Patents by Inventor Horst Theuss

Horst Theuss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRESSED DECOUPLED MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR
    Publication number: 20200002159
    Abstract: A semiconductor device may include a stress decoupling structure to at least partially decouple a first region of the semiconductor device and a second region of the semiconductor device. The stress decoupling structure may include a set of trenches that are substantially perpendicular to a main surface of the semiconductor device. The first region may include a micro-electro-mechanical (MEMS) structure. The semiconductor device may include a sealing element to at least partially seal openings of the stress decoupling structure.
    Type: Application
    Filed: June 29, 2018
    Publication date: January 2, 2020
    Inventors: Horst THEUSS, Bernhard Knott, Thoralf Kautzsch, Mirko Vogt, Maik Stegemann, Andre Roeth, Marco Haubold, Heiko Froehlich, Wolfram Langheinrich, Steffen Bieselt
  • Transducer package with integrated sealing
    Patent number: 10519030
    Abstract: A package which comprises a carrier, a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal, a package housing at least partially housing at least one of the carrier and the transducer, and a sealing which forms at least part of the package housing for sealing between the package and a package-external body.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: December 31, 2019
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Franz Gabler, Thomas Mueller, Horst Theuss, Mathias Vaupel
  • Laminate package of chip on carrier and in cavity
    Patent number: 10522433
    Abstract: A package which comprises a chip carrier made of a first material, a body made of a second material differing from the first material and being arranged on the chip carrier so as to form a cavity, a semiconductor chip arranged at least partially in the cavity, and a laminate encapsulating at least one of at least part of the chip carrier, at least part of the body and at least part of the semiconductor chip.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: December 31, 2019
    Assignee: Infineon Technologies AG
    Inventors: Juergen Hoegerl, Horst Theuss, Gottfried Beer
  • Package with component connected at carrier level
    Patent number: 10515879
    Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: December 24, 2019
    Assignee: Infineon Technologies AG
    Inventors: Manfred Schindler, Klaus Elian, Volker Strutz, Horst Theuss, Michael Weber
  • Photoacoustic gas sensor device and a method for analyzing gas
    Patent number: 10495612
    Abstract: A photoacoustic gas sensor device for analyzing gas includes an emitter module and a pressure-sensitive module. The emitter module is arranged on a carrier substrate and emits light pulses. The pressure-sensitive module is arranged on the carrier substrate within a reference gas volume. The reference gas volume is separated from a volume intended to be filled with a gas to be analyzed. Further, the pressure-sensitive module generates a sensor signal indicating information on an acoustic wave caused by light pulses emitted by the emitter module interacting with a reference gas within the reference gas volume. Additionally, the emitter module is arranged so that light pulses emitted by the emitter module reach the reference gas volume after crossing the volume intended to be filled with the gas to be analyzed.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: December 3, 2019
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Stefan Kolb, Horst Theuss
  • WAFER ARRANGEMENT
    Publication number: 20190323947
    Abstract: Shown is a wafer arrangement for a gas sensor including a first substrate and a sescond substrate. The first substrate includes a MEMS membrane associated with a sensor element and an emitter element configured to emit electromagnetic radiation. The second substrate is arranged on top of the first substrate and defines at least a portion of a chamber disposed adjacent to the MEMS membrane.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 24, 2019
    Inventors: Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Horst Theuss, Wilhelm Wiedmeier, Juergen Woellenstein
  • Integrated photo-acoustic gas sensor module
    Patent number: 10451543
    Abstract: A photo-acoustic gas sensor is disclosed. The photo-acoustic gas sensor includes a substrate, a light emitter unit supported by the substrate, the light emitter unit including a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit supported by the substrate, the detector unit including a microphone, wherein the beam of light pulses traverses an area intended to accommodate the gas and the microphone can receive a signal oscillating with the repetition frequency.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: October 22, 2019
    Assignee: Infineon Technologies AG
    Inventors: Thomas Mueller, Horst Theuss, Klaus Elian, Rainer Markus Schaller, Stefan Kolb
  • Implantable vessel fluid sensor
    Patent number: 10433736
    Abstract: An implantable vessel fluid sensor is configured to sense at least one vessel fluid parameter of a vessel. The implantable vessel fluid sensor includes a tubular body having a first end portion. The first end portion is configured to be inserted into and to form a sealed junction with an open vessel end of the vessel. The implantable vessel fluid sensor further includes a sensor unit connected to the tubular body. The sensor unit includes a sensor region configured to be in direct contact with the vessel fluid in a sealed junction state. A minimum distance between the sensor region and the first end portion is at most 10 times an outer diameter of the first end portion of the tubular body.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: October 8, 2019
    Assignee: Infineon Technologies AG
    Inventors: Kamil Karlovsky, Bernhard Goller, Dirk Hammerschmidt, Horst Theuss, Carsten von Koblinski
  • PACKAGES FOR MICROELECTROMECHANICAL SYSTEM (MEMS) MIRROR AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20190293923
    Abstract: A microelectromechanical system (MEMS) package assembly and a method of manufacturing the same are provided for Light Detection and Ranging (LIDAR) systems. A MEMS package assembly includes a MEMS chip including a front-side surface and a back-side surface, the MEMS chip further including a LIDAR MEMS mirror configured to receive light and reflect the light as reflected light; and a cavity cap disposed on the front-side surface of the MEMS chip and forms a cavity that surrounds the LIDAR MEMS mirror such that the LIDAR MEMS mirror is sealed from an environment, the cavity cap having an asymmetrical shape such that a transmission surface of the cavity cap, through which the light and the reflected light is transmitted, is tilted at a tilt angle with respect to the front-side surface of the MEMS chip.
    Type: Application
    Filed: April 23, 2018
    Publication date: September 26, 2019
    Applicant: Infineon Technologies AG
    Inventors: Cyrus GHAHREMANI, Horst THEUSS
  • PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR PRODUCING PACKAGED SEMICONDUCTOR DEVICES
    Publication number: 20190270636
    Abstract: A packaged semiconductor device comprises a semiconductor chip and a semiconductor package.
    Type: Application
    Filed: February 27, 2019
    Publication date: September 5, 2019
    Inventors: Rainer Markus Schaller, Horst Theuss
  • Gas sensor
    Patent number: 10365208
    Abstract: Shown is a gas sensor including a sensor element, a measurement chamber and an emitter element. The sensor element has a MEMS membrane which is arranged in a first substrate region. Furthermore, the measurement chamber is embodied to receive a measurement gas.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: July 30, 2019
    Assignees: Infineon Technologies AG, Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
    Inventors: Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Horst Theuss, Wilhelm Wiedmeier, Juergen Woellenstein
  • SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS COPPER AND ASSOCIATED PRODUCTION METHODS
    Publication number: 20190221533
    Abstract: A semiconductor device includes a semiconductor chip, an electrical connection element for electrically connecting the semiconductor device to a carrier, and a metallization adjoining the electrical connection element, the metallization contains porous nanocrystalline copper that contains portions of organic acids.
    Type: Application
    Filed: January 14, 2019
    Publication date: July 18, 2019
    Applicant: Infineon Technologies AG
    Inventors: Horst THEUSS, Rudolf BERGER, Walter HARTNER, Veronika HUBER, Werner ROBL
  • HERMETICALLY SEALED HOUSING WITH A SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING THEREOF
    Publication number: 20190131154
    Abstract: A method is provided for producing a hermetically sealed housing having a semiconductor component. The method comprises introducing a housing having a housing body and a housing cover into a process chamber. The housing cover closes off a cavity of the housing body and is attached in a gas-tight manner to the housing body. At least one opening is formed in the housing. At least one semiconductor component is arranged in the cavity. The method furthermore comprises generating a vacuum in the cavity by evacuating the process chamber, and also generating a predetermined gas atmosphere in the cavity and the process chamber. The method moreover comprises applying sealing material to the at least one opening while the predetermined gas atmosphere prevails in the process chamber.
    Type: Application
    Filed: October 12, 2018
    Publication date: May 2, 2019
    Inventors: Rainer Markus SCHALLER, Horst THEUSS
  • SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME
    Publication number: 20190106321
    Abstract: A method for producing a semiconductor component is proposed. The method includes providing a housing. At least one semiconductor chip is arranged in a cavity of the housing. Furthermore, an electrical contact of the semiconductor chip is connected to an electrical contact of the housing via a bond wire. The method furthermore includes applying a protective material on the electrical contact of the semiconductor chip and also on a region of the bond wire which is adjacent to the electrical contact of the semiconductor chip, and/or on the electrical contact of the housing and also on a region of the bond wire which is adjacent to the electrical contact of the housing. Moreover, the method also includes filling at least one partial region of the cavity with a gel.
    Type: Application
    Filed: September 26, 2018
    Publication date: April 11, 2019
    Applicant: Infineon Technologies AG
    Inventors: Mathias VAUPEL, Bernhard KNOTT, Horst THEUSS
  • Photo-acoustic gas sensor module having light emitter and detector units
    Patent number: 10241088
    Abstract: A photo-acoustic gas sensor includes a light emitter unit having a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and a wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit having a microphone. The light emitter unit is arranged so that the beam of light pulses traverses an area configured to accommodate the gas. The detector unit is arranged so that the microphone can receive a signal oscillating with the repetition frequency.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: March 26, 2019
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Gottfried Beer, Sebastian Beer, Alfons Dehe, Franz Jost, Stefan Kolb, Guenther Ruhl, Rainer Markus Schaller
  • LOW PROFILE TRANSDUCER MODULE
    Publication number: 20190039882
    Abstract: A transducer structure is disclosed. The transducer structure may include a substrate with a MEMS structure located on a first side of the substrate and a lid coupled to the first side of the substrate and covering the MEMS structure. The substrate may include an electric contact which is laterally displaced from the lid on the first side of the substrate and electrically coupled to the MEMS structure.
    Type: Application
    Filed: October 11, 2018
    Publication date: February 7, 2019
    Inventors: Horst Theuss, Alfons Dehe
  • PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WITHIN A HOUSING
    Publication number: 20180364123
    Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
    Type: Application
    Filed: August 28, 2018
    Publication date: December 20, 2018
    Applicant: Infineon Technologies AG
    Inventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
  • PACKAGE WITH COMPONENT CONNECTED AT CARRIER LEVEL
    Publication number: 20180350727
    Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 6, 2018
    Applicant: Infineon Technologies AG
    Inventors: Manfred Schindler, Klaus Elian, Volker Strutz, Horst Theuss, Michael Weber
  • Low profile transducer module
    Patent number: 10138115
    Abstract: A transducer structure is disclosed. The transducer structure may include a substrate with a MEMS structure located on a first side of the substrate and a lid coupled to the first side of the substrate and covering the MEMS structure. The substrate may include an electric contact which is laterally displaced from the lid on the first side of the substrate and electrically coupled to the MEMS structure.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: November 27, 2018
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Alfons Dehe
  • MEMS device
    Patent number: 10125012
    Abstract: A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main surface on which a first set of contact pads for contacting the MEMS device and a second set of contact pads for contacting the first chip are arranged. The first chip is mechanically attached and electrically connected to the second set of contact pads via the mounting surface facing the main surface. The mounting surface of the first chip is at least 25% smaller than the main surface of the MEMS chip.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: November 13, 2018
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Horst Theuss