Abstract: A remote control apparatus is provided.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: A remote controller is provided. The remote controller includes an input interface; a communicator; a storage; and a processor configured to: transmit, to the display apparatus via the communicator, a signal indicating control instructions based on a user input received through the input interface, receive, from the display apparatus via the communicator, information related to a first control code for controlling a first source device of the at least one source device based on the control instructions, identify the first control code from a first control code set stored in the storage based on the information related to the first control code, and control the communicator to transmit a first control signal indicating the first control code to the first source device.

Abstract: An input device which includes a sensor, a microphone, a communicator, and a processor configured to, based on an operation of a user being identified based on a value sensed through the sensor, transmit utterance intention sensing information to an electronic device, based on a command to initiate a speech recognition and feedback information being received from the electronic device according to the utterance intention sensing information transmitted to the electronic device, activate the microphone and provide a feedback according to the feedback information, and transmit a voice signal received via the microphone to the electronic device.

Abstract: The present invention relates to a microstrip-waveguide transition for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a microstrip-waveguide transition for transmission of electromagnetic wave signals, comprising: a feeding part for providing an electromagnetic wave signal to be transmitted through the waveguide; and a ground part formed at a predetermined interval from the feeding part, wherein the microstrip and the waveguide are coupled alongside each other along a length direction of the waveguide, and wherein a distance between the feeding part and the ground part in a direction perpendicular to the length direction of the waveguide is greater as it is closer to the waveguide.

Abstract: A remote controller includes a communicator and a processor configured to control the communicator to transmit an identification information request signal to a plurality of electronic apparatuses paired with the remote controller. Based on a signal that includes identification information being received from two or more of the plurality of electronic apparatuses in response to the identification information request signal, the processor controls the communicator to identify a direction of the remote controller based on a direction from which each of the signals is received. The processor causes communication to be performed via an exclusive communication channel between the remote controller and one of the plurality of electronic apparatuses based on the identified direction.

Abstract: Disclosed are a modified conjugated diene polymer and a method for preparing the same. The modified conjugated diene polymer and the method for preparing the same advantageously provide superior compatibility with an inorganic filler, heat generation, tensile strength and abrasion resistance, low fuel consumption and excellent resistance on wet roads.

Abstract: The present invention relates to a waveguide for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part comprising two or more dielectrics having different permittivity; and a conductor part surrounding at least a part of the dielectric part.

Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

Abstract: The present invention relates to a waveguide for transmission of electromagnetic wave signals and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part; and a conductor part surrounding at least a part of the dielectric part, wherein a signal of a first frequency band being a relatively higher frequency band is transmitted through the dielectric part, and a signal of a second frequency band being a relatively lower frequency band is transmitted through the conductor part.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: Methods of and systems for removing organic substance from condensate generated from an industrial evaporation process are provided. The condensate comprises water and the organic substance. The methods and systems provide solutions related to enthalpy recovery of industrial evaporation processes such as, for example, sugar cane juice evaporation processes, dairy evaporation processes, coffee processing evaporation processes, fruit juice evaporation processes, soup evaporation processes, and chemical industry evaporation processes.

Abstract: An apparatus and method capable of efficiently manufacturing a LED module. The method of manufacturing an Light Emitting Diode (LED) module includes preparing a substrate and a carrier on which an LED chip is disposed, disposing a mask on the substrate, the mask including an opening and a wall defining or forming the opening, picking up the LED chip from the carrier with a stamp, moving the LED chip picked up by the stamp to face the opening, moving the LED chip so that at least a part of the LED chip is inserted into the opening, and positioning the LED chip on the substrate by moving the LED chip so that the at least a part of the LED chip contacts the wall.

Abstract: An electronic device includes a camera and a processor. The processor is configured to: obtain a first image from the camera with respect to an external object, move a lens device depending on a specified amount of movement using a lens driver, obtain a second image corresponding to a position to which the lens device moves with respect to the external object, determine a first partial area of the first image corresponding to a specified portion of the external object, determine a second partial area of the second image corresponding to the first partial area based on the first partial area and the specified movement amount, determine a focus position with respect to the lens device based on a defocus difference between the first partial area and the second partial area and the specified movement amount, and move the lens device to the focus position using the lens driver.

Abstract: The present disclosure relates to a gasket for an MCFC, the gasket being in direct contact with a molten carbonate electrolyte and configuring a wet seal part of a stack in a manifold sealing part of an external manifold-type MCFC stack, wherein the gasket has a structure in which two or more partial gaskets separated from each other in a stacking direction of the stack are connected to each other and a blocking layer physically blocking migration of the molten carbonate electrolyte is formed between the partial gaskets, and the blocking layer is a thick film layer or a green sheet layer formed of the same oxide powder particles as those of the partial gaskets and is manufactured by co-sintering a partial oxide felt assembly and the blocking layer in a process of sintering the gasket.

Abstract: In one embodiment, a method for fabricating a semiconductor package includes providing a multi-layer molded conductive structure. The multi-layer molded conductive structure includes a first conductive structure disposed on a surface of a carrier and a first encapsulant covering at least portions of the first conductive structure while other portions are exposed in the first encapsulant. A second conductive structure is disposed on the first encapsulant and electrically connected to the first conductive structure. A second encapsulant covers a first portion of the second conductive structure while a second portion of the second conductive structure is exposed to the outside, and a third portion of the second conductive structure is exposed in a receiving space disposed in the second encapsulant. The method includes electrically connecting a semiconductor die to the second conductive structure and in some embodiments removing the carrier.

Abstract: An electronic device is provided. The electronic device includes a camera including a lens unit and a lens driving unit and a processor configured to obtain a first image of an object from the camera, move the lens unit by a specified amount using the lens driving unit, obtain a second image of the object that corresponds to a position to which the lens unit is moved, determine a focus position for an image of the object based on a difference between the first image, the second image, and the specified amount of movement, determine an amount of movement for moving the lens unit to the focus position including determining a distance between the object and the lens unit and correcting the determined amount of movement based on the determined distance, and move the lens unit by the determined amount of movement using the lens driving unit.

Abstract: The present disclosure provides a current sensor including: a shunt resistor provided between a first bus bar and a second bus bar, and a fastener coupled through the first bus bar, the second bus bar, and the shunt resistor. The first bus bar has a first through-hole, the second bus bar has a second through-hole, and the shunt resistor has a third through-hole. The first through-hole, the second through-hole, and the third through-hole are aligned with one another to allow the fastener to pass through the first to third through-holes.

Abstract: A curved multi-view image display apparatus is provided. The curved multi-view image display apparatus includes: a curved display panel which includes a plurality of sub-pixels and has a curvature; a viewing zone divider provided on in front of the display panel and configured to divide a viewing zone and provide a plurality of optical views; a renderer configured to render a multi-view image to be output to the display panel; and a controller configured to determine a rendering pitch for each of the plurality of optical views based on the curvature, and control the renderer so that at least some of the plurality of sub-pixels to output a pixel value corresponding to a plurality of multi-view images based on the determined rendering pitch.