Abstract: Provided is an automatic folding electronic car that is driven with power supplied from a battery and folded automatically including: a body portion to which a front frame and a rear frame are connected rotatably through a connection shaft and on which a support shaft is formed on an upper part of the rear frame so as to support the front frame from a rear side; a front wheel portion that is arranged on a front of the body portion and is provided with a pair of front wheels connected through a front wheel shaft and a braking means; a rear wheel portion that is arranged on a rear of the body portion and is provided with a pair of rear wheels connected through a rear wheel shaft and a driving means; a handle portion including a handle frame connected upright to the front wheel shaft, an operation panel arranged on an upper part of the handle frame and provided with a folding switch and a handle formed on an upper part and provided with an acceleration lever and a hand brake; a seat portion a front of which is c

Abstract: Provided is an automatic folding electronic car that is driven with power supplied from a battery and folded automatically including: a body portion to which a front frame and a rear frame are connected rotatably through a connection shaft and on which a support shaft is formed on an upper part of the rear frame so as to support the front frame from a rear side; a front wheel portion that is arranged on a front of the body portion and is provided with a pair of front wheels connected through a front wheel shaft and a braking means; a rear wheel portion that is arranged on a rear of the body portion and is provided with a pair of rear wheels connected through a rear wheel shaft and a driving means; a handle portion including a handle frame connected upright to the front wheel shaft, an operation panel arranged on an upper part of the handle frame and provided with a folding switch and a handle formed on an upper part and provided with an acceleration lever and a hand brake; a seat portion a front of which is c

Abstract: Embodiments of the present invention relate to a biodegradable scaffold for replacing tissue or inducing tissue regeneration and a preparation method thereof, wherein the scaffold comprises at least one woven silk tube layer and a collagen layer inside the tube layer. The scaffold is excellent in terms of tissue regeneration and mechanical properties and causes little or no immune response after implantation. Thus, the scaffold can be effectively used as a matrix for the regeneration of ligaments and tendons and the repair of injured muscles.

Abstract: A memory device may include nonvolatile memory cells. A first memory cell of the nonvolatile memory cells may have a first resistance value in a first state and a second memory cell of the nonvolatile memory cells may have a second resistance value less than the first resistance value in a second state. A third memory cell of the nonvolatile memory cells may have a third resistance value less than the first resistance value and greater than the second resistance value in a third state, and a fourth memory cell of the nonvolatile memory cells may have a fourth resistance value less than the third resistance value and greater than the second resistance value in a fourth state.

Abstract: Disclosed are a modified conjugated diene polymer and a method for preparing the same. Provided are advantageously a modified conjugated diene polymer and a method for preparing the same which provide superior compatibility with an inorganic filler, heat generation, tensile strength and abrasion resistance, low fuel consumption and excellent resistance on wet roads.

Abstract: A semiconductor device may include: a substrate. First and second gate electrode patterns are disposed on first and second fin type active patterns. The first and second fin type active patterns include a first channel region disposed between a first impurity region and a second impurity region. The second gate electrode pattern crosses a first gate-separating region included in the second fin type active region. The first gate-separating region includes a trench and an embedded insulator filling at least a portion of the trench.

Abstract: An embedded package includes a chip having a top surface on which a connection member is disposed, a first insulation layer surrounding a portion of the chip, a second insulation layer disposed on the first insulation layer to cover the chip, circuit patterns disposed on a bottom surface of the first insulation layer, a third insulation layer disposed on the bottom surface of the first insulation layer to cover the circuit patterns, an external connection terminal penetrating the third insulation layer to contact any one of the circuit patterns, a metal layer disposed on a top surface of the second insulation layer, a first via penetrating the first insulation layer to electrically couple the connection member to any one of the circuit patterns, and a second via penetrating the first and second insulation layers to electrically couple the metal layer to any one of the circuit patterns.

Abstract: The present invention relates to a method for producing a splash shield, in which method a base-portion raw material comprising a plastic, glass fibers, a compatibilizer and rubber is subjected to melt extrusion while at the same time injection molding is performed, and then, without removing the injection-molded article from the injection mold, the injection mold is rotated in the open state, and the injection-molded article is conveyed to a foaming mold and subsequently undergoes flame treatment and a polyurethane foam molding step. A single process in the production method is used for the procedure in which the materials are separately compounded and pelletized and the procedure in which the injection-molded article is molded.

Abstract: A stacked semiconductor package and a manufacturing method thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor package in which an upper interposer and/or package are electrically and mechanically coupled to a lower package utilizing an adhesive member comprising conductive particles.

Abstract: A solar cell module, a method for manufacturing the solar cell module, a solar power system, and an interconnection ribbon are provided. The solar cell module includes a plurality of solar cells which are connected in series or in parallel through interconnection ribbons, wherein the interconnection ribbons have a zigzag shape to reduce tension generated according to bending of the solar cell module.

Abstract: A memory device may include nonvolatile memory cells. A first memory cell of the nonvolatile memory cells may have a first resistance value in a first state and a second memory cell of the nonvolatile memory cells may have a second resistance value less than the first resistance value in a second state. A third memory cell of the nonvolatile memory cells may have a third resistance value less than the first resistance value and greater than the second resistance value in a third state, and a fourth memory cell of the nonvolatile memory cells may have a fourth resistance value less than the third resistance value and greater than the second resistance value in a fourth state.

Abstract: In a display panel and a method of manufacturing the display panel, the display panel includes a display substrate including a first electrode and a second electrode insulated from the first electrode and disposed on the first electrode, an opposite substrate including a third electrode facing the second electrode, and a liquid crystal layer interposed between the display substrate and the opposite substrate. The liquid crystal layer includes liquid crystal molecules, a reactive mesogen polymer, and nano-rods.

Abstract: A method of bonding a flexible printed circuit board (FPCB). The method includes disposing a bonding material on a connection unit of a panel, disposing a connection unit of the FPCB on the bonding material; disposing a thermally conductive sheet on the connection unit of the FPCB; and heating and pressing the connection unit of the FPCB onto the connection unit of the panel. The thermally conductive sheet includes through holes that are formed in the thermally conductive sheet or grooves that are formed in a bottom surface of the thermally conductive sheet. In the operation of heating and pressing the connection unit of the FPCB, extended portions of the FPCB are accepted into the through holes or the grooves in the thermally conductive sheet.

Abstract: Disclosed are a modified conjugated diene polymer and a method for preparing the same. Provided are advantageously a modified conjugated diene polymer and a method for preparing the same which provide superior compatibility with an inorganic filler, heat generation, tensile strength and abrasion resistance, low fuel consumption and excellent resistance on wet roads.

Abstract: Provided is an iron-based amorphous alloy and a method of manufacturing the same. More particularly, provided is an high carbon iron-based amorphous alloy expressed by a general formula Fe?C?Si?BxPyCrz, wherein ?, ?, ?, x, y and z are atomic % of iron (Fe), carbon (C), silicon (Si), boron (B), phosphorus (P), and chrome (Cr) respectively, wherein ? is expressed by ?=100?(?+?+x+y+z) atomic %, ? is expressed by 13.5 atomic %???17.8 atomic %, ? is expressed by 0.30 atomic %???1.50 atomic %, x is expressed by 0.1 atomic %?x?4.0 atomic %, y is expressed by 0.8 atomic %?y?7.7 atomic %, and z is expressed by 0.1 atomic %?z?3.0 atomic %.

Abstract: A semiconductor device may include: a substrate. First and second gate electrode patterns are disposed on first and second fin type active patterns. The first and second fin type active patterns include a first channel region disposed between a first impurity region and a second impurity region. The second gate electrode pattern crosses a first gate-separating region included in the second fin type active region. The first gate-separating region includes a trench and an embedded insulator filling at least a portion of the trench.

Abstract: Disclosed are a modified conjugated diene polymer and a method for preparing the same. Provided are advantageously a modified conjugated diene polymer and a method for preparing the same which provide superior compatibility with an inorganic filler, heat generation, tensile strength and abrasion resistance, low fuel consumption and excellent resistance on wet roads.

Abstract: Laser assisted bonding for semiconductor die interconnections is disclosed and may, for example, include forming flux on a circuit pattern on a circuit board, placing a semiconductor die on the circuit board where a bump on the semiconductor die contacts the flux, and reflowing the bump by directing a laser beam toward the semiconductor die. The laser beam may volatize the flux and make an electrical connection between the bump and the circuit pattern. A jig plate may be placed on the semiconductor die when the laser beam is directed toward the semiconductor die. Warpage may be reduced during heating or cooling of the semiconductor die by applying pressure to the jig plate. Jig bars may extend outward from the jig plate and may be in contact with the circuit board during the application of pressure to the jig plate. The jig plate may comprise one or more of: silicon, silicon carbide, and glass.

Abstract: Disclosed is a method of forming a chalcopyrite light-absorbing layer for a solar cell, including: forming a thin film including a chalcopyrite compound precursor; and radiating light on the thin film, wherein the chalcopyrite compound precursor absorbs light energy and is thus crystallized. When forming the chalcopyrite light-absorbing layer, light, but not heat, is applied, thus preventing problems, including damage to a substrate due to heat and formation of MoSe2 due to heating of the Mo rear electrode. Furthermore, long-wavelength light, which deeply penetrates the thin film, is first radiated, and short-wavelength light, which shallowly penetrates the thin film, is subsequently radiated, thereby sequentially forming the chalcopyrite light-absorbing layer from the bottom of the thin film.