Patents by Inventor Hsin-Chieh Huang

Hsin-Chieh Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160265745
    Abstract: An illumination device includes an optical component and a light-emitting module. The optical component includes a light-transmitting body, a first optical unit, and a second optical unit. The first optical unit has a light input surface and a plurality of surrounding structures surrounding the light input surface and arranged in a pattern of concentric circles, and each surrounding structure has a first surrounding surface and a second surrounding surface. The second optical unit has a spiral structure surrounding the light output surface of the light-transmitting body and a surrounding frame surrounding the light output surface of the light-transmitting body and the spiral structure, and a relative height from a topmost surface of the spiral structure to the light output surface of the light-transmitting body is increased gradually from inner to outer. The light-emitting module is disposed under the light input surface of the first optical unit.
    Type: Application
    Filed: January 5, 2016
    Publication date: September 15, 2016
    Inventors: Hsin-Chieh Huang, Shun-Wen Teng, Shun Wang
  • Publication number: 20160204074
    Abstract: Some embodiments relate to a method of dicing a semiconductor wafer. The semiconductor wafer that includes a device structure that is formed within a device layer. The device layer is arranged within an upper surface the device layer. A crack stop is formed, which surrounds the device structure and reinforces the semiconductor wafer to prevent cracking during dicing. A laser is used to form a groove along a scribe line outside the crack stop. The groove extends completely through the device layer, and into an upper surface region of the semiconductor wafer. The semiconductor wafer is then cut along the grooved scribe line with a cutting blade to singulate the semiconductor wafer into two or more die. By extending the groove completely through the device layer, the method avoids damage to the device layer caused by the blade saw, and thus avoids an associated performance degradation of the device structure.
    Type: Application
    Filed: January 14, 2015
    Publication date: July 14, 2016
    Inventors: Yu-Syuan Lin, Jiun-Lei Jerry Yu, Ming-Cheng Lin, Hsin-Chieh Huang, Chao-Hsiung Wang
  • Publication number: 20160178568
    Abstract: The present disclosure relates to an integrated chip having an integrated bio-sensor having horizontal and vertical sensing surfaces. In some embodiments, the integrated chip has a sensing device disposed within a semiconductor substrate. A back-end-of the line (BEOL) metallization stack with a plurality of metal interconnect layers electrically coupled to the sensing device is arranged within an inter-level dielectric (ILD) layer overlying the semiconductor substrate. A sensing well is located within a top surface of the ILD layer. The sensing well has a horizontal sensing surface extending along a top surface of a first one of the plurality of metal interconnect layers and a vertical sensing surface extending along a sidewall of a second one of the plurality of metal interconnect layers overlying the first one of the plurality of metal interconnect layers. The use of both horizontal and vertical sensing surfaces enables more accurate sensing.
    Type: Application
    Filed: December 17, 2014
    Publication date: June 23, 2016
    Inventors: Chun-Wen Cheng, Fei-Lung Lai, Chia-Hua Chu, Yi-Hsien Chang, Hsin-Chieh Huang
  • Patent number: 9257942
    Abstract: An audio amplifier apparatus for driving a loudspeaker is provided. The audio amplifier apparatus includes a soft charge unit, a first amplification module, and a second amplification module. The soft charge unit is coupled to the loudspeaker through an output terminal and supplies a driving current according to a first control signal to soft charge the loudspeaker, so as to gradually increase a voltage level on the output terminal. The first amplification module receives an audio signal according to the first control signal and amplifies the audio signal to output a first amplified signal for driving the loudspeaker. The second amplification module receives the audio signal according to a second control signal and amplifies the audio signal to output a second amplified signal for driving the loudspeaker. The soft charge unit generates the second control signal by comparing the voltage level on the output terminal with a predetermined voltage level.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: February 9, 2016
    Assignee: MICROCHIP TECHNOLOGY INCORPORATED
    Inventors: Yi-Lung Chen, Hsin-Chieh Huang
  • Patent number: 9153739
    Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: October 6, 2015
    Assignee: TSMC SOLID STATE LIGHTING, LTD.
    Inventor: Hsin-Chieh Huang
  • Patent number: 9125272
    Abstract: A lighting apparatus includes a board, a first light-emitting diode (LED) bank disposed on the board, a second LED bank disposed on the board, a light detector coupled to the first LED bank, and a driver coupled to the light detector and to each of the first and second LED banks. The first LED bank includes a plurality of first LEDs. The second LED bank includes a plurality of second LEDs, and is electrically coupled to the first LED bank. The light detector is configured to detect an output decay of light from each of the first LEDs. The second LEDs in the second LED bank are initially deactivated and are subsequently activated in response to light output decay of the first LEDs.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: September 1, 2015
    Assignee: TSMC SOLID STATE LIGHTING LTD.
    Inventor: Hsin-Chieh Huang
  • Publication number: 20150243848
    Abstract: Multiple through-substrate vias (TSVs) are used to make electrical connections for an LED formed over a substrate. A first TSV extends through the substrate from a back surface of the substrate to the front surface of the substrate and includes a first TSV conductor that electrically connects to a first cladding layer of the LED. A second TSV extends through the substrate and an active layer of the LED from the back surface of the substrate to a second cladding layer or an ITO layer. The second TSV includes an isolation layer that electrically isolates a second TSV conductor from the first cladding layer and the active layer. Additionally dummy TSVs may be formed to conduct heat away from the LED optionally through a package substrate.
    Type: Application
    Filed: April 29, 2015
    Publication date: August 27, 2015
    Inventor: Hsin-Chieh Huang
  • Publication number: 20150187992
    Abstract: A device includes a textured substrate, which further includes a plurality of trenches. Each of the plurality of trenches includes a first sidewall and a second sidewall opposite the first sidewall. A plurality of reflectors configured to reflect light is formed, with each of the plurality of reflectors being on one of the first sidewalls of the plurality of trenches. The second sidewalls of the plurality of trenches are substantially free from any reflector.
    Type: Application
    Filed: March 12, 2015
    Publication date: July 2, 2015
    Inventor: Hsin-Chieh Huang
  • Publication number: 20150171266
    Abstract: The present disclosure involves an apparatus. The apparatus includes a substrate having a front side a back side opposite the front side. The substrate includes a plurality of openings formed from the back side of the substrate. The openings collectively define a pattern on the back side of the substrate from a planar view. In some embodiments, the substrate is a silicon substrate or a silicon carbide substrate. Portions of the silicon substrate vertically aligned with the openings have vertical dimensions that vary from about 100 microns to about 300 microns. A III-V group compound layer is formed over the front side of the silicon substrate. The III-V group compound layer is a component of one of: a light-emitting diode (LED), a laser diode (LD), and a high-electron mobility transistor (HEMT).
    Type: Application
    Filed: February 25, 2015
    Publication date: June 18, 2015
    Inventors: Zhen-Yu Li, Chung-Pao Lin, Hsing-Kuo Hsia, Hao-Chung Kuo, Cindy Huichun Shu, Hsin-Chieh Huang
  • Patent number: 9029175
    Abstract: A photonic device generates light from a full spectrum of lights including white light. The device includes two or more LEDs grown on a substrate, each generating light of a different wavelength and separately controlled. A light-emitting structure is formed on the substrate and apportioned into the two or more LEDs by etching to separate the light-emitting structure into different portions. At least one of the LEDs is coated with a phosphor material so that different wavelengths of light are generated by the LEDs while the same wavelength of light is emitted from the light-emitting structure.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: May 12, 2015
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Hsin-Chieh Huang, Chao-Hsiung Wang
  • Patent number: 8981534
    Abstract: The present disclosure involves an apparatus. The apparatus includes a substrate having a front side a back side opposite the front side. The substrate includes a plurality of openings formed from the back side of the substrate. The openings collectively define a pattern on the back side of the substrate from a planar view. In some embodiments, the substrate is a silicon substrate or a silicon carbide substrate. Portions of the silicon substrate vertically aligned with the openings have vertical dimensions that vary from about 100 microns to about 300 microns. A III-V group compound layer is formed over the front side of the silicon substrate. The III-V group compound layer is a component of one of: a light-emitting diode (LED), a laser diode (LD), and a high-electron mobility transistor (HEMT).
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: March 17, 2015
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Zhen-Yu Li, Chung-Pao Lin, Hsing-Kuo Hsia, Hao-Chung Kuo, Cindy Huichun Shu, Hsin-Chieh Huang
  • Patent number: 8981397
    Abstract: A device includes a textured substrate, which further includes a plurality of trenches. Each of the plurality of trenches includes a first sidewall and a second sidewall opposite the first sidewall. A plurality of reflectors configured to reflect light is formed, with each of the plurality of reflectors being on one of the first sidewalls of the plurality of trenches. The second sidewalls of the plurality of trenches are substantially free from any reflector.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: March 17, 2015
    Assignee: TSMC Solid State Lighting Ltd.
    Inventor: Hsin-Chieh Huang
  • Publication number: 20150054412
    Abstract: An integrated photonic device includes a number of LEDs and a feedback mechanism that measures individual LED light outputs using a photo sensor via a light transmitter disposed in the vicinity of individual LEDs. A controller or driver adjusts a current driven to each LED using the detected values according to various logic based on the device application.
    Type: Application
    Filed: October 27, 2014
    Publication date: February 26, 2015
    Inventor: Hsin-Chieh Huang
  • Patent number: 8884529
    Abstract: An integrated photonic device includes a number of LEDs and a feedback mechanism that measures individual LED light outputs using a photo sensor via a light transmitter disposed in the vicinity of individual LEDs. A controller or driver adjusts a current driven to each LED using the detected values according to various logic based on the device application.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: November 11, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Hsin-Chieh Huang
  • Publication number: 20140319318
    Abstract: A system having a light guide adapted to collect light from a light source, a light detector attached to the light guide, a controller electrically connected to an output of the light detector, and a driver for driving the light source detachably connected to an output of the controller. The driver includes a memory that stores a calibration value for the light source.
    Type: Application
    Filed: July 18, 2014
    Publication date: October 30, 2014
    Inventor: Hsin-Chieh Huang
  • Patent number: 8786197
    Abstract: A system having a light guide adapted to collect light from a light source, a light detector attached to the light guide, a controller electrically connected to an output of the light detector, and a driver for driving the light source detachably connected to an output of the controller. The driver includes a memory that stores a calibration value for the light source.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: July 22, 2014
    Assignee: TSMC Solid State Lighting Ltd.
    Inventor: Hsin-Chieh Huang
  • Publication number: 20140191191
    Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.
    Type: Application
    Filed: March 14, 2014
    Publication date: July 10, 2014
    Inventor: Hsin-Chieh Huang
  • Publication number: 20140077224
    Abstract: The present disclosure involves an apparatus. The apparatus includes a substrate having a front side a back side opposite the front side. The substrate includes a plurality of openings formed from the back side of the substrate. The openings collectively define a pattern on the back side of the substrate from a planar view. In some embodiments, the substrate is a silicon substrate or a silicon carbide substrate. Portions of the silicon substrate vertically aligned with the openings have vertical dimensions that vary from about 100 microns to about 300 microns. A III-V group compound layer is formed over the front side of the silicon substrate. The III-V group compound layer is a component of one of: a light-emitting diode (LED), a laser diode (LD), and a high-electron mobility transistor (HEMT).
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: TSMC Solid State Lighting Ltd.
    Inventors: Zhen-Yu Li, Chung-Pao Lin, Hsing-Kuo Hsia, Hao-Chung Kuo, Cindy Huichun Shu, Hsin-Chieh Huang
  • Patent number: 8673666
    Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: March 18, 2014
    Assignee: TSMC Solid State Lighting Ltd.
    Inventor: Hsin-Chieh Huang
  • Publication number: 20140065740
    Abstract: A photonic device generates light from a full spectrum of lights including white light. The device includes two or more LEDs grown on a substrate, each generating light of a different wavelength and separately controlled. A light-emitting structure is formed on the substrate and apportioned into the two or more LEDs by etching to separate the light-emitting structure into different portions. At least one of the LEDs is coated with a phosphor material so that different wavelengths of light are generated by the LEDs while the same wavelength of light is emitted from the light-emitting structure.
    Type: Application
    Filed: November 20, 2013
    Publication date: March 6, 2014
    Applicant: TSMC Solid State Lighting Ltd.
    Inventors: Hsin-Chieh Huang, Chao-Hsiung Wang