Patents by Inventor Horst Theuss

Horst Theuss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250130294
    Abstract: A sensor device contains a magnetic field sensor chip. The magnetic field sensor chip contains a semiconductor substrate having a first surface and a second surface opposite the first surface, a sensor element that is arranged at the first surface and is configured to detect a magnetic field present at the location of the sensor element, and at least one trench extending from at least one of the two surfaces into the semiconductor substrate. The sensor element is spaced laterally from the at least one trench.
    Type: Application
    Filed: October 16, 2024
    Publication date: April 24, 2025
    Inventor: Horst THEUSS
  • Publication number: 20250117099
    Abstract: An ultrasonic touch sensor is proposed for attachment to a casing, having a semiconductor chip including a substrate side and a component side, the semiconductor chip including an ultrasonic transducer element and the ultrasonic transducer element being arranged at the component side, having an acoustic coupling medium covering the semiconductor chip at least in the region of the ultrasonic transducer element, having electrical contact elements for controlling the ultrasonic transducer element, the electrical contact elements being laterally displaced outward from the semiconductor chip, and having conductor tracks electrically coupled to the semiconductor chip and the electrical contact elements.
    Type: Application
    Filed: December 19, 2024
    Publication date: April 10, 2025
    Inventors: Rainer Markus SCHALLER, Jochen DANGELMAIER, Klaus ELIAN, Horst THEUSS
  • Publication number: 20250109011
    Abstract: A description is given of a sensor device and a method for producing same. According to one example implementation, the sensor device includes a chip carrier, a semiconductor chip mounted on the chip carrier, and electrical connections between connection pads of the semiconductor chip and corresponding connection pads of the chip carrier. The sensor device further includes a sensor chip arranged on the semiconductor chip and having a sensor element. The sensor chip has trenches that mechanically decouple the sensor element from the rest of the sensor chip. The chip package forms a mold compound that at least partially encapsulates the semiconductor chip and the electrical connections and has an opening in the region of the sensor element so that the sensor element can interact with a medium surrounding the sensor device. The mold compound covers the semiconductor chip except for the sensor chip.
    Type: Application
    Filed: September 18, 2024
    Publication date: April 3, 2025
    Inventors: Horst THEUSS, Rainer Markus SCHALLER
  • Patent number: 12228728
    Abstract: One example implementation of a mirror system comprises a carrier, and a first chip package arranged on a surface of the carrier and comprising a first MEMS mirror. Furthermore, the mirror system comprises a second chip package arranged on the surface of the carrier and comprising a second MEMS mirror. The mirror system furthermore comprises a reflective element arranged over the surface of the carrier and above the first chip package and the second chip package in such a way that a radiation that is incident in the mirror system and is reflected by the first MEMS mirror in the direction of the reflective element is reflected by the reflective element in the direction of the second MEMS mirror.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: February 18, 2025
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Klaus Elian, Cyrus Ghahremani
  • Patent number: 12210706
    Abstract: An ultrasonic touch sensor is proposed for attachment to a casing, having a semiconductor chip including a substrate side and a component side, the semiconductor chip including an ultrasonic transducer element and the ultrasonic transducer element being arranged on the component side, having an acoustic coupling medium covering the semiconductor chip at least in the region of the ultrasonic transducer element, having electrical contact elements for controlling the ultrasonic transducer element, and the electrical contact elements being arranged on the component side of the semiconductor chip.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: January 28, 2025
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Jochen Dangelmaier, Klaus Elian, Horst Theuss
  • Patent number: 12196825
    Abstract: A sensor device contains a first magnetic field sensor chip having a first sensor element. The first magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the first sensor element. The sensor device contains a second magnetic field sensor chip having a second sensor element. The second magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the second sensor element. The sensor device contains a current conductor configured to carry a measurement current that induces a magnetic field at the locations of the sensor elements. The magnetic field sensor chips and the current conductor are arranged relative to one another in such a way that an influence of a homogeneous magnetic stray field on the first components is compensated for upon difference formation or summation applied to the first components.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: January 14, 2025
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Rainer Markus Schaller
  • Publication number: 20240413057
    Abstract: A semiconductor package is proposed. The semiconductor package includes a housing and at least one micromechanical ultrasonic transducer arranged in the housing. Furthermore, the semiconductor package includes a cable interface integrated into the housing, which is configured to be separably connected to a plug connector in order to electrically contact the semiconductor package externally.
    Type: Application
    Filed: May 29, 2024
    Publication date: December 12, 2024
    Inventors: Horst THEUSS, Klaus ELIAN
  • Publication number: 20240393433
    Abstract: A method for authenticating an object includes positioning a millimeter-wave transceiver relative to an object which contains a metamaterial marking. A transmit signal is transmitted from the millimeter-wave transceiver in the direction of the metamaterial marking, wherein the transmit signal is converted based on the metamaterial marking into a receive signal which has a first characteristic and is emitted in the direction of the millimeter-wave transceiver. The receive signal is received and processed by the millimeter-wave transceiver in order to capture the first characteristic. First comparison information is generated based on the first characteristic and an authentication of the object is carried out based on the first comparison information.
    Type: Application
    Filed: May 20, 2024
    Publication date: November 28, 2024
    Inventors: Klaus ELIAN, Walter HARTNER, Horst THEUSS, Christian GEIßLER, Rainer Markus SCHALLER
  • Patent number: 12135853
    Abstract: What is proposed is an ultrasonic touch sensor having a contact surface for attaching the ultrasonic touch sensor to a casing, having a first ultrasonic transducer element, having a first semiconductor chip, wherein the first semiconductor chip comprises the first ultrasonic transducer element, wherein the first semiconductor chip is potted into a potting compound in such a way that a first cutout is formed from the first ultrasonic transducer element to the contact surface of the ultrasonic touch sensor, and wherein the potting compound forms the housing of the ultrasonic touch sensor.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: November 5, 2024
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Horst Theuss
  • Patent number: 12122667
    Abstract: A method for producing sensor devices includes generating a semiconductor wafer having a plurality of sensor chips, wherein each sensor chip comprises a micro-electromechanical systems (MEMS) structure arranged at a main surface of the semiconductor wafer; forming a plurality of gas-permeable covers over the main surface of the semiconductor wafer, wherein each gas-permeable cover covers a corresponding MEMS structure of the MEMS structures and forms a cavity above the corresponding MEMS structure; and singulating the semiconductor wafer into a plurality of sensor devices.
    Type: Grant
    Filed: September 15, 2023
    Date of Patent: October 22, 2024
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Klaus Elian, Horst Theuss
  • Publication number: 20240343553
    Abstract: Examples disclose a semiconductor package including a semiconductor chip, an encapsulation, and a metal structure. The semiconductor chip is at least partially embedded in the encapsulation. The metal structure is formed on an outer surface of the encapsulation and includes a floating portion. The floating portion is floating on the encapsulation and the metal structure is electrically coupled with the semiconductor chip. Further examples disclose a method for manufacturing a semiconductor package, the method including providing a semiconductor chip at least partially embedded in an encapsulation; providing a metal structure on the encapsulation; forming a floating portion of the metal structure by forming a recess in the encapsulation.
    Type: Application
    Filed: April 3, 2024
    Publication date: October 17, 2024
    Inventors: Horst THEUSS, Chau Fatt CHIANG, Chee Hong LEE, Rainer Markus SCHALLER, Kok Yau CHUA, Julianous KETIHUS, Khay Chwan ANDREW SAW
  • Publication number: 20240312975
    Abstract: A transformer arrangement is disclosed. The transformer arrangement includes: an electrically insulating carrier; a first integrated circuit including a first semiconductor die embedded in or arranged on top of the electrically insulating carrier; and a transformer including a first winding and a second winding that are inductively coupled. One of the first and second windings is connected to the first integrated circuit, and each of the first and second windings is embedded in or arranged on top of the electrically insulating carrier.
    Type: Application
    Filed: March 7, 2024
    Publication date: September 19, 2024
    Inventors: Horst Theuss, Christian Geißler, Walter Hartner
  • Patent number: 12086363
    Abstract: A sensor device contains at least one sensor chip having at least one MEMS structure arranged at a main surface of the at least one sensor chip, wherein the at least one sensor chip is configured to transmit ultrasonic signals and/or to receive ultrasonic signals. The sensor device further contains an acoustic coupling medium arranged selectively on the at least one MEMS structure, wherein the acoustic coupling medium is configured to decouple an ultrasonic signal to be emitted from the at least one MEMS structure and/or to inject a received ultrasonic signal into the at least one MEMS structure. The acoustic coupling medium only partially covers the main surface of the at least one sensor chip.
    Type: Grant
    Filed: August 28, 2023
    Date of Patent: September 10, 2024
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Christoph Steiner, Horst Theuss
  • Patent number: 12040543
    Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: July 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Walter Hartner, Tuncay Erdoel, Klaus Elian, Christian Geissler, Bernhard Rieder, Rainer Markus Schaller, Horst Theuss, Maciej Wojnowski
  • Patent number: 12030450
    Abstract: A sensor device includes a sensor which is configured to detect a physical quantity generated by an impact event and to generate first measurement data based on the impact event. The sensor device also includes a MEMS microphone configured to detect sound waves generated by the impact event and to generate second measurement data based on the impact event. The sensor device is configured to provide the first measurement data and the second measurement data to a logic unit. The logic unit is configured to detect the impact event based on a combination of the first measurement data and the second measurement data.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: July 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Horst Theuss
  • Publication number: 20240196757
    Abstract: A fan-out wafer-level package contains a magnetic field sensor chip and an encapsulation material which at least partially encapsulates the magnetic field sensor chip. Further, the fan-out wafer-level package contains an external electrical contact element formed by a planar solderable metal coating, and an electrical redistribution layer arranged over the encapsulation material and electrically interconnecting the magnetic field sensor chip and the external electrical contact element.
    Type: Application
    Filed: December 1, 2023
    Publication date: June 13, 2024
    Inventors: Horst THEUSS, Christian GEISSLER, Rainer Markus SCHALLER, Walter HARTNER
  • Publication number: 20240151689
    Abstract: The application relates to a semiconductor device (20) for measuring hydrogen including a sensor chip (10), which has a sensor including a sensor layer (14), which changes its mechanical stress upon contact with hydrogen, wherein the sensor is configured to detect the change in the mechanical stress of the sensor layer (14) by way of a membrane (15), wherein for detection purposes provision is made for exciting the membrane (15) using a periodic signal. The application furthermore relates to a method for measuring a hydrogen concentration.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 9, 2024
    Inventors: Horst THEUSS, Rainer Markus SCHALLER
  • Publication number: 20240151674
    Abstract: The application relates to a semiconductor device for measuring hydrogen including a sensor chip having a sensor layer, which changes its mechanical stress upon contact with hydrogen. The sensor chip furthermore has a sensor for detecting the change in stress, wherein the construction of the semiconductor device affords the sensor layer and/or the sensor protection against further mechanical stresses. The application furthermore relates to a method for measuring a hydrogen concentration.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 9, 2024
    Inventors: Horst THEUSS, Rainer Markus SCHALLER
  • Patent number: 11967562
    Abstract: A method for fabricating packaged semiconductor devices is disclosed. In one example the method comprises providing a plurality of semiconductor dies, the semiconductor dies being arranged in an array on a carrier such that a first side of the semiconductor dies faces the carrier and such that an empty space is arranged laterally besides each semiconductor die. A substrate comprising a plurality of conductive elements is arranged over the plurality of semiconductor dies such that a conductive element is arranged in the respective empty space besides each one of the semiconductor dies. The plurality of semiconductor dies are molded over to form a molded body, and singulating packaged semiconductor devices from the molded body by cutting through the molded body.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: April 23, 2024
    Assignee: Infineon Technologies AG
    Inventor: Horst Theuss
  • Publication number: 20240086017
    Abstract: A sensor device contains at least one sensor chip having at least one MEMS structure arranged at a main surface of the at least one sensor chip, wherein the at least one sensor chip is configured to transmit ultrasonic signals and/or to receive ultrasonic signals. The sensor device further contains an acoustic coupling medium arranged selectively on the at least one MEMS structure, wherein the acoustic coupling medium is configured to decouple an ultrasonic signal to be emitted from the at least one MEMS structure and/or to inject a received ultrasonic signal into the at least one MEMS structure. The acoustic coupling medium only partially covers the main surface of the at least one sensor chip.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 14, 2024
    Inventors: Klaus ELIAN, Christoph STEINER, Horst THEUSS