Patents by Inventor Horst Theuss

Horst Theuss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240196757
    Abstract: A fan-out wafer-level package contains a magnetic field sensor chip and an encapsulation material which at least partially encapsulates the magnetic field sensor chip. Further, the fan-out wafer-level package contains an external electrical contact element formed by a planar solderable metal coating, and an electrical redistribution layer arranged over the encapsulation material and electrically interconnecting the magnetic field sensor chip and the external electrical contact element.
    Type: Application
    Filed: December 1, 2023
    Publication date: June 13, 2024
    Inventors: Horst THEUSS, Christian GEISSLER, Rainer Markus SCHALLER, Walter HARTNER
  • Publication number: 20240151674
    Abstract: The application relates to a semiconductor device for measuring hydrogen including a sensor chip having a sensor layer, which changes its mechanical stress upon contact with hydrogen. The sensor chip furthermore has a sensor for detecting the change in stress, wherein the construction of the semiconductor device affords the sensor layer and/or the sensor protection against further mechanical stresses. The application furthermore relates to a method for measuring a hydrogen concentration.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 9, 2024
    Inventors: Horst THEUSS, Rainer Markus SCHALLER
  • Publication number: 20240151689
    Abstract: The application relates to a semiconductor device (20) for measuring hydrogen including a sensor chip (10), which has a sensor including a sensor layer (14), which changes its mechanical stress upon contact with hydrogen, wherein the sensor is configured to detect the change in the mechanical stress of the sensor layer (14) by way of a membrane (15), wherein for detection purposes provision is made for exciting the membrane (15) using a periodic signal. The application furthermore relates to a method for measuring a hydrogen concentration.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 9, 2024
    Inventors: Horst THEUSS, Rainer Markus SCHALLER
  • Patent number: 11967562
    Abstract: A method for fabricating packaged semiconductor devices is disclosed. In one example the method comprises providing a plurality of semiconductor dies, the semiconductor dies being arranged in an array on a carrier such that a first side of the semiconductor dies faces the carrier and such that an empty space is arranged laterally besides each semiconductor die. A substrate comprising a plurality of conductive elements is arranged over the plurality of semiconductor dies such that a conductive element is arranged in the respective empty space besides each one of the semiconductor dies. The plurality of semiconductor dies are molded over to form a molded body, and singulating packaged semiconductor devices from the molded body by cutting through the molded body.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: April 23, 2024
    Assignee: Infineon Technologies AG
    Inventor: Horst Theuss
  • Publication number: 20240086017
    Abstract: A sensor device contains at least one sensor chip having at least one MEMS structure arranged at a main surface of the at least one sensor chip, wherein the at least one sensor chip is configured to transmit ultrasonic signals and/or to receive ultrasonic signals. The sensor device further contains an acoustic coupling medium arranged selectively on the at least one MEMS structure, wherein the acoustic coupling medium is configured to decouple an ultrasonic signal to be emitted from the at least one MEMS structure and/or to inject a received ultrasonic signal into the at least one MEMS structure. The acoustic coupling medium only partially covers the main surface of the at least one sensor chip.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 14, 2024
    Inventors: Klaus ELIAN, Christoph STEINER, Horst THEUSS
  • Patent number: 11921032
    Abstract: A method is disclosed. In one example, the method includes bonding a first panel of a first material to a base panel in a first gas atmosphere, wherein multiple hermetically sealed first cavities encapsulating gas of the first gas atmosphere are formed between the first panel and the base panel. The method further includes bonding a second panel of a second material to at least one of the base panel and the first panel, wherein multiple second cavities are formed between the second panel and the at least one of the base panel and the first panel.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: March 5, 2024
    Assignee: Infineon Technologies AG
    Inventor: Horst Theuss
  • Publication number: 20240058841
    Abstract: Device with ultrasonic transducer and method for manufacturing same. A device is provided, having an ultrasonic transducer, which includes a membrane and a cover element. A coupling medium entirely fills an interspace between the membrane and the cover element, and extends from the interspace into a reservoir space which communicates with the interspace.
    Type: Application
    Filed: August 7, 2023
    Publication date: February 22, 2024
    Inventors: Horst THEUSS, Klaus ELIAN
  • Patent number: 11899047
    Abstract: A current sensor system includes a magnetic field sensor including a chip plane, a first set of sensor elements sensitive to a first magnetic field component that is aligned in a first direction that is parallel to the chip plane, and a second set of sensor elements sensitive to a second magnetic field component that is aligned in a second direction that is perpendicular to the chip plane; and three conductor structures arranged in parallel to each other and configured to carry a current parallel or antiparallel to a third direction that is perpendicular to the first direction and to the second direction. The three conductor structures generate three magnetic fields based on the current flowing therethrough, where the three magnetic fields produce a first magnetic field distribution of the first magnetic field component and a second magnetic field distribution of the second magnetic field component.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: February 13, 2024
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Rainer Markus Schaller
  • Patent number: 11885736
    Abstract: A method is disclosed. In one example, the method includes bonding a first panel of a first material to a base panel in a first gas atmosphere, wherein multiple hermetically sealed first cavities encapsulating gas of the first gas atmosphere are formed between the first panel and the base panel. The method further includes bonding a second panel of a second material to at least one of the base panel and the first panel, wherein multiple second cavities are formed between the second panel and the at least one of the base panel and the first panel.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: January 30, 2024
    Assignee: Infineon Technologies AG
    Inventor: Horst Theuss
  • Patent number: 11876007
    Abstract: A method is provided for producing a hermetically sealed housing having a semiconductor component. The method comprises introducing a housing having a housing body and a housing cover into a process chamber. The housing cover closes off a cavity of the housing body and is attached in a gas-tight manner to the housing body. At least one opening is formed in the housing. At least one semiconductor component is arranged in the cavity. The method furthermore comprises generating a vacuum in the cavity by evacuating the process chamber, and also generating a predetermined gas atmosphere in the cavity and the process chamber. The method moreover comprises applying sealing material to the at least one opening while the predetermined gas atmosphere prevails in the process chamber.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: January 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Horst Theuss
  • Publication number: 20240002217
    Abstract: A method for producing sensor devices includes generating a semiconductor wafer having a plurality of sensor chips, wherein each sensor chip comprises a micro-electromechanical systems (MEMS) structure arranged at a main surface of the semiconductor wafer; forming a plurality of gas-permeable covers over the main surface of the semiconductor wafer, wherein each gas-permeable cover covers a corresponding MEMS structure of the MEMS structures and forms a cavity above the corresponding MEMS structure; and singulating the semiconductor wafer into a plurality of sensor devices.
    Type: Application
    Filed: September 15, 2023
    Publication date: January 4, 2024
    Inventors: Rainer Markus SCHALLER, Klaus ELIAN, Horst THEUSS
  • Patent number: 11860272
    Abstract: An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: January 2, 2024
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Christoph Steiner, Horst Theuss, Matthias Eberl, Fabian Merbeler
  • Patent number: 11795053
    Abstract: A sensor device includes a sensor chip with a micro-electromechanical systems (MEMS) structure, wherein the MEMS structure is arranged at a main surface of the sensor chip, and a gas-permeable cover arranged over the main surface of the sensor chip, which covers the MEMS structure and forms a cavity above the MEMS structure.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: October 24, 2023
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Klaus Elian, Horst Theuss
  • Patent number: 11784144
    Abstract: A semiconductor device comprises a first semiconductor chip, a first planar waveguide transmission line arranged within a BEOL metal stack of the first semiconductor chip, wherein the first planar waveguide transmission line comprises line sections situated opposite one another, and a second planar waveguide transmission line arranged over the first semiconductor chip and electrically coupled to the first planar waveguide transmission line, wherein the second planar waveguide transmission line comprises line sections situated opposite one another.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: October 10, 2023
    Assignee: Infineon Technologies AG
    Inventor: Horst Theuss
  • Publication number: 20230315235
    Abstract: An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.
    Type: Application
    Filed: March 23, 2023
    Publication date: October 5, 2023
    Inventors: Klaus ELIAN, Matthias EBERL, Horst THEUSS, Rainer Markus SCHALLER, Fabian MERBELER
  • Patent number: 11686667
    Abstract: A photoacoustic sensor includes a first layer with an optical MEMS emitter; a second layer stacked over the first layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are offset laterally with respect to one another; and a third layer stacked over the second layer with a cavity for a reference gas. The optical MEMS emitter transmits optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is outside the course of the optical path.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: June 27, 2023
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Rainer Markus Schaller
  • Publication number: 20230168318
    Abstract: A sensor device contains a first magnetic field sensor chip having a first sensor element. The first magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the first sensor element. The sensor device contains a second magnetic field sensor chip having a second sensor element. The second magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the second sensor element. The sensor device contains a current conductor configured to carry a measurement current that induces a magnetic field at the locations of the sensor elements. The magnetic field sensor chips and the current conductor are arranged relative to one another in such a way that an influence of a homogeneous magnetic stray field on the first components is compensated for upon difference formation or summation applied to the first components.
    Type: Application
    Filed: November 17, 2022
    Publication date: June 1, 2023
    Inventors: Horst THEUSS, Rainer Markus SCHALLER
  • Patent number: 11655143
    Abstract: A method for producing a semiconductor component is proposed. The method includes providing a housing. At least one semiconductor chip is arranged in a cavity of the housing. Furthermore, an electrical contact of the semiconductor chip is connected to an electrical contact of the housing via a bond wire. The method furthermore includes applying a protective material on the electrical contact of the housing and also on a region of the bond wire which is adjacent to the electrical contact of the housing. Moreover, the method also includes filling at least one partial region of the cavity with a gel.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: May 23, 2023
    Assignee: Infineon Technologies AG
    Inventors: Mathias Vaupel, Bernhard Knott, Horst Theuss
  • Publication number: 20230152448
    Abstract: An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.
    Type: Application
    Filed: November 8, 2022
    Publication date: May 18, 2023
    Inventors: Klaus ELIAN, Christoph STEINER, Horst THEUSS, Matthias EBERL, Fabian MERBELER
  • Patent number: 11652084
    Abstract: A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the die pad, forming electrical connections between the die and the bond pads, encapsulating the die and the electrical connections with an electrically insulating mold compound, removing portions of the panel, and exposing the die pad and the bond pads after encapsulating the die.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: May 16, 2023
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Meyer, Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss, Peter Scherl