Abstract: A socket LED device includes a first body, a second body, a conducting device, a heat-dissipation device and an LED module. The first body is demountably connected to the second body. The heat-dissipation device is set between the first body and the second body. The conducting device includes two conducting pins and two conducting sockets respectively located on the first connecting surface and the second connecting surface to embed with each other. The LED module is secured on the first body and includes a heat-conducting substrate touching the heat-dissipation device and a conductive portion electrically connected with the conducting pins. Therefore, the heat is gradually decreased through this kind of stacked formation.

Abstract: A manufacturing method of a microstructure includes the steps of: providing a substrate; forming a photoresist layer on the substrate; providing a first mask, which has at least one opaque area and at least one first lens, over the photoresist layer; providing a light source for illuminating the photoresist layer through the first mask; removing a portion of the photoresist layer to form at least one recess having a lateral wall, a depth and a width. An inclined angle of the lateral wall is not less than 5 degrees and the ratio of the depth to the width is not less than 2.

Abstract: A microstructure includes a substrate and a photoresist layer. The substrate has a surface, and the photoresist layer is disposed on the substrate. The photoresist layer has at least one recess, which has a sidewall, a depth and a width. An oblique angle of the sidewall is not less than 5 degrees, and the aspect ratio is not less than 2. Also, a manufacturing method of the microstructure is also disclosed.

Abstract: A method for manufacturing a heat dissipation apparatus comprises the following steps: A substrate is provided. A pressure is exerted on the substrate by a roller mold to form a plurality of grooves on one surface of the substrate. A sealed chamber is formed out of the substrate so that the grooves are formed on an inner wall of the sealed chamber.

Abstract: This invention id related to a heat dissipation device comprises a case having a heat dissipation path, a backflow path, a first link path, and a second link path for working fluid to circulate therein. The heat dissipation path and the backflow path are positioned in the different height levels individually. The working fluid will not be more easily have turbulence. The reduction of heat dissipation efficiency will be improved. And the working fluid will not be necessary to limit covering the liquid state and gaseous state both.

Abstract: A micro-switch. The micro-switch comprises at least one base, at least one fixed portion, and at least one switch component. The base comprises at least one first terminal and at least one first drive unit. The fixed portion is protruded higher than the base. The switch component comprises at least one deflection structure and at least one reverse structure. The deflection structure comprises at least one second terminal and at least one second drive unit. The second terminal corresponds to the first terminal and the second drive unit corresponds to the first drive unit. The reverse structure comprises one end connected to the fixed portion and another end connected to the deflection structure.

Abstract: A chip package mechanism. A substrate is disposed in a receiving chamber of a base. A chip is disposed on a target surface of the substrate. A plurality of supporting elements is disposed on the target surface and surrounds the chip. A gap for receiving the chip is created in the receiving chamber and between the target surface and the base by means of the supporting elements. A barricade is disposed in the gap to separate glue filled in the receiving chamber from contacting the chip. Outside water and particles cannot enter the chip package mechanism. The chip thus has a prolonged lifespan after packaged in the chip package mechanism.

Abstract: A heat dissipation apparatus. The heat-dissipation apparatus comprises a chamber, a working fluid, an evaporation section and a condensing section. The chamber has an inner wall, and the working fluid is sealed in the chamber. The evaporation section and the condensing section are located at the inner wall. The first grooves are disposed on the inner wall and connected to the evaporation section and the condensing section. The working fluid is vaporized at the evaporation section when absorbing heat from the heat source and condenses to a liquid phase and releases the heat at the condensing section, and the first groove provides a capillary force to drive the working fluid from the condensing section back to the evaporation section.

Abstract: The detent means for a heat sink has on each of the two ends of a pressing member a fixing engaging member and a movable engaging member, the movable engaging member is provided thereon with a foldable member. Wherein the pressing member is provided on the heat sink, the fixing engaging member extending downwards to engage protrusions on a side of a fixing seat of a microprocessor, the movable engaging member can be lowered to engage with protrusions on an opposite side of the fixing seat of the microprocessor, and the movable engaging member can be raised to a predetermined level under the action of the foldable member to thereby exert a force on the pressing member, thus the heat sink and the microprocessor at the center of the fixing seat can be press connected with each other.

Abstract: A method for forming a die, including forming a pre-formed mold by providing a preliminary layer on a substrate and performing a micro-machining process on the preliminary layer. Due to the micro-machining process, the method can fabricate a pre-formed mold with high precision for forming a mold. The die is fabricated by the mold for performing a molding process to obtain a workpiece with a predetermined shape.

Abstract: The detent means for a heat sink has on each of the two ends of a pressing member a fixing engaging member and a movable engaging member, the movable engaging member is provided thereon with a foldable member. Wherein the pressing member is provided on the heat sink, the fixing engaging member extending downwards to engage protrusions on a side of a fixing seat of a microprocessor, the movable engaging member can be lowered to engage with protrusions on an opposite side of the fixing seat of the microprocessor, and the movable engaging member can be raised to a predetermined level under the action of the foldable member to thereby exert a force on the pressing member, thus the heat sink and the microprocessor at the center of the fixing seat can be press connected with each other.