Abstract: An apparatus used for forming stud bumps may be formed by providing a first clamp plate comprising a clamping surface, forming a notcher on the clamping surface, and forming a contact stopper on the clamping surface. The apparatus may include a clamp that includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method for forming stud bumps includes bonding wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface.

Abstract: The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.

Abstract: A drug-delivery chip and a method of fabricating the same are provided. The drug-delivery chip has a main body having at least one drug receiving space individually formed with an opening for storing drugs therein; a thin film for sealing up the at least one drug receiving space; a first conductive wire connecting to one end of the thin film; a second conductive wire connecting to another end of the thin film; a signal-receiving module for receiving actuated signals; and a control module for applying voltages to first and second wire conductive s according to the actuated signal, thereby generating heat to break off the thin film for the release of a drug or drugs received in the at least one drug receiving space.

Abstract: Methods for forming stud bumps and apparatuses for forming stud bumps are disclosed. According to an embodiment, a method includes clamping a wire with a clamp. The clamp includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method further includes bonding the wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface. The second notch is the notch pitch distance from the first notch along the wire.

Abstract: A drug-delivery chip and a method of fabricating the same are provided. The drug-delivery chip has a main body having at least one drug receiving space individually formed with an opening for storing drugs therein; a thin film for sealing up the at least one drug receiving space; a first conductive wire connecting to one end of the thin film; a second conductive wire connecting to another end of the thin film; a signal-receiving module for receiving actuated signals; and a control module for applying voltages to first and second wire conductive s according to the actuated signal, thereby generating heat to break off the thin film for the release of a drug or drugs received in the at least one drug receiving space.

Abstract: Provided is an optical switch member including a bi-stable mechanism, and first and second electro-thermal actuators. The bi-stable mechanism includes a curved-beam disposed on a bending portion of a first cantilever, one end of the first cantilever having a driven portion disposed thereon. The first electro-thermal actuator includes a first beam of a first driven arm disposed on the bending portion. The second electro-thermal actuator includes a second beam of a second driven arm disposed on the bending portion. The ends of the first and second driven arms are adjacent to first and second sides of the driven arm, respectively. Also proposed is an optical switch device including a substrate, a third thermal actuator, and the optical switch member disposed on the substrate to form an optical switch device to thereby integrate the optical switch with variable optical attenuators on the substrate.

Abstract: Provided is an optical switch member including a bi-stable mechanism, and first and second electro-thermal actuators. The bi-stable mechanism includes a curved-beam disposed on a bending portion of a first cantilever, one end of the first cantilever having a driven portion disposed thereon. The first electro-thermal actuator includes a first beam of a first driven arm disposed on the bending portion. The second electro-thermal actuator includes a second beam of a second driven arm disposed on the bending portion. The ends of the first and second driven arms are adjacent to first and second sides of the driven arm, respectively. Also proposed is an optical switch device including a substrate, a third thermal actuator, and the optical switch member disposed on the substrate to form an optical switch device to thereby integrate the optical switch with variable optical attenuators on the substrate.

Abstract: A drug-delivery chip and a method of fabricating the same are provided. The drug-delivery chip has a main body having at least one drug receiving space individually formed with an opening for storing drugs therein; a thin film for sealing up the at least one drug receiving space; a first conductive wire connecting to one end of the thin film; a second conductive wire connecting to another end of the thin film; a signal-receiving module for receiving actuated signals; and a control module for applying voltages to first and second wire conductive s according to the actuated signal, thereby generating heat to break off the thin film for the release of a drug or drugs received in the at least one drug receiving space.

Abstract: A thermo-pneumatic peristaltic pump. A heating base board includes at least one heater. A membrane disposition board is disposed on the heating base board and includes at least one membrane chamber. The membrane chamber includes a first chamber body and a second chamber body. The first chamber body connects to the second chamber body and covers the heater. A fluidic receiving board is disposed on the membrane disposition board and includes at least one fluidic chamber, a fluidic inlet, and a fluidic outlet. The fluidic chamber is connected between the fluidic inlet and the fluidic outlet and is disposed on the second chamber body of the membrane chamber.