Patents by Inventor Hsien Ming

Hsien Ming has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11986285
    Abstract: A disease diagnosing method and a disease diagnosing system are provided in the disclosure. The disease diagnosing method includes: obtaining continuous images of a body skin and generating a time domain signal according to an average pixel value of a region of interest in each frame of the continuous images; transforming the time domain signal to a frequency domain signal and combining the time domain signal and the frequency domain signal to a time frequency signal; retrieving multiple first features of a first high dimensional space of the time frequency signal to obtain multiple second features of a second high dimensional space; and use the second features as feature vectors to map to a high dimension feature space, and classifying the second features as one of the multiple categories of a disease corresponding to the region of interest in the body skin according to a hyperplane of the high dimension feature space.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: May 21, 2024
    Assignee: National Taiwan University
    Inventors: Hao-Ming Hsiao, Hsien-Li Kao, Mao-Shin Lin, Chung-Yuan Hsu
  • Publication number: 20240162349
    Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Inventors: Chung-Chiang Wu, Po-Cheng Chen, Kuo-Chan Huang, Hung-Chin Chung, Hsien-Ming Lee, Chien-Hao Chen
  • Publication number: 20240151623
    Abstract: A method of assessing a bodily fluid sample on a test strip may involve applying a periodic signal with a first electrode located at a first location in a microfluidic channel of the test strip, monitoring the applied periodic signal with a second electrode located at a second location in the microfluidic channel, and using a third electrode located at a third location in the microfluidic channel as a reference electrode. The method may also include: collecting the bodily fluid sample in the microfluidic channel; continuing to apply the periodic signal, monitor the periodic signal and use the third electrode as a reference electrode while collecting the bodily fluid sample; and determining that the bodily fluid sample is sufficient for analyzing, based at least in part on the applied and monitored periodic signal.
    Type: Application
    Filed: May 31, 2023
    Publication date: May 9, 2024
    Inventors: Efstratios Skafidas, Hsien Ming, You Liang, Duc Huynh, Thanh Nguyen, Michael Erlichster
  • Publication number: 20240138723
    Abstract: A test strip for sampling a bodily fluid may include multiple layers of a substrate material, an adhesive between at least some of the multiple layers, and a microfluidic channel formed between at least some of the multiple layers. The test strip may further include multiple electrodes on one of the multiple layers, positioned and partially exposed within the microfluidic channel, an additional material positioned at or near an entrance to the microfluidic channel, to selectively limit the flow of at least one of bubbles or debris into the microfluidic channel, and at least one exit port in at least one of the multiple layers to allow for release of pressure from the test strip. In some embodiments, the test strip is a saliva analysis test strip. In some embodiments, the test strip includes multiple exit ports to prevent blockage of sample flow.
    Type: Application
    Filed: May 31, 2023
    Publication date: May 2, 2024
    Inventors: Thanh Cong Nguyen, Efstratios Skafidas, Duc Hau Huynh, Michael Erlichster, Duc Phuong Nguyen, Hsien Ming, Gursharan Chana, Ting Ting Lee, Chathurika Darshani Abeyrathne, You Liang, Trevor John Kilpatrick, Michael Luther, Alan Dayvault Luther
  • Patent number: 11961768
    Abstract: A method includes forming a first transistor, which includes forming a first gate dielectric layer over a first channel region in a substrate and forming a first work-function layer over the first gate dielectric layer, wherein forming the first work-function layer includes depositing a work-function material using first process conditions to form the work-function material having a first proportion of different crystalline orientations and forming a second transistor, which includes forming a second gate dielectric layer over a second channel region in the substrate and forming a second work-function layer over the second gate dielectric layer, wherein forming the second work-function layer includes depositing the work-function material using second process conditions to form the work-function material having a second proportion of different crystalline orientations.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ya-Wen Chiu, Da-Yuan Lee, Hsien-Ming Lee, Kai-Cyuan Yang, Yu-Sheng Wang, Chih-Hsiang Fan, Kun-Wa Kuok
  • Patent number: 11921001
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: March 5, 2024
    Assignee: Hiwin Technologies Corp.
    Inventors: Hsien-Yu Chen, Yu-Sheng Chiu, Chih-Chun Cheng, Wen-Nan Cheng, Chi-Ming Liu
  • Patent number: 11916146
    Abstract: A device includes a semiconductor fin, and a gate stack on sidewalls and a top surface of the semiconductor fin. The gate stack includes a high-k dielectric layer, a work-function layer overlapping a bottom portion of the high-k dielectric layer, and a blocking layer overlapping a second bottom portion of the work-function layer. A low-resistance metal layer overlaps and contacts the work-function layer and the blocking layer. The low-resistance metal layer has a resistivity value lower than second resistivity values of both of the work-function layer and the blocking layer. A gate spacer contacts a sidewall of the gate stack.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Chiang Wu, Po-Cheng Chen, Kuo-Chan Huang, Hung-Chin Chung, Hsien-Ming Lee, Chien-Hao Chen
  • Publication number: 20240055377
    Abstract: The present disclosure provides a method of processing a semiconductor structure. The method includes: placing a first semiconductor structure inside a semiconductor processing apparatus; supplying a solution, wherein the solution is directed toward a surface of the first semiconductor structure, and the solution includes a solvent and a resist; rotating the first semiconductor structure to spread the solution over the surface of the first semiconductor structure; forming a resist layer on the surface of the first semiconductor structure using the resist in the solution; and removing a portion of the solvent from the solution by an exhaust fan disposed adjacent to a periphery of the first semiconductor structure.
    Type: Application
    Filed: October 27, 2023
    Publication date: February 15, 2024
    Inventors: CHANG-PIN HUANG, TUNG-LIANG SHAO, HSIEN-MING TU, CHING-JUNG YANG, YU-CHIA LAI
  • Patent number: 11875591
    Abstract: A fingerprint identification module includes a light guiding member, a flexible circuit board, two light emitting members, and a fingerprint identification chip. The light guiding member includes a bottom and a protruding edge. The protruding edge surrounds to form a first space. A first through-hole is formed on the bottom. The flexible circuit board is disposed in the first space and has a first portion, a second portion, a third portion, and a fourth portion connected in sequence. The first portion goes out of the light guiding member through the first through-hole. The third portion faces a direction opposite to the bottom. The second portion and the fourth portion face the bottom of the light guiding member. The light emitting members are disposed on the flexible circuit board and face the light guiding member. The fingerprint identification chip is disposed on the third portion of the flexible circuit board.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: January 16, 2024
    Assignee: MIYABI TECHNOLOGY CO., LTD.
    Inventors: Hsien-Ming Lee, Tsung-Yi Lu
  • Patent number: 11857592
    Abstract: This invention relates to a method of treating Attention-Deficit Hyperactivity Disorder by orally administering to a subject a composition containing a Radix Polygalae (Polygala tenuifolia Willd) extract (such as PDC-1421). A solid dosage form of the composition can be prepared into the gelatin capsule. The oral administration of the composition in healthy volunteers was safe and well-tolerated for the daily dose from 380 mg to 3800 mg. The composition can be administered chronically over at least 25 days; the daily dose is administered once per day, twice per day, or three times per day, wherein each dose is 380-760 mg of the botanical extract.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: January 2, 2024
    Assignee: BIOLITE, INC.
    Inventors: Chi-Hsin Richard King, Hsien-Ming Wu, Howard Doong, Tsung-Shann Jiang
  • Patent number: 11837562
    Abstract: Present disclosure provides a semiconductor structure and a method for fabricating a semiconductor structure. The semiconductor structure includes a substrate, a conductive layer in the substrate, a conductive bump over the substrate and electrically coupled to the conductive layer, and a dielectric stack, including a polymer layer laterally surrounding the conductive bump and including a portion spaced from a nearest outer edge of the conductive bump with a gap, wherein a first thickness of the polymer layer in a first region is greater than a second thickness of the polymer layer in a second region adjacent to the first region, a first bottom surface of the polymer layer in the first region is leveled with a second bottom surface of the polymer layer in the second region, and a dielectric layer underneath the polymer layer.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: December 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai
  • Publication number: 20230386926
    Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.
    Type: Application
    Filed: August 2, 2023
    Publication date: November 30, 2023
    Inventors: Chia-Ching Lee, Hsin-Han Tsai, Shih-Hang Chiu, Tsung-Ta Tang, Chung-Chiang Wu, Hung-Chin Chung, Hsien-Ming Lee, Da-Yuan Lee, Jian-Hao Chen, Chien-Hao Chen, Kuo-Feng Yu, Chia-Wei Chen, Chih-Yu Hsu
  • Publication number: 20230387003
    Abstract: A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Inventors: Shih-Wei LIANG, Hung-Yi KUO, Hao-Yi TSAI, Ming-Hung TSENG, Hsien-Ming TU
  • Publication number: 20230369132
    Abstract: The present disclosure provides a semiconductor device with a profiled work-function metal gate electrode. The semiconductor structure includes a metal gate structure formed in an opening of an insulating layer. The metal gate structure includes a gate dielectric layer, a barrier layer, a work-function metal layer between the gate dielectric layer and the barrier layer and a work-function adjustment layer over the barrier layer, wherein the work-function metal has an ordered grain orientation. The present disclosure also provides a method of making a semiconductor device with a profiled work-function metal gate electrode.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Inventors: Da-Yuan LEE, Hung-Chin CHUNG, Hsien-Ming LEE, Kuan-Ting LIU, Syun-Ming JANG, Weng CHANG, Wei-Jen LO
  • Patent number: 11804409
    Abstract: The present disclosure provides a semiconductor device with a profiled work-function metal gate electrode. The semiconductor structure includes a metal gate structure formed in an opening of an insulating layer. The metal gate structure includes a gate dielectric layer, a barrier layer, a work-function metal layer between the gate dielectric layer and the barrier layer and a work-function adjustment layer over the barrier layer, wherein the work-function metal has an ordered grain orientation. The present disclosure also provides a method of making a semiconductor device with a profiled work-function metal gate electrode.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: October 31, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Da-Yuan Lee, Hung-Chin Chung, Hsien-Ming Lee, Kuan-Ting Liu, Syun-Ming Jang, Weng Chang, Wei-Jen Lo
  • Publication number: 20230343648
    Abstract: An improved work function layer and a method of forming the same are disclosed. In an embodiment, the method includes forming a semiconductor fin extending from a substrate; depositing a dielectric layer over the semiconductor fin; depositing a first work function layer over the dielectric layer; and exposing the first work function layer to a metastable plasma of a first reaction gas, a metastable plasma of a generation gas, and a metastable plasma of a second reaction gas, the first reaction gas being different from the second reaction gas.
    Type: Application
    Filed: June 30, 2023
    Publication date: October 26, 2023
    Inventors: Shao-Jyun Wu, Hung-Chi Wu, Chia-Ching Lee, Pin-Hsuan Yeh, Hung-Chin Chung, Hsien-Ming Lee, Chien-Hao Chen, Sheng-Liang Pan, Huan-Just Lin
  • Publication number: 20230335613
    Abstract: Provided is a semiconductor device including a first transistor of a first type comprising a first work function layer, the first work function layer comprising a first underlying layer; and a second transistor of the first type comprising a second work function layer, the second work function layer comprising a second underlying layer. The first and second underlying layers each comprises a metal nitride layer with at least two kinds of metals, and a thickness of the first underlying layer is greater than a thickness of the second underlying layer. A method of manufacturing a gate structure for a semiconductor device is also provided.
    Type: Application
    Filed: June 19, 2023
    Publication date: October 19, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jui-Fen Chien, Hsiao-Kuan Wei, Hsien-Ming Lee, Chin-You Hsu
  • Publication number: 20230317457
    Abstract: Generally, the present disclosure provides example embodiments relating to formation of a gate structure of a device, such as in a replacement gate process, and the device formed thereby. In an example method, a gate dielectric layer is formed over an active area on a substrate. A dummy layer that contains a passivating species (such as fluorine) is formed over the gate dielectric layer. A thermal process is performed to drive the passivating species from the dummy layer into the gate dielectric layer. The dummy layer is removed. A metal gate electrode is formed over the gate dielectric layer. The gate dielectric layer includes the passivating species before the metal gate electrode is formed.
    Type: Application
    Filed: June 7, 2023
    Publication date: October 5, 2023
    Inventors: Hsiao-Kuan Wei, Hsien-Ming Lee, Chin-You Hsu, Hsin-Yun Hsu, Pin-Hsuan Yeh
  • Patent number: 11771651
    Abstract: Disclosed herein are novel synthetic polypeptides and uses thereof in the preparation of liposomes. According to embodiments of the present disclosure, the synthetic polypeptide comprises a membrane lytic motif, a masking motif, and a linker configured to link the membrane lytic motif and the masking motif. The linker is cleavable by a stimulus, such as, light, protease, or phosphatase. Once being coupled to a liposome, the exposure to the stimulus cleaves the linker that results in the separation of the masking motif from the membrane lytic motif, which in turn exerts membrane lytic activity on the liposome that leads to the collapse of the intact structure of the liposome, and releases the agent encapsulated in the liposome to the target site. Also disclosed herein are methods of diagnosing or treating a disease in a subject by use of the present liposomes.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: October 3, 2023
    Assignee: Academia Sinica
    Inventors: Hsien-Ming Lee, Hua-De Gao, Jia-Lin Hong, Chih-Yu Kuo, Cheng-Bang Jian
  • Patent number: D1000270
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: October 3, 2023
    Assignee: YFY CONSUMER PRODUCTS, CO.
    Inventors: Yi-Da Ho, Hsien-Ming Kwo, Yu-Lin Chiang, Yin-Feng Chen