Abstract: The present invention proposed a slew-rate control circuitry without the use of external components such as amplifiers. Therefore slew-rate control circuitry of the present invention not only provides an IC with build-in slew-rate control, but also reduces number of transistors used externally which will increase gate-oxide reliability of the IC. The slew-rate control circuitry of the present invention is primarily comprised by an output buffer and feedback circuitry, the output buffer mainly consisted four transistors and depends on output of the IC, these four transistors will interact with each other to control the slew-rate of IC output. Additional feedback circuitry and gate-tracking circuitry are also disclosed to enhance the performance of the slew-rate control circuitry.

Abstract: An electrostatic discharge protection device that includes a semiconductor substrate of a first dopant type, at least one source/drain pair of a second dopant type formed in the substrate, wherein the source/drain pair is separated to define a channel region therebetween, a lightly-doped region of the first dopant type defined between the source/drain pair and including at least a portion of the channel region, a gate dielectric layer formed over the substrate, and a gate formed over the gate dielectric layer and above the channel region.

Abstract: An ESD protection circuit including a clamping module and a detecting module is provided. The clamping module is coupled between a positive power line and a negative power line. The detecting module includes a triggering unit, a resistor, and a MOS capacitor. An output terminal of the triggering unit is used for triggering the clamping module. The resistor is coupled between the positive power line and an input terminal of the triggering unit. The MOS capacitor has a first end and a second end. The first end is coupled to the input terminal of the triggering unit. During a normal power operation, a switching terminal of the triggering unit enables the second end of the MOS capacitor to be coupled with the positive power line. Thereby, the gate tunneling leakage is eliminated and the problem of mistriggering is prevented.

Abstract: An ESD protection circuit suitable for applying in an integrated circuit with separated power domains is provided. The circuit includes a P-type MOSFET coupled between a first circuit in a first power domain and a second circuit in a second power domain. A source terminal of the P-type MOSFET is coupled to a connection node for connecting the first circuit and the second circuit. A gate terminal of the P-type MOSFET is coupled to a positive power line of the second power domain. A drain terminal of the P-type MOSFET is coupled to a negative power line of the second power domain. A body terminal of the P-type MOSFET is also coupled to the connection node.

Abstract: An ESD protection circuit that protects a mixed-voltage input/output (I/O) buffer circuit in an integrated circuit is provided. The ESD protection circuit includes an ESD discharging circuit coupled to the I/O pad and ESD detection circuit coupled to the discharging circuit providing a means for detecting an ESD and triggering the discharging circuit to conduct the ESD to ground. The ESD discharging circuit comprises stacked NMOS transistors or a field oxide device (FOD). The protection circuit can also be used in an ESD protection circuit for a high-voltage-tolerant input pad or to protect multiple input pads and/or multiple I/O pads in an integrated circuit.

Abstract: The present invention discloses a symmetric bidirectional silicon-controlled rectifier, which comprises: a substrate; a buried layer formed on the substrate; a first well, a middle region and a second well, which are sequentially formed on the buried layer side-by-side; a first semiconductor area and a second semiconductor area both formed inside the first well; a third semiconductor area formed in a junction between the first well and the middle region, wherein a first gate is formed over a region between the second and third semiconductor areas; a fourth semiconductor area and a fifth semiconductor area both formed inside the second well; a sixth semiconductor area formed in a junction between the second well and the middle region, wherein a second gate is formed over a region between the fifth and sixth semiconductor areas.

Abstract: The present invention discloses an asymmetric bidirectional silicon-controlled rectifier, which comprises: a second conduction type substrate; a first conduction type undoped epitaxial layer formed on the substrate; a first well and a second well both formed inside the undoped epitaxial layer and separated by a portion of the undoped epitaxial layer; a first buried layer formed in a junction between the first well and the substrate; a second buried layer formed in a junction between the second well and the substrate; a first and a second semiconductor area with opposite conduction type both formed inside the first well; a third and a fourth semiconductor area with opposite conduction type both formed inside the second well, wherein the first and second semiconductor areas are connected to the anode of the silicon-controlled rectifier, and the third and fourth semiconductor areas are connected to the cathode of the silicon-controlled rectifier.

Abstract: A charge pump circuit with bipolar output comprises a first set of switch device capable of selectively connecting two terminals of a first transfer capacitor to a voltage source and a ground terminal, respectively, a second set of switch device capable of selectively connecting the two terminals of the first transfer capacitor to a grounded first storage capacitor and the voltage source, respectively, a third set of switch device capable of selectively connecting two terminals of a second transfer capacitor to the first transfer capacitor connected to the voltage source and the ground terminal, respectively, and a fourth set of switch device capable of selectively connecting the two terminals of the second transfer capacitor to a grounded second storage capacitor and the ground terminal, respectively.

Abstract: An ESD protection circuit is provided. The circuit includes a discharging component, a diode, and an ESD detection circuit. The discharging component is coupled between an input/output pad and a first power line of an IC. The diode is coupled between the input/output pad and a second power line of the IC in a forward direction toward the second power line. The ESD detection circuit includes a capacitor, a resistor, and a triggering component. The capacitor and the resistor are formed in series and coupled between the first power line and the second power line. The triggering component has a positive power end coupled to the input/output pad and a negative power end coupled to the first power line. An input of the triggering component is coupled to a node between the capacitor and the resistor.

Abstract: A high/low voltage tolerant interface circuit and a crystal oscillator circuit using the same are provided herein. The interface circuit includes a first transistor, a bulk-voltage generator module and an bias module. The first transistor includes a gate, a first source/drain, a bulk coupled to the first source/drain of the first transistor and a second source/drain coupled to an input node. The bulk-voltage generator module is, used to determine whether a first voltage or a predetermined voltage is being provided to the bulk of the first transistor according to the voltage of the input node. The bias module is coupled to the gate of the first transistor. The bias module is used to provide an bias voltage to the gate of the first transistor and makes the first transistor conduct in order to control the voltage of the second source/drain voltage of the first transistor.

Abstract: An electrostatic discharge protection circuit that includes at least two transistors connected in a stacked configuration, a first diffusion region of a first dopant type shared by two adjacent transistors, and a second diffusion region of a second dopant type formed in the first diffusion region. A substrate-triggered site is induced into the device structure of the stacked transistors to improve ESD robustness and turn-on speed. An area-efficient layout to realize the stacked transistors is proposed. The stacked transistors may be implemented in ESD protection circuits with a mixed-voltage I/O interface, or in integrated circuits with multiple power supplies. The stacked transistors are fabricated without using a thick-gate mask.

Abstract: A Mixed-voltage input and output (I/O) buffer including a pre-driver unit, a bulk-voltage generating unit, a first to a third transistors and an input stage unit is provided. The pre-driver unit outputs a first source/drain and a second signal. The bulk-voltage generating unit determines whether a first voltage or a pad voltage is used as a bulk voltage according to the pad voltage level. A gate of the first transistor receives the first signal, and a bulk, a first source/drain and a second source/drain of the first transistor are respectively coupled to the bulk voltage, the first voltage and the pad. A gate of the third transistor receives the second signal, and a first source/drain and a second source/drain of the third transistor are respectively coupled to the input stage unit for receiving an input signal from the pad and a second voltage.

Abstract: An electrostatic discharge protection circuit that includes at least two transistors connected in a stacked configuration, a first diffusion region of a first dopant type shared by two adjacent transistors, and a second diffusion region of a second dopant type formed in the first diffusion region. A substrate-triggered site is induced into the device structure of the stacked transistors to improve ESD robustness and turn-on speed. An area-efficient layout to realize the stacked transistors is proposed. The stacked transistors may be implemented in ESD protection circuits with a mixed-voltage I/O interface, or in integrated circuits with multiple power supplies. The stacked transistors are fabricated without using a thick-gate mask.

Abstract: An electrostatic discharge (ESD) protection device and a layout thereof are provided. A bias conducting wire is mainly used to couple each base of a plurality of parasitic transistors inside ESD elements together, in order to simultaneously trigger all the parasitic transistors to bypass the ESD current, avoid the elements of a core circuit being damaged, and solve the non-uniform problem of bypassing the ESD current when ESD occurs. Furthermore, in the ESD protection layout, it only needs to add another doped region on a substrate neighboring to, but not contacting, doped regions of the ESD protection elements and use contacts to connect the added doped region, so as to couple each base of the parasitic transistors together without requiring for additional layout area.

Abstract: An ESD protection circuit that protects a mixed-voltage input/output (I/O) buffer circuit in an integrated circuit is provided. The ESD protection circuit includes an ESD discharging circuit coupled to the I/O pad and ESD detection circuit coupled to the discharging circuit providing a means for detecting an ESD and triggering the discharging circuit to conduct the ESD to ground. The ESD discharging circuit comprises stacked NMOS transistors or a field oxide device (FOD). The protection circuit can also be used in an ESD protection circuit for a high-voltage-tolerant input pad or to protect multiple input pads and/or multiple I/O pads in an integrated circuit.

Abstract: An on-chip latch-up protection circuit. The lath-up protection circuit includes a core circuit, a power switch, and a current extractor. The power switch controls major current flowing through the core circuit. The current extractor detects amplitude of the major current. The power switch, the core circuit and the current extractor are coupled in series between a relatively-high power line and a relatively-low power line. When the major current surpasses a predetermined amplitude, the power switch is turned off, causing latch-up stops.

Abstract: An on-chip latch-up protection circuit. The lath-up protection circuit includes a core circuit, a power switch, and a current extractor. The power switch controls major current flowing through the core circuit. The current extractor detects amplitude of the major current. The power switch, the core circuit and the current extractor are coupled in series between a relatively-high power line and a relatively-low power line. When the major current surpasses a predetermined amplitude, the power switch is turned off, causing latch-up stops.

Abstract: An integrated circuit for providing electrostatic discharge protection that includes a contact pad, a CMOS device including a transistor having a substrate, and a CDM clamp for providing electrostatic discharge protection coupled between the contact pad and the CMOS device, the CDM clamp including at least one active device, wherein the CDM clamp conducts electrostatic charges accumulated in the substrate of the transistor to the contact pad and wherein the CMOS device is coupled between a high voltage line and a low voltage line.

Abstract: An electrostatic discharge protection circuit includes a first terminal, a second terminal, an electrostatic discharge device coupled between the first and second terminals, and an active device coupled to the electrostatic discharge device and controlling an electrostatic current through the electrostatic discharge device. The electrostatic discharge device includes at least one of an SCR, an FOD, an active device, a BJT, and an MOS device.

Abstract: An integrated circuit device for electrostatic discharge protection that includes a semiconductor substrate, a lightly doped region of a first dopant type formed in the substrate, a first diffusion region of the first dopant type formed at least partially in the lightly doped region, a second diffusion region of the first dopant type formed at least partially in the lightly doped region and spaced apart from the first diffusion region, a resistive path defined by the lightly doped region, the first and the second diffusion regions, and a third diffusion region of a second dopant type formed in the lightly doped region, and disposed between and spaced apart from the first and the second diffusion regions, wherein the third diffusion region keeps the resistive path at a low resistive state until a normal operation period occurs.