Abstract: An ESD protection circuit suitable for applying in an integrated circuit with separated power domains is provided. The circuit includes a P-type MOSFET coupled between a first circuit in a first power domain and a second circuit in a second power domain. A source terminal of the P-type MOSFET is coupled to a connection node for connecting the first circuit and the second circuit. A gate terminal of the P-type MOSFET is coupled to a positive power line of the second power domain. A drain terminal of the P-type MOSFET is coupled to a negative power line of the second power domain. A body terminal of the P-type MOSFET is also coupled to the connection node.

Abstract: An ESD protection circuit including a clamping module and a detecting module is provided. The clamping module is coupled between a positive power line and a negative power line. The detecting module includes a triggering unit, a resistor, and a MOS capacitor. An output terminal of the triggering unit is used for triggering the clamping module. The resistor is coupled between the negative power line and an input terminal of the triggering unit. The MOS capacitor is coupled between the positive power line and an input terminal of the triggering unit for ESD protection. During a normal power operation, a switching terminal of the triggering unit enables the MOS capacitor to be coupled between the negative power line and an input terminal of the triggering unit. Thereby, the gate tunneling leakage is eliminated and the problem of mistriggering is prevented.

Abstract: The present invention discloses a bidirectional PNPN silicon-controlled rectifier comprising: a p-type substrate; a N-type epitaxial layer; a P-type well and two N-type wells all formed inside the N-type epitaxial layer with the two N-type wells respectively arranged at two sides of the P-type well; a first semiconductor area, a second semiconductor area and a third semiconductor area all formed inside the P-type well and all coupled to an anode, wherein the second semiconductor area and the third semiconductor area are respectively arranged at two sides of the first semiconductor area, and wherein the first semiconductor area is of first conduction type, and the second semiconductor area and the third semiconductor area are of second conduction type; and two P-type doped areas respectively formed inside the N-type wells, wherein each P-type doped area has a fourth semiconductor area neighboring the P-type well and a fifth semiconductor area, and wherein both the fourth semiconductor area and the fifth semico

Abstract: An ESD protection circuit including a clamping module and a detecting module is provided. The clamping module is coupled between a positive power line and a negative power line. The detecting module includes a triggering unit, a resistor, and a MOS capacitor. An output terminal of the triggering unit is used for triggering the clamping module. The resistor is coupled between the positive power line and an input terminal of the triggering unit. The MOS capacitor has a first end and a second end. The first end is coupled to the input terminal of the triggering unit. During a normal power operation, a switching terminal of the triggering unit enables the second end of the MOS capacitor to be coupled with the positive power line. Thereby, the gate tunneling leakage is eliminated and the problem of mistriggering is prevented.

Abstract: A bidirectional transient voltage suppression device is disclosed. The bi-directional transient voltage suppression device comprises a semiconductor die. The semiconductor die has a multi-layer structure comprising a semiconductor substrate of a first conductivity type, a buried layer of a second conductivity type, an epitaxial layer, and five diffused regions. The buried layer and the semiconductor substrate form a first semiconductor junction. The first diffused region of the second conductivity type and the semiconductor substrate form a second semiconductor junction. The fourth diffused region of the first conductivity type and the third diffused region of the second conductivity type form a third semiconductor junction. The fifth diffused region of the first conductivity type and the second diffused region of the second conductivity type form a fourth semiconductor junction.

Abstract: An ESD protection circuit is provided. The circuit includes a discharging component, a diode, and an ESD detection circuit. The discharging component is coupled between an input/output pad and a first power line of an IC. The diode is coupled between the input/output pad and a second power line of the IC in a forward direction toward the second power line. The ESD detection circuit includes a capacitor, a resistor, and a triggering component. The capacitor and the resistor are formed in series and coupled between the first power line and the second power line. The triggering component has a positive power end coupled to the input/output pad and a negative power end coupled to the first power line. An input of the triggering component is coupled to a node between the capacitor and the resistor.

Abstract: An electrostatic discharge (ESD) protection device and a layout thereof are provided. A bias conducting wire is mainly used to couple each base of a plurality of parasitic transistors inside ESD elements together, in order to simultaneously trigger all the parasitic transistors to bypass the ESD current, avoid the elements of a core circuit being damaged, and solve the non-uniform problem of bypassing the ESD current when ESD occurs. Furthermore, in the ESD protection layout, it only needs to add another doped region on a substrate neighboring to, but not contacting, doped regions of the ESD protection elements and use contacts to connect the added doped region, so as to couple each base of the parasitic transistors together without requiring for additional layout area.

Abstract: An electrostatic discharge protection circuit that includes at least two transistors connected in a stacked configuration, a first diffusion region of a first dopant type shared by two adjacent transistors, and a second diffusion region of a second dopant type formed in the first diffusion region. A substrate-triggered site is induced into the device structure of the stacked transistors to improve ESD robustness and turn-on speed. An area-efficient layout to realize the stacked transistors is proposed. The stacked transistors may be implemented in ESD protection circuits with a mixed-voltage I/O interface, or in integrated circuits with multiple power supplies. The stacked transistors are fabricated without using a thick-gate mask.

Abstract: An on-chip latch-up protection circuit. The lath-up protection circuit includes a core circuit, a power switch, and a current extractor. The power switch controls major current flowing through the core circuit. The current extractor detects amplitude of the major current. The power switch, the core circuit and the current extractor are coupled in series between a relatively-high power line and a relatively-low power line. When the major current surpasses a predetermined amplitude, the power switch is turned off, causing latch-up stops.

Abstract: A transient noise detection circuit for detecting a level of a transient noise voltage is disclosed. The transient noise detection circuit comprises a triggering circuit, a rectifying circuit, and a controller. The triggering circuit is coupled between a power rail and a ground node. When the triggering circuit receives a transient noise, the triggering circuit generates a triggering signal. The rectifying circuit comprises a rectifying unit and a current-limiting unit coupled in series. When the rectifying unit receives the triggering signal from the triggering circuit, the rectifying unit will be triggered by the triggering signal. The controller is coupled to a detection node between the rectifying unit and the current-limiting unit. The controller is used for determining the level of the transient noise voltage based on the voltage of the detection node.

Abstract: An ESD protection circuit is provided. The circuit includes a discharging component, a diode, and an ESD detection circuit. The discharging component is coupled between an input/output pad and a first power line of an IC. The diode is coupled between the input/output pad and a second power line of the IC in a forward direction toward the second power line. The ESD detection circuit includes a capacitor, a resistor, and a triggering component. The capacitor and the resistor are formed in series and coupled between the first power line and the second power line. The triggering component has a positive power end coupled to the input/output pad and a negative power end coupled to the first power line. An input of the triggering component is coupled to a node between the capacitor and the resistor.

Abstract: The present invention proposed a slew-rate control circuitry without the use of external components such as amplifiers. Therefore slew-rate control circuitry of the present invention not only provides an IC with build-in slew-rate control, but also reduces number of transistors used externally which will increase gate-oxide reliability of the IC. The slew-rate control circuitry of the present invention is primarily comprised by an output buffer and feedback circuitry, the output buffer mainly consisted four transistors and depends on output of the IC, these four transistors will interact with each other to control the slew-rate of IC output. Additional feedback circuitry and gate-tracking circuitry are also disclosed to enhance the performance of the slew-rate control circuitry.

Abstract: An ESD protection circuit including a clamping module and a detecting module is provided. The clamping module is coupled between a positive power line and a negative power line. The detecting module includes a triggering unit, a resistor, and a MOS capacitor. An output terminal of the triggering unit is used for triggering the clamping module. The resistor is coupled between the negative power line and an input terminal of the triggering unit. The MOS capacitor is coupled between the positive power line and an input terminal of the triggering unit for ESD protection. During a normal power operation, a switching terminal of the triggering unit enables the MOS capacitor to be coupled between the negative power line and an input terminal of the triggering unit. Thereby, the gate tunneling leakage is eliminated and the problem of mistriggering is prevented.

Abstract: An ESD protection circuit for a differential I/O pair is provided. The circuit includes an ESD detection circuit, a discharge device, and four diodes. The first diode is coupled between the first I/O pin and the discharge device in a forward direction toward the discharge device. The second diode is coupled between the second I/O pin and the discharge device in a forward direction toward the second I/O pin. The third diode is coupled between the discharge device and the positive power line in a forward direction toward the positive power line. The fourth diode is coupled between the discharge device and the negative power line in a forward direction toward the discharge device. Via an output end, the ESD detection circuit triggers the discharge device during ESD events.

Abstract: An ESD detection circuit for detecting a level of an ESD voltage on a power rail is provided. The ESD detection circuit includes a resistive component, a diode unit, and a controller. The resistive component is coupled between a detection node and a ground node corresponding to the power rail. The diode unit is coupled between the power rail and the detection node in a forward direction toward the power rail. The controller, coupled to the detection node, is used for determining the level of the ESD voltage based on the voltage of the detection node and the breakdown voltage of the diode unit.

Abstract: The present invention discloses a bidirectional silicon-controlled rectifier, wherein the conventional field oxide layer, which separates an anode structure from a cathode structure, is replaced by a field oxide layer having floating gates, a virtual gate or a virtual active region. Thus, the present invention can reduce or escape from the bird's beak effect of a field oxide layer, which results in crystalline defects, a concentrated current and a higher magnetic field and then causes abnormal operation of a rectifier. Thereby, the present invention can also reduce signal loss.

Abstract: A charge pump circuit with bipolar output comprises a first switch capable of selectively connecting a first input terminal of a transfer capacitor to a voltage source, a second switch capable of selectively connecting a first input terminal of a first storage capacitor to said first input terminal of said transfer capacitor; a third switch capable of selectively connecting a second input terminal of said transfer capacitor to said voltage source; a fourth switch selectively connecting said second input terminal of said transfer capacitor to a ground terminal; and a fifth switch selectively connecting said second input terminal of said transfer capacitor to a second input terminal of a second storage capacitor. The charge pump circuit is collocated with clock signals to be selectively driven by a four-phase signal so as to produce bipolar voltages with magnitudes higher than the input voltage with minimum number of switches and capacitors and also accomplish the highest efficiency.

Abstract: A charge pump circuit with bipolar output comprises a first set of switch device capable of selectively connecting two terminals of a first transfer capacitor to a voltage source and a ground terminal, respectively, a second set of switch device capable of selectively connecting the two terminals of the first transfer capacitor to a grounded first storage capacitor and the voltage source, respectively, a third set of switch device capable of selectively connecting two terminals of a second transfer capacitor to the first transfer capacitor connected to the voltage source and the ground terminal, respectively, and a fourth set of switch device capable of selectively connecting the two terminals of the second transfer capacitor to a grounded second storage capacitor and the ground terminal, respectively.

Abstract: The present invention discloses a bidirectional PNPN silicon-controlled rectifier comprising: a p-type substrate; a N-type epitaxial layer; a P-type well and two N-type wells all formed inside the N-type epitaxial layer with the two N-type wells respectively arranged at two sides of the P-type well; a first semiconductor area, a second semiconductor area and a third semiconductor area all formed inside the P-type well and all coupled to an anode, wherein the second semiconductor area and the third semiconductor area are respectively arranged at two sides of the first semiconductor area, and wherein the first semiconductor area is of first conduction type, and the second semiconductor area and the third semiconductor area are of second conduction type; and two P-type doped areas respectively formed inside the N-type wells, wherein each P-type doped area has a fourth semiconductor area neighboring the P-type well and a fifth semiconductor area, and wherein both the fourth semiconductor area and the fifth semico

Abstract: A high/low voltage tolerant interface circuit and a crystal oscillator circuit using the same are provided herein. The interface circuit includes a first transistor, a bulk-voltage generator module and an bias module. The first transistor includes a gate, a first source/drain, a bulk coupled to the first source/drain of the first transistor and a second source/drain coupled to an input node. The bulk-voltage generator module is, used to determine whether a first voltage or a predetermined voltage is being provided to the bulk of the first transistor according to the voltage of the input node. The bias module is coupled to the gate of the first transistor. The bias module is used to provide an bias voltage to the gate of the first transistor and makes the first transistor conduct in order to control the voltage of the second source/drain voltage of the first transistor.