Abstract: A Cas9 expression plasmid, a genome editing system and a genome editing method for Escherichia coli are provided. The Cas9 expression plasmid includes a tracrRNA sequence, a Cas9 gene and a chloramphenicol resistance gene (CmR). The Cas9 expression plasmid is applied to CRISPR/Cas-coupled ?-red recombineering system for editing genomes of E. coli with high efficiency.

Abstract: A slide rail assembly includes a first rail, a second rail, a blocking base, a ball retainer and a blocking member. The second rail is movable relative to the first rail. The blocking base is arranged on the first rail and has a limiting part. The ball retainer is configured to facilitate the second rail to move relative to the first rail. The ball retainer has a contact part. When the blocking member is in a first state, the blocking member is configured to push the contact part of the ball retainer to move the ball retainer in response to a movement of the second rail until the blocking member abuts against the limiting part of the blocking base. When the blocking member is in a second state, the blocking member no longer abuts against the limiting part of the blocking base.

Abstract: A pivot structure includes a base, a bracket, an elastic component, and a positioning assembly. The bracket is rotatably connected to the base. The elastic component is disposed on the base. The positioning assembly includes an elastic clip and a pillar. The elastic clip is pivoted to the base and has a first releasing segment and a first positioning segment. The pillar is connected to the bracket and has a second positioning segment. The pillar is rotatably clipped in the elastic clip. The bracket is adapted to be expanded to a first expanding state through an elastic force of the elastic component, so as to drive the second positioning segment to move along the first releasing segment. The bracket is adapted to receive an external force to be further expanded to a second expanding state, so as to drive the second positioning segment to move to the first positioning segment.

Abstract: An electronic device and a hinge thereof are disclosed. The hinge includes a base, a first link, a second link, a third link and an elastic member. The first link is pivoted to the base and rotatable about a first axis. The first link includes a first groove. The second link is pivoted to the base and rotatable about a second axis. The third link includes a first end pivoted to the second link and a second end slidably joined to the first groove. The elastic member is disposed between the second link and the third link and propped against the second link and the third link.

Abstract: A slide rail assembly includes a first rail, a second rail, a first locking device and a second locking device. The first rail includes a blocking part. The first locking device is arranged on the second rail and configured to lock the blocking part of the first rail when the second rail is moved to a first predetermined position relative to the first rail. The second locking device is arranged on the second rail and configured to lock the blocking part of the first rail when the second rail is moved to a second predetermined position relative to the first rail.

Abstract: A cable management device adapted for a slide rail assembly includes a first tray, a second tray, and a cable chain. The second tray is connected to the first tray in an extendable and retractable manner in order to move with respect to the first tray and thus enter a retracted state or an extended state. The cable chain is connected to the first tray.

Abstract: An electronic device includes a body, a stand and a sliding member. The stand is rotatably connected to the body. The sliding member is slidably disposed on the body and has at least one stopping portion and at least one pushing portion. When the sliding member is located at a first position, the stopping portion interferes with the stand to stop the stand from expanding from the body. When the sliding member slides relative to the body to be away from the first position, the stopping portion releases the stand and the pushing portion pushes the stand to drive the stand to rotate and expand from the body.

Abstract: An electronic apparatus includes a base and an electronic device. The base includes a first main body and at least one first connection portion. The first connection portion includes a rotating component, and the rotating component is pivoted to the first main body and has a driven portion and a positioning portion. The electronic device includes a second main body and at least one second connection portion. The second connection portion includes an elastic component and a positioning trench. The elastic component is connected to the second main body, and the positioning trench is formed on the second main body. When the base supports the electronic device so that the first connection portion is aligned to the second connection portion, the elastic component pushes the driven portion such that the positioning portion is engaged into the positioning trench.

Abstract: A medical system includes an interaction interface and an analysis engine. The interaction interface is configured for receiving an initial symptom. The analysis engine is communicated with the interaction interface. The analysis engine includes a prediction module. The prediction module is configured for generating symptom inquiries to be displayed on the interaction interface according to a prediction model and the initial symptom. The interaction interface is configured for receiving responses corresponding to the symptom inquiries. The prediction module is configured to generate a result prediction according to the prediction model, the initial symptom and the responses.

Abstract: A slide rail assembly includes a first rail, a second rail and at least one supporting member. The first rail has a first end and a second end opposite to the first end. The second rail is movable relative to the first rail. The second rail has a recessed part. The at least one supporting member is movably mounted between the first rail and the second rail. A portion of the at least one supporting member is accommodated in the recessed part. The at least one supporting member is configured to support the second rail. Wherein, when the at least one supporting member is moved from a first position to a second position, the portion of the at least one supporting member is extended beyond the first end of the first rail.

Abstract: A pivot structure includes a base, a bracket, an elastic component, and a positioning assembly. The bracket is rotatably connected to the base. The elastic component is disposed on the base. The positioning assembly includes an elastic clip and a pillar. The elastic clip is pivoted to the base and has a first releasing segment and a first positioning segment. The pillar is connected to the bracket and has a second positioning segment. The pillar is rotatably clipped in the elastic clip. The bracket is adapted to be expanded to a first expanding state through an elastic force of the elastic component, so as to drive the second positioning segment to move along the first releasing segment. The bracket is adapted to receive an external force to be further expanded to a second expanding state, so as to drive the second positioning segment to move to the first positioning segment.

Abstract: Disclosed is a semiconductor package with Pillar-Top-Interconnection (PTI) configuration, comprising a redistribution layer (RDL) formed on a carrier plane, a plurality of metal pillars disposed on the RDL, a chip bonded onto the RDL, and a molding core. The molding core is formed on the carrier plane and has a bottom surface defined by the carrier plane so that the RDL is embedded inside the molding core. The package thickness of the molding core is greater than the chip-bonding height of the chip so that the chip is completely embedded inside the molding core. The metal pillars are encapsulated at the peripheries of the molding core with a plurality of pillar top portions exposed from the molding core. The exposed pillar top portions are reentrant from a top surface of the molding core and uneven. Accordingly, it realizes the effects of ultra-thin and smaller footprint POP stacked assembly with fine pitch vertically electrical connections in POP structure.

Abstract: A stackable semiconductor package and manufacturing method thereof are provided. The stackable semiconductor package includes carrier, first RDL, encapsulation layer, vertical interposers, second RDL, and chip. The carrier has first surface in which the first RDL and the encapsulation layer are formed thereon. The first RDL includes first pads and second pads. The encapsulation layer covers the first RDL and has outer surface. The vertical interposers are disposed in the encapsulation layer to electrically connect with the first RDL. The second RDL is formed on the outer surface to electrically connect with the vertical interposers. The carrier includes terminal holes and chip-accommodating hole. The terminal holes correspondingly expose the second pads. The chip-accommodating hole exposes the first pads. The chip is mounted on the encapsulation layer through the chip-accommodating hole to electrically connect with the first pads.

Abstract: A docking station adapted to an electrical device is provided. The docking station includes a base and an input device. The base has a supporting portion and a bottom plate portion. A first angle is formed between the supporting portion and the bottom plate portion. The electrical device is adapted to be supported on the supporting portion. The input device has an input portion and a leaning portion. The leaning portion leans against the supporting portion. A second angle is formed between the input portion and the leaning portion. When the supporting portion is moved relatively to the bottom plate portion to change the first angle, the supporting portion drives the input portion and the leaning portion to be moved correspondingly to change the second angle. In addition, an electrical apparatus including the docking station and the electrical device is also provided.

Abstract: A stylus suitable for an electronic device is provided. The stylus comprises a pen barrel and a pen core. The pen barrel has a sidewall and at least one first protrusion, and the first protrusion is located at an inner side of the sidewall. The pen core movably passes through the pen barrel. The pen core has a pen tip and at least one second protrusion. Under a first status, the first protrusion and the second protrusion are dislocated from each other. Under a second status, the first protrusion and the second protrusion are aligned with each other to make a part of pen barrel expand and deform.

Abstract: A Cas9 expression plasmid, a genome editing system and a genome editing method for Escherichia coli are provided. The Cas9 expression plasmid includes a tracrRNA sequence, a Cas9 gene and a chloramphenicol resistance gene (CmR). The Cas9 expression plasmid is applied to CRISPR/Cas-coulped ?-red recombineering system for editing genomes of E. coli with high efficiency.

Abstract: A lighting emitting diode including: an n side layer and a p side layer formed by nitride semiconductors respectively; an active layer comprising a nitride semiconductor is between the n side layer and the p side layer; wherein, the n-side layer is successively laminated by an extrinsically-doped buffer layer and a compound multi-current spreading layer; the compound multi-current spreading layer is successively-laminated by a first current spreading layer, a second current spreading layer and a third current spreading layer; the first current spreading layer and the third current spreading layer are alternatively-laminated layers comprising a u-type nitride semiconductor layer and an n-type nitride semiconductor layer; the second current spreading layer is a distributed insulation layer formed on the n-type nitride semiconductor layer; and the first current spreading layer is adjacent to the extrinsically-doped buffer layer; and the third current spreading layer is adjacent to the active layer.