Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: An integrated circuit device includes a first fin separation insulating portion over the first device region; a pair of first fin-type active regions apart from each other with the first fin separation insulating portion therebetween and collinearly extending in a first horizontal direction; a first dummy gate structure vertically overlapping the first fin separation insulating portion; a second fin separation insulating portion apart from the first fin separation insulating portion and arranged over the second device region; and a plurality of second fin-type active regions apart from each other with the second fin separation insulating portion therebetween in the second device region and collinearly extending in the first horizontal direction, wherein a vertical level of a lowermost surface of the second fin separation insulating portion is equal to or lower than a vertical level of a lowermost surface of the first fin separation insulating portion.

Abstract: A semiconductor package includes a semiconductor chip comprising a first surface and a second surface, a redistribution layer on the first surface of the semiconductor chip, an under bump metal (UBM) layer on the redistribution layer, and a solder bump on the UBM layer, and the solder bump covers both outer side surfaces of the UBM layer.

Abstract: A manufacturing method of a display apparatus includes mounting a plurality of inorganic light emitting diodes on a substrate, forming a black molding layer having a low refractive index and configured to surround the plurality of inorganic light emitting diodes such that front light emitting surfaces of the plurality of inorganic light emitting diodes that are directed to a front side of the display apparatus are exposed, and assembling a plurality of unit modules each comprising the substrate, the plurality of inorganic light emitting diode, and the black molding layer to be adjacent to each other.

Abstract: The present disclosure provides a current sensor including: a shunt resistor provided between a first bus bar and a second bus bar, and a fastener coupled through the first bus bar, the second bus bar, and the shunt resistor. The first bus bar has a first through-hole, the second bus bar has a second through-hole, and the shunt resistor has a third through-hole. The first through-hole, the second through-hole, and the third through-hole are aligned with one another to allow the fastener to pass through the first to third through-holes.

Abstract: A display apparatus includes a plurality of unit modules; and a cover configured to support the plurality of unit modules. Each of the plurality of unit modules includes: a substrate; a plurality of inorganic light emitting diodes provided on a mounting surface of the substrate; and an encapsulation layer formed on the mounting surface of the substrate to cover the plurality of inorganic light emitting diodes and the mounting surface of the substrate. The encapsulation layer includes a viscoelastic material having varying viscoelasticity based on temperature being applied to the viscoelastic material.

Abstract: A remote controller includes a communicator and a processor configured to control the communicator to transmit an identification information request signal to a plurality of electronic apparatuses paired with the remote controller. Based on a signal that includes identification information being received from two or more of the plurality of electronic apparatuses in response to the identification information request signal, the processor controls the communicator to identify a direction of the remote controller based on a direction from which each of the signals is received. The processor causes communication to be performed via an exclusive communication channel between the remote controller and one of the plurality of electronic apparatuses based on the identified direction.

Abstract: Methods of conditioning a membrane utilized for water purification are provided. The methods monitor membrane performance during water purification or membrane conditioning via fluorometric measurement. The monitoring allows for the detection of removal efficiency of the fluorescing substance. A conditioner is introduced in the feed stream to increase the detected removal efficiency of a fluorescing substance by the membrane. The conditioner generally extends the useful life of the membrane being conditioned.

Abstract: A system and method for monitoring a leakage of internal information by analyzing encrypted traffic according to the present invention is characterized in that an SSL session is not created directly between an internal computer and an external computer, but a monitoring computer creates SSL sessions with the internal computer and the external computer respectively, and when a data packet is transmitted from the internal computer to the external computer, the monitoring computer first checks whether the data packet contains internal information and then delivers the data packet.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

Abstract: An electronic device includes a camera and a processor. The processor is configured to: obtain a first image from the camera with respect to an external object, move a lens device depending on a specified amount of movement using a lens driver, obtain a second image corresponding to a position to which the lens device moves with respect to the external object, determine a first partial area of the first image corresponding to a specified portion of the external object, determine a second partial area of the second image corresponding to the first partial area based on the first partial area and the specified movement amount, determine a focus position with respect to the lens device based on a defocus difference between the first partial area and the second partial area and the specified movement amount, and move the lens device to the focus position using the lens driver.

Abstract: A remote control apparatus is provided.

Abstract: An integrated circuit device includes a first fin separation insulating portion over the first device region; a pair of first fin-type active regions apart from each other with the first fin separation insulating portion therebetween and collinearly extending in a first horizontal direction; a first dummy gate structure vertically overlapping the first fin separation insulating portion; a second fin separation insulating portion apart from the first fin separation insulating portion and arranged over the second device region; and a plurality of second fin-type active regions apart from each other with the second fin separation insulating portion therebetween in the second device region and collinearly extending in the first horizontal direction, wherein a vertical level of a lowermost surface of the second fin separation insulating portion is equal to or lower than a vertical level of a lowermost surface of the first fin separation insulating portion.

Abstract: A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.

Abstract: Disclosed is a crucible that exhibits stable evaporation efficiency and durability with respect to Al, is used in an evaporation source of an electron-beam evaporator, and includes a storage unit, which includes a wall and a bottom and in which a deposition material is placed, and a wetting prevention unit that includes another wall, which is taller than the wall of the storage unit, and another bottom, and is combined with an exterior of the storage unit. The wetting prevention unit is provided so that only the wall of the storage unit is wet with Al, and accordingly, the lifespan of the crucible is lengthened. Further, contact with the ceramic material in order to prevent wetting is minimized, thereby preventing a reduction in the physical properties of the thin film due to the impurities mixed with the deposited Al.

Abstract: A fluorometer may be used to measure ultralow concentrations of fluorescing species, such as ultralow concentrations of fluorescent tracer passing through a reverse osmosis membrane into a permeate stream. In some examples, the fluorometer may be recalibrated by resetting some but not all of the calibration parameters used to determine the concentration of fluorescent tracer in the permeate based on the measured fluorescent response of the fluorometer. For example, an intercept of a calibration curve may be reset or recalibrated for the fluorometer in situ, potentially providing significant accuracy improvements even though the fluorometer has not undergone a full recalibration.

Abstract: Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.

Abstract: A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.

Abstract: A 3D display device includes: a data processor configured to generate at least one frame by combining a left-eye image and a right-eye image; a panel including pixels, each of the pixels including three sub pixels; a barrier configured to form a light blocking region and a light transmitting region on the panel on a basis of two sub pixel units; and a controller configured to control the data processor to generate the at least one frame by placing the left-eye image and the right-eye image alternately on the basis of two sub pixels, and to control the panel to display at least one frame generated by the data processor.