improving the strength and hardness of the thin coating layer and securing the bonding force by chromium in the amorphous mixture between the hard coating layer and a blade substrate on which an edge of the razor blade is formed.
    Type: Grant
    Filed: November 17, 2023
    Date of Patent: October 15, 2024
    Assignee: DORCO CO., LTD.
    Inventors: Min Joo Park, Sung Hoon Oh, Seong Won Jeong
  • Patent number: 12116482
    Abstract: An embodiment of the present invention provides a racing tire rubber composition comprising: 30-60 wt % of rubber, 10-30 wt % of carbon black, 1-20 wt % of carbon nanotubes, and 10-50 wt % of oil; and a method for manufacturing same.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: October 15, 2024
    Assignee: KOREA KUMHO PETROCHEMICAL CO., LTD.
    Inventors: Dong Hoon Oh, Namsun Choi, Young Woo Lim
  • Patent number: 12094733
    Abstract: Disclosed is a substrate treatment apparatus including a rotation unit that supports and rotates a substrate, a chemical discharge unit that discharges a chemical solution to the rotation unit, a chemical recovery unit disposed close to the rotation unit and configured to recover the chemical solution scattering from the rotation unit, and a laser irradiation unit that applies a laser beam to the substrate and heats the substrate.
    Type: Grant
    Filed: October 17, 2020
    Date of Patent: September 17, 2024
    Assignee: SEMES CO., LTD.
    Inventors: Young Dae Chung, Won Geun Kim, Jee Young Lee, Ji Hoon Jeong, Tae Shin Kim, Se Hoon Oh, Pil Kyun Heo, Hyun Goo Park
  • Patent number: 12087848
    Abstract: Power semiconductor device with reduced loss and manufacturing method the same disclosed. Power semiconductor device include a first drift region of a first conductivity type, a second drift region of the first conductivity type formed by epitaxially growing on the first drift region and a plurality of buried ion regions of a second conductivity type formed to be buried in the second drift region.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: September 10, 2024
    Assignee: TRINNO TECHNOLOGY CO., LTD.
    Inventors: Kwang Hoon Oh, Soo Seong Kim, Jin Young Jung, Chongman Yun
  • Patent number: 12076873
    Abstract: The present disclosure provides a razor blade coating by a physical vapor deposition method through performing a deposition with a single composite target composed of dissimilar materials with their area ratio defined to be varied in the single composite target in the direction of transferring the razor blade subject to the deposition, thereby forming a single layer in which the composition ratio of the dissimilar materials gradually changes in the thickness direction of the coating layer to improve the durability of the razor blade coating layer.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: September 3, 2024
    Assignee: Dorco Co., Ltd.
    Inventors: Min Joo Park, Sung Hoon Oh, Seong Won Jeong
  • Patent number: 12079195
    Abstract: An apparatus for storing a key value store file according to an embodiment includes a memory configured to record one or more key values in a predefined unit space based on a data input request from an outside, a controller configured to store data received from the memory in a storage, and the storage configured to include a plurality of zones. The controller is configured to perform a flush operation of storing one or more key values received from the memory as a file in a predefined format in the storage and a compaction operation of merging a plurality of files existing in one level in the storage and recording the merged files as one file in another level.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: September 3, 2024
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, DANKOOK UNIVERSITY
    Inventors: Jong Moo Choi, Myung Hoon Oh
  • Patent number: 12073401
    Abstract: Disclosed is a method for use in a virtual asset transmission from a sender having a sending account at a sending virtual asset service provider (sending VASP) to a recipient having a receiving account at a receiving virtual asset service provider (receiving VASP).
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: August 27, 2024
    Assignees: Dunamu Inc., Lambda266
    Inventors: Jae Hoon Oh, Hyeok Choi
  • Publication number: 20240272243
    Abstract: An atomic magnetometer with an extended measurement bandwidth is disclosed. The atomic magnetometer includes coils configured to transmit incident pump light and a bias magnetic field and a vapor cell positioned between the coils and receiving the pump light and the bias magnetic field transmitted from the coils and irradiation light incident from a direction perpendicular to the coils, wherein the vapor cell includes both a first alkali metal atom and a second alkali metal atom, which are isotopes of one of alkali metals.
    Type: Application
    Filed: January 5, 2024
    Publication date: August 15, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hyunjoon LEE, Jang Yeol KIM, Jung Hoon OH, In Kui CHO
  • Patent number: D1045916
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: October 8, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Se Hoon Oh, Seok Young Youn, Sung Woo Kim, Jong Kyu Choi, Dong Jin Hyun, Ju Young Yoon