Wafer pod

Skip to: Description  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a wafer pod showing the preferred embodiment of my new design;

FIG. 2 is a front elevational view of the wafer pod;

FIG. 3 is a rear elevational view of the wafer pod;

FIG. 4 is a left elevational side view of the wafer pod;

FIG. 5 is a right elevational side view of the wafer pod;

FIG. 6 is a top plan view of the wafer pod; and,

FIG. 7 is a bottom plan view of the wafer pod.

Referenced Cited
U.S. Patent Documents
D344891 March 8, 1994 Dressen
D376688 December 24, 1996 Gallagher et al.
D387903 December 23, 1997 Jacoby et al.
4588086 May 13, 1986 Coe
4684021 August 4, 1987 Niebling et al.
4709834 December 1, 1987 Mortensen et al.
4793488 December 27, 1988 Mortensen
4817799 April 4, 1989 Gregerson et al.
5025926 June 25, 1991 Gregerson et al.
5207324 May 4, 1993 Kos
Patent History
Patent number: D408139
Type: Grant
Filed: Aug 12, 1997
Date of Patent: Apr 20, 1999
Assignee: Industrial Technology Research Institute (Hsinchu)
Inventors: Horng-Kuang Fan (Hsinchu), Gwo-Jou Huang (Hsinchu)
Primary Examiner: Philip S. Hyder
Attorney: W. Wayne Liauh
Application Number: 0/77,908
Classifications
Current U.S. Class: D/3273; D3/269
International Classification: 0301;