Patents by Inventor Hsien Cheng

Hsien Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240172347
    Abstract: A lighting device includes a driver, a first light string, a second light string, a constant current controller and a pulse width modulation controller. The driver is configured to provide a DC driving current to a shunt node. The first light string is electrically coupled between the shunt node and a ground terminal, and the first light string is driven by a first pulsating direct current. The second light string and the constant current controller are electrically coupled in series between the shunt node and the ground terminal. The pulse width modulation controller is configured to provide a pulse signal to the constant current controller, and the constant current controller controls a pulse frequency of a second pulsating direct current supplied for the second light string according to the pulse signal.
    Type: Application
    Filed: November 16, 2023
    Publication date: May 23, 2024
    Inventors: Chih-Hsien Wang, Kuan-Hsien Tu, Kai-Wei Chen, Ming-Chieh Cheng
  • Publication number: 20240161416
    Abstract: An augmented reality interaction system applied to a physical scene and comprising a server and a plurality of mobile devices is provided. The server stores a point cloud map corresponding to the physical scene, and one of the mobile devices uploads a physical image, role state variation data and local variation data to the server. The server compares the physical image with the point cloud map to generate orientation data of the mobile device in real time, and adjusts role data corresponding to a user according to the role state variation data and the local variation data. The server pushes the orientation data of the mobile device and the role data to the other mobile devices such that augmented reality images displayed by the other mobile devices are adjusted in real time according to the orientation data of the mobile device and the role data.
    Type: Application
    Filed: November 21, 2022
    Publication date: May 16, 2024
    Inventors: Hsien Cheng Liao, Jia Wei Hong
  • Publication number: 20240163407
    Abstract: A projection system and a control method thereof are provided. The projection system includes a projector. The projector comprises a projection module and a processor. The processor is electrically coupled to the projection module. The projector confirms whether a first triggering event is detected and turns on a sleep aid mode in response to the first triggering event. The sleep aid mode corresponds to at least one control parameter. In the sleep aid mode, the projection module plays at least one multimedia file according to the at least one control parameter. The processor adjusts at least one parameter value of the at least one control parameter to adjust the at least one multimedia file correspondingly. The projector confirms whether a second triggering event is detected and the projection module stops playing the at least one multimedia file and turns off the sleep aid mode in response to the second triggering event.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 16, 2024
    Applicant: Optoma Corporation
    Inventors: Yuan-Mao Tsui, Hsien-Cheng Yuan, Chia-Chien Wu, Wei-Jung Wang
  • Publication number: 20240159476
    Abstract: A heat transferring device and a heat transferring component thereof are disclosed. The heat transferring device includes a heat transferring component, a lower plate, a positioning component and at least one support rod. The heat transferring component is in a shape of pouch and includes input end and an output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on and surrounding an exterior of the heat transferring component to restrict the shape and a position of the heat transferring component, wherein an end of the sleeve is connected to the lower plate. The support rod is connected to the lower plate. The heat transferring component further includes at least one protrusion on the periphery, and the protrusion is fixed on the support rod or the sleeve through at least one fastener.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Inventors: Wei-Pin Lo, Wen-Yen Huang, Chin-Hsien Cheng
  • Publication number: 20240162349
    Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Inventors: Chung-Chiang Wu, Po-Cheng Chen, Kuo-Chan Huang, Hung-Chin Chung, Hsien-Ming Lee, Chien-Hao Chen
  • Patent number: 11984485
    Abstract: A semiconductor device includes a substrate, a gate structure on the substrate, a source/drain (S/D) region and a contact. The S/D region is located in the substrate and on a side of the gate structure. The contact lands on and connected to the S/D region. The contact wraps around the S/D region.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hsien Cheng, Jr-Hung Li, Tai-Chun Huang, Tze-Liang Lee, Chung-Ting Ko, Jr-Yu Chen, Wan-Chen Hsieh
  • Publication number: 20240152273
    Abstract: A memory management method for continuously recording digital content and a circuit system operating the method are provided. The circuit system includes a control circuit, a memory, and a storage device. The memory has a buffer that is defined as a pre-buffer or a main buffer based on a current recording mode. In the method, the circuit system loads continuously-received data and sequentially saves the data in the buffer that is defined as the pre-buffer in a first-in-first-out manner before a start-record instruction is received. After the start-record instruction is received, the data buffered in the pre-buffer is combined with the data that is continuously recorded to the main buffer. This file is then written to the storage device until a stop-record instruction is received.
    Type: Application
    Filed: October 11, 2023
    Publication date: May 9, 2024
    Inventors: Yu-Cheng Lee, Hsien-Yang Chiang
  • Patent number: 11978740
    Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Harry-Hak-Lay Chuang, Kuo-Ching Huang, Wei-Cheng Wu, Hsin Fu Lin, Henry Wang, Chien Hung Liu, Tsung-Hao Yeh, Hsien Jung Chen
  • Publication number: 20240140782
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: PO CHEN YEH, YI-HSIEN CHANG, FU-CHUN HUANG, CHING-HUI LIN, CHIAHUNG LIU, SHIH-FEN HUANG, CHUN-REN CHENG
  • Patent number: 11974367
    Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: April 30, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chih-Hsien Wang, Ming-Chieh Cheng, Po-Yen Chen, Shih-Chieh Chang, Kuan-Hsien Tu, Xiu-Yi Lin, Ling-Chun Wang
  • Publication number: 20240136346
    Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.
    Type: Application
    Filed: April 17, 2023
    Publication date: April 25, 2024
    Inventors: Chien Hung LIU, Yu-Sheng CHEN, Yi Ching ONG, Hsien Jung CHEN, Kuen-Yi CHEN, Kuo-Ching HUANG, Harry-HakLay CHUANG, Wei-Cheng WU, Yu-Jen WANG
  • Publication number: 20240135745
    Abstract: An electronic device has a narrow viewing angle state and a wide viewing angle state, and includes a panel and a light source providing a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, the second relative light intensity is 50% of the strongest light intensity, the first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°. In the narrow angle state, a third relative light intensity at each angle between 20° and 60° or each angle between ?20° and ?60° is lower than 20% of the strongest light intensity.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Applicant: InnnoLux Corporation
    Inventors: Kuei-Sheng Chang, Po-Yang Chen, Kuo-Jung Wu, I-An Yao, Wei-Cheng Lee, Hsien-Wen Huang
  • Patent number: 11967563
    Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen
  • Publication number: 20240126023
    Abstract: An optical fiber connector includes a connecting unit, an adapter unit, and an attenuation unit. The adapter unit includes an insertion seat connected removably to a main housing of the connecting unit, and two guide frame bodies located respectively at two opposite sides of the insertion seat in a transverse direction. The insertion seat has two insertion holes spaced apart in the transverse direction and extending in a front-rear direction. Each guide frame body extends in the front-rear direction away from the connecting unit. The attenuation unit includes two attenuation components, two rear ferrules, and two front ferrules. The attenuation components are arranged in the transverse direction and disposed within the main housing. The rear ferrules respectively extend rearwardly from rear ends of the attenuation components into the insertion holes. The front ferrules respectively extend forwardly from front ends of the attenuation components through and outwardly of the main housing.
    Type: Application
    Filed: January 19, 2023
    Publication date: April 18, 2024
    Inventors: Hsien-Hsin HSU, Yu Cheng CHEN, Ke Xue NING, Shu Bin LI
  • Publication number: 20240121935
    Abstract: Methods for fabricating semiconductor structures are provided. An exemplary method includes forming a first transistor structure and a second transistor structure over a substrate, wherein each transistor structure includes at least one nanosheet. The method further includes depositing a metal over each transistor structure and around each nanosheet; depositing a coating over the metal; depositing a mask over the coating; and patterning the mask to define a patterned mask, wherein the patterned mask lies over a masked portion of the coating and the second transistor structure, and wherein the patterned mask does not lie over an unmasked portion of the coating and the first transistor structure. The method further includes etching the unmasked portion of the coating and the metal over the first transistor structure using a dry etching process with a process pressure of from 30 to 60 (mTorr).
    Type: Application
    Filed: January 18, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Y.L. Cheng, Tzu-Wen Pan, Yu-Hsien Lin, Ryan Chia-Jen Chen
  • Patent number: 11956541
    Abstract: A control method of a driving mechanism is provided, including: the driving mechanism provides a first electrical signal from a control assembly to the driving mechanism to move the movable portion into an initial position relative to the fixed portion, wherein the control assembly includes a control unit and a position sensing unit; the status signal of an inertia sensing unit is read; the control unit sends the status signal to the control unit to calculate a target position; the control unit provides a second electrical signal to the driving assembly according to the target position for driving the driving assembly; a position signal is sent from the position sensing unit to the control unit; the control unit provides a third electric signal to the driving assembly to drive the driving assembly according the position signal.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: April 9, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chen-Hsien Fan, Sung-Mao Tsai, Yueh-Lin Lee, Yu-Chiao Lo, Mao-Kuo Hsu, Ching-Chieh Huan, Yi-Chun Cheng
  • Patent number: 11955444
    Abstract: Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first conductive structure disposed within a first layer of the semiconductor structure. The semiconductor structure includes a dielectric structure disposed within a second layer of the semiconductor structure, with the second layer being disposed on the first layer. The semiconductor structure includes a second conductive structure disposed within a recessed portion of the dielectric structure that extends to the first conductive structure, with the second conductive structure having a concave recessed portion on a top surface of the second conductive structure. The semiconductor structure includes multiple layers of conductive material disposed within the concave recessed portion of the second conductive structure.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Manikandan Arumugam, Tsung-Yi Yang, Chien-Chih Chen, Mu-Han Cheng, Kuo-Hsien Cheng
  • Patent number: 11955960
    Abstract: The invention uses the control circuit formed on the silicon wafer to detect the leakage current of transistor formed on the depletion mode GaN wafer and then adjust the gate voltage of the depletion mode GaN transistor according to the detected leakage current. Essentially, the gate voltage is reduced or viewed as made more negative when the detected leakage current is larger a specific value. Thus, the gate voltage can be gradually adjusted to approach a specific threshold voltage that right block the leakage current. In other words, by making the gate voltage more negative when non-zero leakage current is detected and even by making the gate voltage more positive when zero leakage current is detected, the depletion mode GaN transistor can be adjusted to have an acceptable or even zero leakage current, a high reaction rate and an optimized efficiency.
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: April 9, 2024
    Assignee: CHIP-GAN POWER SEMICONDUCTOR CORPORATION
    Inventors: Ke-Horng Chen, Tzu-Hsien Yang, Yong-Hwa Wen, Kuo-Lin Cheng
  • Patent number: 11956869
    Abstract: A display driver circuit for controlling a display panel having a plurality of light-emission diode (LED) strings includes a plurality of current regulators and a control circuit. Each of the plurality of current regulators is configured to control one of the plurality of LED strings. The control circuit, coupled to the plurality of current regulators, is configured to generate a plurality of pulses in a plurality of pulse width modulation (PWM) signals and output each of the plurality of PWM signals to a respective current regulator among the plurality of current regulators. Wherein, the plurality of pulses are scrambled.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: April 9, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Chih-Hsien Chou, Jhih-Siou Cheng, Jin-Yi Lin, Ren-Chieh Yang
  • Patent number: 11954779
    Abstract: An animation generation method for tracking a facial expression and a neural network training method thereof are provided. The animation generation method for tracking a facial expression includes: driving a first role model according to an expression parameter set to obtain a virtual expression image corresponding to the expression parameter set; applying a plurality of real facial images to the virtual expression image corresponding to the facial expression respectively to generate a plurality of real expression images; training a tracking neural network according to the expression parameter set and the real expression images; inputting a target facial image to the trained tracking neural network to obtain a predicted expression parameter set; and using the predicted expression parameter set to control a second role model.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: April 9, 2024
    Assignee: DIGITAL DOMAIN ENTERPRISES GROUP LIMITED
    Inventors: Chin-Yu Chien, Yu-Hsien Li, Yi-Chi Cheng