Patents by Inventor Horst Theuss

Horst Theuss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a protective coating for a packaged semiconductor device
    Patent number: 10118816
    Abstract: A packaged includes a flip-chip assembly. The flip-chip assembly includes a first semiconductor substrate having at least one integrated semiconductor device, and a second substrate connected to the first substrate. A main surface of the first semiconductor substrate faces and is spaced apart from the second substrate. The packaged semiconductor device further includes a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate. A first section of the main surface is exposed from the parylene coating.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: November 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Horst Theuss
  • Implantable device and implantable system comprising the same
    Patent number: 10117621
    Abstract: An implantable device includes a body part and a piezoelectric part. The body part is configured to grasp a pulsatile organic or inorganic tissue. The piezoelectric part is mechanically coupled to the body part and is configured to convert a varying shear force transferred from the body part to the piezoelectric part into voltage. An implantable system, comprises the implantable device and a stent like object configured to be inserted and deployed within a pulsatile or static tissue. The implantable device is configured to form a sealed junction with the pulsatile tissue while pressing against an outer circumference area of the stent.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: November 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Jan Berger, Bernhard Wedl, Dirk Hammerschmidt, Walther Pachler, Horst Theuss, Harald Witschnig
  • GMR sensor within molded magnetic material employing non-magnetic spacer
    Patent number: 10107875
    Abstract: An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: October 23, 2018
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Martin Petz, Uwe Schindler, Horst Theuss, Adolf Koller
  • Sensor arrangement, battery cell and energy system
    Patent number: 10107867
    Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: October 23, 2018
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Jochen Dangelmaier, Franz Michael Darrer, Thomas Mueller, Mathias Vaupel, Manfred Fries, Guenther Ruhl, Horst Theuss, Matthias Rose, Stephan Auer, Tue Fatt David Wee, Sie Boo Chiang
  • MEMS SOUND TRANSDUCER ELEMENT AND METHOD FOR PRODUCING A MEMS SOUND TRANSDUCER ELEMENT
    Publication number: 20180295458
    Abstract: A method for producing a MEMS sound transducer element includes, inter alia, providing a first substrate. The first substrate has a first substrate side, an opposite second substrate side and a membrane layer arranged on the first substrate side. A further method step includes performing a first etching from the second substrate side in a first surface section that is situated opposite the membrane layer, as far as a first depth. A further method step includes performing a second etching of the first substrate from the second substrate side in a second surface section in order to expose the membrane layer in the first surface section and to produce a back volume for the membrane layer, where the second surface section is larger than the first surface section and includes the first surface section.
    Type: Application
    Filed: April 5, 2018
    Publication date: October 11, 2018
    Inventors: Matthias Steiert, Horst Theuss
  • Chip arrangement and a method for manufacturing the same
    Patent number: 10097918
    Abstract: In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: October 9, 2018
    Assignee: Infineon Technologies AG
    Inventors: Thomas Spoettl, Horst Theuss
  • Pressure sensor module having a sensor chip and passive devices within a housing
    Patent number: 10060819
    Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: August 28, 2018
    Assignee: Infineon Technologies AG
    Inventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
  • Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals
    Patent number: 9998812
    Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: June 12, 2018
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Horst Theuss, Thomas Mueller
  • Pre-mold for a microphone assembly and method of producing the same
    Patent number: 9986354
    Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: May 29, 2018
    Assignee: Infineon Technologies AG
    Inventors: Thomas Mueller, Horst Theuss, Stefan Uwe Schindler, Dominik Kohl, Jochen Dangelmaier
  • Insulated die
    Patent number: 9978720
    Abstract: An insulated chip comprising a semiconductor chip comprising at least one chip pad and an electrically insulating layer surrounding at least part of the semiconductor chip.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: May 22, 2018
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Gottfried Beer, Juergen Hoegerl
  • MEMS SENSOR PACKAGE SYSTEMS AND METHODS
    Publication number: 20180127267
    Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
    Type: Application
    Filed: January 8, 2018
    Publication date: May 10, 2018
    Inventors: Bernhard Winkler, Rainer Leuschner, Horst Theuss
  • Multi-die pressure sensor package
    Patent number: 9952110
    Abstract: A pressure sensor package includes a pressure sensor having a first side attached to a substrate and a second side opposite the first side, the first side having a pressure inlet aligned with an opening in the substrate, the second side having one or more electrical contacts. A logic die attached to an opposite side of the substrate as the pressure sensor is operable to process signals from the pressure sensor. First electrical conductors connect to the one or more electrical contacts of the pressure sensor. Second electrical conductors connect to one or more electrical contacts of the logic die. A mold compound completely encapsulates the second electrical conductors and at least partly encapsulates the logic die and the first electrical conductors. An open passage in the mold compound is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: April 24, 2018
    Assignee: Infineon Technologies AG
    Inventors: Sebastian Beer, Horst Theuss
  • Multi-Purpose Non-Linear Semiconductor Package Assembly Line
    Publication number: 20180096966
    Abstract: A method of producing packaged semiconductor devices includes providing a first packaging substrate panel. A second packaging substrate panel is provided. The first and second packaging substrate panels are moved through an assembly line that includes a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The second type packaged semiconductor device is different than the first type packaged semiconductor device. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner.
    Type: Application
    Filed: October 4, 2016
    Publication date: April 5, 2018
    Inventors: Thorsten Meyer, Gerald Ofner, Peter Scherl, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss
  • Magnetic sensor device comprising a ring-shaped magnet and a sensor chip in a common package
    Patent number: 9927498
    Abstract: In one implementation, a magnetic sensor device used for sensing a static or dynamic magnetic field includes a ring-shaped magnet, a sensor chip arranged in an opening of the ring-shaped magnet, and a leadframe, with the ring-shaped magnet and the sensor chip directly disposed on the leadframe. The sensor chip may further include a carrier with a stepwise configuration having two or more different planes with the ring-shaped magnet and the sensor chip disposed on different planes.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: March 27, 2018
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Horst Theuss, Alexander Spielbauer, Ingrid Bollmann
  • MEMS sensor package systems and methods
    Patent number: 9884757
    Abstract: Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: February 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Bernhard Winkler, Rainer Leuschner, Horst Theuss
  • Molded cavity package with embedded conductive layer and enhanced sealing
    Patent number: 9868632
    Abstract: A base plate with a first side having an elevated portion, a recessed portion laterally surrounding the elevated portion, and a vertical face extending from the recessed portion to the elevated portion is provided. At least a part of the vertical face is covered with a metal layer. A mold compound structure is formed on the first side with the metal layer disposed between the first side and the mold compound structure such that the mold compound structure includes an elevated portion laterally surrounding a recessed portion, and opposing edge faces that vertically extend from the recessed portion to the elevated portion. At least a part of the base plate is subsequently removed such that the recessed portion of the mold compound structure is uncovered from the base plate and such that the metal layer remains on at least one uncovered section of the mold compound structure.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: January 16, 2018
    Assignee: Infineon Technologies AG
    Inventors: Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Horst Theuss
  • Semiconductor component comprising magnetic field sensor
    Patent number: 9859332
    Abstract: The invention relates to a semiconductor component (100) comprising a semiconductor chip (10) configured as a wafer level package, a magnetic field sensor (11) being integrated into said semiconductor chip.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: January 2, 2018
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Albert Auburger
  • Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces
    Patent number: 9818665
    Abstract: In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: November 14, 2017
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Horst Theuss
  • Laminate package of chip on carrier and in cavity
    Publication number: 20170316994
    Abstract: A package which comprises a chip carrier made of a first material, a body made of a second material differing from the first material and being arranged on the chip carrier so as to form a cavity, a semiconductor chip arranged at least partially in the cavity, and a laminate encapsulating at least one of at least part of the chip carrier, at least part of the body and at least part of the semiconductor chip.
    Type: Application
    Filed: April 14, 2017
    Publication date: November 2, 2017
    Inventors: Juergen HOEGERL, Horst THEUSS, Gottfried BEER
  • Micromechanical semiconductor sensing device
    Patent number: 9790086
    Abstract: A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: October 17, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Joachim Mahler, Manfred Mengel