Patents by Inventor Hoon YOON

Hoon YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip-to-chip interface comprising a microstrip circuit to waveguide transition having an emitting patch
    Patent number: 10128557
    Abstract: The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, and a patch emitting the signal to a waveguide. The patch is disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween. At least one of length of the probe, thickness of the core substrate, and permittivity of the core substrate is determined based on bandwidth of a transition between the microstrip circuit and the waveguide.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: November 13, 2018
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha II Song, HuXian Jin, Joon Yeong Lee, Hyo Sup Won, Tae Hoon Yoon
  • Solar cell having rear buffer layer and method of manufacturing the same
    Patent number: 10121924
    Abstract: The invention relates a thin-film solar cell. In the related art, a buffer layer, a transparent electrode, and a grid electrode are formed on a light absorption layer, but in the invention, the buffer layer and the transparent electrode are not formed on a light absorption layer, and the buffer layer, the transparent electrode, and the grid electrode are formed under a CIGS face such that solar light is directly input to the light absorption layer without obstacles, and the first electrode and the buffer layer are patterned in a saw-toothed structure to engage with each other to reduce a distance by which electrons or holes generated by absorbing light energy move to the electrode or the buffer layer.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: November 6, 2018
    Assignee: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Young Joo Eo, Ara Cho, Jun Sik Cho, Joo Hyung Park, Kyung Hoon Yoon, Se Jin Ahn, Ji Hye Gwak, Jae Ho Yun, Kee Shik Shin, Seoung Kyu Ahn, Jin Su You, Sang Hyun Park
  • Functional film for improving impregnation properties of composite material and method for manufacturing composite material using same
    Patent number: 10093080
    Abstract: Disclosed are a film for forming a composite material, which is capable of improving impregnation properties by using a carrier film on which a low viscosity resin layer is formed, and a method for manufacturing a composite material using the same. The film for forming a composite material, according to the present invention, comprises: a continuous fibrous layer; and a carrier film which is adhered to any one side of the continuous fibrous layer and has a low viscosity resin layer formed on the adhered side of the continuous fibrous layer. Thus, the present invention provides the advantage of having a composite material with excellent impregnation properties and excellent mechanical performance.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: October 9, 2018
    Assignee: LG HAUSYS, LTD.
    Inventors: Ae Ri Oh, Gi Hune Jung, Tae-Hwa Lee, Yong-Hoon Yoon, Hee-June Kim, Jae-Hoon Choi
  • Method for manufacturing light absorption layer of thin film solar cell and thin film solar cell using the same
    Patent number: 10096739
    Abstract: A method for manufacturing a light absorption layer of a thin film solar cell in in a method for manufacturing a solar cell transparent electrode may be provided that includes: manufacturing a Ib group element-VIa group element binary system nano particle (s100); manufacturing a binary system nano particle slurry of the Ib group element-VIa group element by adding a solvent, binder and a solution precursor including Va group element to the Ib group element-VIa group element binary system nano particle (s200); distributing and mixing the binary system nano particle slurry of the Ib group element-VIa group element (s300); coating the binary system nano particle slurry of the Ib group element-VIa group element on the rear electrode layer 200 (s400); and performing a heat treatment process on the coated nano particle slurry by supplying the VIa group element (s500).
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: October 9, 2018
    Assignee: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Ara Cho, Kyung Hoon Yoon, Se Jin Ahn, Jae Ho Yun, Jihye Gwak, Kee Shik Shin, Young Joo Eo, Seoung Kyu Ahn, Jun Sik Cho, Jin Su You, Joo Hyung Park, Ki Hwan Kim
  • Keyless entry system and control method for the same
    Patent number: 10089800
    Abstract: A keyless entry system for remotely controlling a door and a window of a vehicle includes: a remote control key that stores a plurality of function codes, selects a function code corresponding to an on-duration time of a lock switch or an on-duration time of an unlock switch, modulates the selected function code to a wireless signal, and transmits the wireless signal; and a receiving device that receives the wireless signal, demodulates the wireless signal into the function code, and outputs a door control signal or a window control signal according to the modulated function code, where the function code is divided into a basic function code field and a window function code field.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: October 2, 2018
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Kyong Ho Shon, Gi Hoon Yoon
  • Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
    Patent number: 10090230
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: October 2, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Fluorescent lamp-type LED lighting device
    Patent number: 10066790
    Abstract: The present invention relates to a fluorescent lamp-type LED lighting device including: a case part formed to be elongated in one direction and having an open bottom surface which provides a reflection space on the inner side; a cover part provided on the bottom surface of the case part so that the light which is reflected and diffused in the case part is emitted; and multiple LEDs which emit the light from the cover part and the inner side of the case part such that the light is reflected and diffused on the inner side of the case part. According to the present invention, the LED light is emitted toward an indoor ceiling side, the reflection space is provided so as to reflect and diffuse the emitted LED light, and the light is emitted through a bottom surface part. Accordingly, no additional diffusion plate for surface emission is used and thus optical efficiency can be increased.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: September 4, 2018
    Assignee: GIGATERA INC.
    Inventors: Duk-Yong Kim, Min-Soo Kim, Joon-Hong Park, Sung-Hoon Yoon
  • Semiconductor device and manufacturing method thereof
    Patent number: 10062626
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: August 28, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • POSITIONING MODULE AND DRIVING CONTROL DEVICE OF CARRIER UNIT, INCLUDING SAME
    Publication number: 20180208423
    Abstract: The present invention relates to a positioning module and a driving control device of carrier unit with the positioning module. In the present invention, the positioning module calculates the unwinding length and unwinding angle of a wire which is unwound by an external force. Then, the positioning module sequentially calculates location information of some points on the wire and the speed of the wire. When the speed exceeds the threshold value, the positioning module generates a control signal corresponding to the number of times where the speed exceeds the threshold value, by using the unwinding length and the unwinding angle.
    Type: Application
    Filed: March 21, 2018
    Publication date: July 26, 2018
    Applicant: OMOROBOT INC.
    Inventor: Seok-Hoon YOON
  • Backlight apparatus and 3D image display apparatus including the same
    Patent number: 10025020
    Abstract: A 3D image display apparatus includes a display panel configured to display a multiview image, a light guide plate disposed in a rear of the display panel and spaced apart from the display panel, a main pattern repeatedly formed and spaced at a preset interval, and a light source configured to irradiate light to the light guide plate. A height of a sub pattern disposed in a light incident portion of the light guide plate near the light source among sub patterns constituting the main pattern is smaller than that of a sub pattern disposed in a central portion of the light guide plate.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: July 17, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-hoon Yoon, Ki-hyung Kang
  • PLATE HEAT EXCHANGER INTEGRATED WITH PIPELINE
    Publication number: 20180156548
    Abstract: Provided is a technology for a battery module used in an electric vehicle, and, more particularly, a plate heat exchanger integrated with pipelines, the heat exchanger which has a structure as simple as possible and thus is able to streamline a manufacturing process, reduce manufacturing price, and maximize heat exchange effects due to pipelines formed on a pipeline plate which is formed on an inner surface of the plate heat exchanger.
    Type: Application
    Filed: December 5, 2016
    Publication date: June 7, 2018
    Applicant: S&G Co.,Ltd
    Inventor: Jung Hoon YOON
  • Power conversion module for vehicle
    Patent number: 9969274
    Abstract: A power conversion module for a vehicle is provided. The module includes a housing and a power conversion unit installed on an inside surface of a bottom panel of the housing. The power conversion unit includes a capacitor module, a power module of an inverter and a LDC. A water-cooling-type cooling unit is installed on an outside surface of the bottom panel of the housing and is in a corresponding position to the power module of the inverter and the LDC, with the bottom panel of the housing interposed therebetween. An air-cooling-type cooling fin is installed on the exterior surface of the bottom panel and is in a corresponding position to a capacitor module, with the bottom panel of the housing interposed therebetween. A radiator blower adjacent to a radiator of a vehicle is configured to generate cooling-air wind to cool the radiator and the air-cooling-type cooling fin.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: May 15, 2018
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jae Hoon Yoon, Jung Hong Joo, Dong Min Shin, Kang Hoon Ko
  • Display apparatus and touch panel
    Patent number: 9967552
    Abstract: A display apparatus includes a display panel configured to display an image frame that includes a right-eye image and a left-eye image, and a touch panel configured to sense a user touch, wherein the touch panel includes a polarizing switch panel configured to switch a direction of polarization of light emitted from the display panel, and a parallax realization layer which is formed on one side of the polarizing switch panel and is configured to provide a binocular disparity image by using light emitted from the polarizing switch panel.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: May 8, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: In-hak Na, Ki-hyung Kang, Soo-bae Moon, Jung-hoon Yoon, Hyun-seung Cho, Seon-deok Hwang
  • ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
    Publication number: 20180083061
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Application
    Filed: November 28, 2017
    Publication date: March 22, 2018
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180033708
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Application
    Filed: July 26, 2016
    Publication date: February 1, 2018
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • Dental implant fixture
    Patent number: 9855119
    Abstract: An implant fixture that is inserted into a bone tissue formed of a cortical bone and a cancellous bone while rotating on a central axis to thereby form an artificial tooth root, the implant fixture including a first portion that is inserted into the cortical bone and includes a first screw thread having first peaks and first roots alternating with one another on an outer surface of the first portion; and a second portion that is disposed below the first portion and inserted into the cancellous bone.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: January 2, 2018
    Assignee: OSSTEMIMPLANT CO., LTD.
    Inventors: Ji Hoon Yoon, Sang Oh Park
  • Electronic device package and fabricating method thereof
    Patent number: 9831282
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: November 28, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • UNMANNED VEHICLE
    Publication number: 20170313418
    Abstract: An unmanned vehicle is provided. The unmanned vehicle includes: a base; a driving unit including an actuator and a propeller rotating by using power of the actuator, the driving unit being provided outside the base capable of pivoting with respect to the base; and a supporter protruding from the base and supporting the base.
    Type: Application
    Filed: January 14, 2015
    Publication date: November 2, 2017
    Applicant: Hanwha Techwin Co., Ltd.
    Inventor: Seok Hoon YOON
  • Plate structure
    Patent number: 9796164
    Abstract: A plate structure and method of manufacturing a plate structure, the plate structure including a first plate; an optical laminate on the first plate, the optical laminate including an optical plate on the first plate and a film dam along a top periphery of the optical plate; a second plate on the optical laminate; and a resin layer in a space provided by the film dam, the resin layer attaching the optical plate to the second plate.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: October 24, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Yun Hak Kim, Seok Hoon Yoon
  • Charging station for multi-media device
    Patent number: D801920
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: November 7, 2017
    Inventor: Sang-Hoon Yoon