Abstract: An illumination apparatus is applied for providing illumination to a photographic device having a photographic field-of-view. The illumination apparatus includes an illumination device and a calibration photographic device. The illumination device is pivoted to a side of the photographic device and has an illumination field-of-view. The calibration photographic device has a calibration photographic field-of-view and is connected to the illumination device to make the calibration photographic field-of-view substantially overlap with the illumination field-of-view and make the calibration photographic device move together with the illumination device. The calibration photographic field-of-view at least partially overlaps with the photographic field-of-view. Accordingly, the present invention could improve convenience of the photographic device in mounting the illumination device.

Abstract: A slide rail assembly includes a first rail, a second rail, a blocking base, a ball retainer and a blocking member. The second rail is movable relative to the first rail. The blocking base is arranged on the first rail and has a limiting part. The ball retainer is configured to facilitate the second rail to move relative to the first rail. The ball retainer has a contact part. When the blocking member is in a first state, the blocking member is configured to push the contact part of the ball retainer to move the ball retainer in response to a movement of the second rail until the blocking member abuts against the limiting part of the blocking base. When the blocking member is in a second state, the blocking member no longer abuts against the limiting part of the blocking base.

Abstract: A light emitting device includes a casing, a lighting module, and a lens module. The lighting module is disposed in the casing for providing light and includes first and second light sources. The lens module faces the lighting module and includes a first lens aligned with the first light source, a second lens aligned with the second light source, a sliding frame, and a driving motor. The sliding frame is fixed to the first lens and has a thread portion. The driving motor has a screw rod for engaging with the thread portion, to make the sliding frame movable along the screw rod. The driving motor rotates the screw rod to make the thread portion drive the first and second lenses close to or away from the first and second light sources. Accordingly, the present invention reduces the manufacturing cost of the light emitting device and simplifies its mechanical design.

Abstract: An image monitoring apparatus includes a casing, a camera module in the casing, and a lighting module disposed on the casing and located above or under the camera module on a plane corresponding to a vertical angle of view of the camera module. A horizontal light-emitting plane of a LED of the lighting module is perpendicular to the plane corresponding to the vertical angle of view. A lens of the lighting module covers the LED and has a convex light-exit surface, a bottom surface, and a concave light-entrance surface. A long axis of the convex light-exit surface is located at the horizontal light-emitting plane. A section thickness of the lens from the concave light-entrance surface to the convex light-exit surface along the long axis is greater than a section thickness of the lens from the concave light-entrance surface to the convex light-exit surface along a normal of the bottom surface.

Abstract: An electronic device and a hinge thereof are disclosed. The hinge includes a base, a first link, a second link, a third link and an elastic member. The first link is pivoted to the base and rotatable about a first axis. The first link includes a first groove. The second link is pivoted to the base and rotatable about a second axis. The third link includes a first end pivoted to the second link and a second end slidably joined to the first groove. The elastic member is disposed between the second link and the third link and propped against the second link and the third link.

Abstract: A method for bacterial genome editing includes: providing a bacterial cell; transforming a pCas9 plasmid and a pKD46 plasmid into the bacterial cell; co-transforming a pCRISPR::LacZ plasmid and an exogenous DNA into the bacterial cell carrying the pCas9 plasmid and the pKD46 plasmid, so as to obtain a strain broth; and spreading the strain broth on a culture medium to conduct cultivation.

Abstract: A molded interconnecting substrate has an embedded redistribution layer (RDL), an embossed RDL, a plurality of conductive pillars encapsulated in a molding core, and a chip also encapsulated in the molded core. The conductive pillars are disposed on the external pads of the embedded RDL. The chip is die-bonded onto the embedded RDL. The molding core has an external surface and an opposing component-installing surface. The embedded RDL is embedded in the molding core from the external surface. The bottom surface of the embedded RDL is coplanar to the external surface and the pillar-top surfaces of the conductive pillars are coplanar to the component-installing surface. The embossed RDL is disposed on and extruded from the component-installing surface including a plurality of pillar-top pads aligned and bonded to the pillar-top surfaces.

Abstract: Disclosed is a semiconductor package with Pillar-Top-Interconnection (PTI) configuration, comprising a redistribution layer (RDL) formed on a carrier plane, a plurality of metal pillars disposed on the RDL, a chip bonded onto the RDL, and a molding core. The molding core is formed on the carrier plane and has a bottom surface defined by the carrier plane so that the RDL is embedded inside the molding core. The package thickness of the molding core is greater than the chip-bonding height of the chip so that the chip is completely embedded inside the molding core. The metal pillars are encapsulated at the peripheries of the molding core with a plurality of pillar top portions exposed from the molding core. The exposed pillar top portions are reentrant from a top surface of the molding core and uneven. Accordingly, it realizes the effects of ultra-thin and smaller footprint POP stacked assembly with fine pitch vertically electrical connections in POP structure.

Abstract: A nitride light-emitting diode including: a substrate with sub-micro patterns over the surface, which is divided into a growth region and a non-growth region; a growth blocking layer, formed in the non-growth region of the substrate for blocking epitaxial growth in the non-growth region of the substrate; a light-emitting epitaxial layer, comprising an n-type layer, a light-emitting layer and a p-type layer, formed in the growth region of the substrate, which extends to the non-growth region through lateral epitaxy and covers the growth blocking layer; wherein, the refractive index of the growth blocking layer is less than that of the light-emitting epitaxial layer and the growth blocking layer forms undulating morphology along the sub-micro patterns of the substrate, thus increasing light extraction interface of LED, generating refractive index difference between the light-emitting epitaxial layer and the light extraction interface and improving light extraction efficiency.

Abstract: A docking station adapted to an electrical device is provided. The docking station includes a base and an input device. The base has a supporting portion and a bottom plate portion. A first angle is formed between the supporting portion and the bottom plate portion. The electrical device is adapted to be supported on the supporting portion. The input device has an input portion and a leaning portion. The leaning portion leans against the supporting portion. A second angle is formed between the input portion and the leaning portion. When the supporting portion is bent relatively to the bottom plate portion to change the first angle, the supporting portion drives the input portion and the leaning portion to be bent correspondingly to change the second angle. In addition, an electrical apparatus including the docking station and the electrical device is also provided.

Abstract: A lock including a lock cylinder, at least one sensing module and a processing unit is provided. The lock cylinder is adapted for allowing a unlocking unit to insert therein along an inserting direction. The at least one sensing module detects a movement of the lock cylinder. The processing unit electrically connected to the at least one sensing module. The sensing module generates a sensing signal to the processing unit according to the movement of the lock cylinder.

Abstract: A light emitting module includes a lens and first and second light sources aligning with the lens. The lens includes a first biconcave section having a first light-entrance concave surface and a first light-exit concave surface, a second biconcave section having a second light-entrance concave surface and a second light-exit concave surface, and a shared section having a light-exit shared surface. A tangent slope of the shared section where the light-exit shared surface is connected to the first light-exit concave surface is less than a tangent slope of the first biconcave section where the first light-exit concave surface is connected to the light-exit shared surface. A tangent slope of the shared section where the light-exit shared surface is connected to the second light-exit concave surface is larger than a tangent slope of the second biconcave section where the second light-exit concave surface is connected to the light-exit shared surface.

Abstract: Message matching methods for use in a message matching system are provided. The message matching system includes a first electronic device, a server and at least one second electronic device. The method includes the steps of: receiving, by the server, a first message from the first electronic device; finding, by the server, at least one second message corresponding to the first message from a database based on the content of the first message; determining, by the server, whether the at least one second message matches the first message; and if so, transmitting, by the server, the at least one second message to the first electronic device and the first message to a second electronic device corresponding to the at least one second message respectively, wherein the second message has content corresponding to that of the first message and is sent by an unknown source.

Abstract: An electronic apparatus includes a base and an electronic device. The base includes a first main body and at least one first connection portion. The first connection portion includes a rotating component, and the rotating component is pivoted to the first main body and has a driven portion and a positioning portion. The electronic device includes a second main body and at least one second connection portion. The second connection portion includes an elastic component and a positioning trench. The elastic component is connected to the second main body, and the positioning trench is formed on the second main body. When the base supports the electronic device so that the first connection portion is aligned to the second connection portion, the elastic component pushes the driven portion such that the positioning portion is engaged into the positioning trench.

Abstract: Disclosed are a light emitting diode having an n-doped ohm contact buffer layer and a manufacturing method therefor. In the present invention, a highly n-doped ohm contact buffer layer with an electronic concentration up to 1×1018 cm3 is formed on the n side of a light emitting epitaxy layer; when a growth substrate is removed, the n-type ohm contact buffer layer on the surface is exposed, which is a no-nitride polarity-face n-type GaN base material with a lower energy gap; an n-type ohm contact electrode is prepared on the n-type ohm contact buffer layer and follows the Ti/Al ohm contact electrode, which can overcome the problem of the existing vertical gallium nitride-based vertical light emitting diode that the voltage of the thin film GaN base light emitting device is unreliable because the ohm contact electrode on the nitride-face GaN base semiconductor layer is easy to crack due to temperature.

Abstract: An alignment structure including a first casing, a first magnetic component, a second casing and a second magnetic component is provided. The first magnetic component is disposed at the first casing and has a first surface, and the first surface is a non-planar surface. The second magnetic component is disposed at the second casing and has a second surface, and the second surface is a non-planar surface. When the second casing leans against the first casing, the first surface and the second surface are facing each other, and a magnetic attraction between the first magnetic component and the second magnetic component guides the second magnetic component to be aligned to the first magnetic component, and stops the second casing from being separated from the first casing.

Abstract: A camera controlling method is applied to a camera device. The camera device includes a plurality of image capturing modules and a plurality of light sources. Each light source is disposed at a position corresponding to at least one image capturing module. The plurality of image capturing modules is disposed adjacent to each other for capturing images. The camera controlling method includes receiving the image captured by each image capturing module sequentially according to a receiving sequence and turning on the light source corresponding to the next image capturing module when receiving the image captured by each image capturing module.

Abstract: An electronic device including a first body and a second body is provided. The first body has a first connection end. The second body has a second connection end, in which the second connection end has a first magnetic component and a first convex arc surface, and the second body is detachably connected to the first body through a magnetic attractive force between the first magnetic component and the first connection end. The first body and the second body are configured to rotate around a rotation axis relatively to each other, and the first convex arc surface faces the first connection end and extends along a direction parallel to the rotation axis.

Abstract: A Group-III nitrides epitaxial structure includes a Si substrate, and a Group-III nitrides layer disposed over the Si substrate, wherein an interface structure of “coexistence of Al atoms and SixNy” between the Si substrate and the Group-III nitrides. Al atoms are configured to be absorbed to the Si substrate and connect the Group-III nitrides; and SixNy are configured to release mismatch stress caused by heteroepitaxy. A fabricating method comprises: (1) providing a Si substrate; (2) forming an interface structure over a surface of the Si substrate , wherein the interface structure is arranged with both Al atoms and SixNy, which are then cladded by an AlN epitaxial layer; and (3) growing Group-III nitrides over the interface structure wherein the Al atoms are configured to be absorbed to the Si substrate and connect the Group-III nitrides and the SixNy is configured to release mismatch stress generated by heteroepitaxy.

Abstract: An integrated controller for electronic apparatuses includes a host and an AC/DC converting module. The host includes at least one power terminal set to connect to an electronic apparatus. The power terminal set includes a power input terminal, a power output terminal and a power neutral terminal. The power input terminal is connected to a fire wire to receive AC power. The power output terminal is connected to a wire-input end of the electronic apparatus, and the power neutral terminal is connected to a wire-output end of the electronic apparatus. Therefore, the AC/DC converting module receives the AC power via the power input terminal and the power neutral terminal and converts the AC power to DC power which is required by the integrated controller. The integrated controller is mounted in an original position for a wall-embedded switch is positioned to replace the wall-embedded switch.