Patents by Inventor Hsiu-Jen Lin

Hsiu-Jen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9281288
    Abstract: A fine pitch package-on-package (PoP), and a method of forming, are provided. The PoP may be formed by placing connections, e.g., solder balls, on a first substrate having a semiconductor die attached thereto. A first reflow process is performed to elongate the solder balls. Thereafter, a second substrate having another semiconductor die attached thereto is connected to the solder balls. A second reflow process is performed to form an hourglass connection.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: March 8, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chung Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 9263412
    Abstract: An embodiment is a method including forming a first package and a second package. The first package includes packaging a first die, forming a plurality of solder balls on the first die, and coating the plurality of solder balls with an epoxy flux. The second package includes forming a first electrical connector, attaching a second die adjacent the first electrical connector, forming a interconnect structure over the first die and the first electrical connector, the interconnect structure being a frontside of the second package, forming a second electrical connector over the interconnect structure, and the second electrical connector being coupled to both the first die and the first electrical connector. The method further includes bonding the first package to the backside of the second package with the plurality of solder balls forming a plurality of solder joints, each of the plurality of solder joints being surrounded by the epoxy flux.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: February 16, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Wei-Yu Chen, Hsiu-Jen Lin, Kuei-Wei Huang
  • Patent number: 9230935
    Abstract: A package on package structure includes a first substrate having a first region and a second region, a bump formed on the first region of the first substrate, a first semiconductor die bonded to the second region of the first substrate, and a semiconductor die package bonded to the first substrate. The bump includes a metallic structure and a plurality of minor elements dispersed in the metallic structure. The semiconductor die package includes a connector bonded to the bump, and the first semiconductor die is between the semiconductor die package and the first substrate.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: January 5, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Cheng Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150318264
    Abstract: Semiconductor dies are bonded to each other and electrically connected to each other. An encapsulant is utilized to protect the semiconductor dies and external connections are formed to connect the semiconductor dies within the encapsulant. In an embodiment the external connections may comprise conductive pillars, conductive reflowable material, or combinations of such.
    Type: Application
    Filed: November 17, 2014
    Publication date: November 5, 2015
    Inventors: Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Meng-Tse Chen, Hui-Min Huang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150249062
    Abstract: Reflow processes and apparatuses are disclosed. A process includes enclosing a package workpiece in an enclosed environment of a chamber of a reflow tool; causing an oxygen content of the enclosed environment of the chamber to be less than 40 ppm; and performing a reflow process in the enclosed environment of the chamber while the oxygen content is less than 40 ppm. An apparatus includes a reflow chamber, a door to the reflow chamber, an energy source in the reflow chamber, and gas supply equipment coupled to the chamber. The door is operable to enclose an environment in the reflow chamber. The energy source is operable to increase a temperature in the environment in the reflow chamber. The gas supply equipment is operable to provide a gas to the reflow chamber.
    Type: Application
    Filed: February 28, 2014
    Publication date: September 3, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ai-Tee Ang, Hsiu-Jen Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150243642
    Abstract: A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.
    Type: Application
    Filed: May 7, 2015
    Publication date: August 27, 2015
    Inventors: Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150243620
    Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
    Type: Application
    Filed: February 26, 2014
    Publication date: August 27, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: WEI-HUNG LIN, HSIU-JEN LIN, MING-DA CHENG, YU-MIN LIANG, CHEN-SHIEN CHEN, CHUNG-SHI LIU
  • Publication number: 20150206779
    Abstract: Presented herein is a device comprising a device processing boat comprising a base at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit, the at least one recess aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base and having the sensel configured to sense a clamping force applied by the cover to the at least one unit.
    Type: Application
    Filed: January 20, 2014
    Publication date: July 23, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ai-Tee Ang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150201462
    Abstract: Systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a system for processing semiconductor devices includes a radiation energy source, a support, and a tool disposable between the support and the radiation energy source. The tool includes apertures adapted to retain a package component over the support. The system includes a cooling device proximate the support.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 16, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsiu-Jen Lin, Wei-Yu Chen, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 9082636
    Abstract: Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: July 14, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen, Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu, Bor-Ping Jang, Hsiu-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin
  • Publication number: 20150171051
    Abstract: Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a tool for processing semiconductor devices includes a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 18, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150145130
    Abstract: The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: HSIU-JEN LIN, WEN-HSIUNG LU, CHENG-TING CHEN, HSUAN-TING KUO, WEI-YU CHEN, MING-DA CHENG, CHUNG-SHI LIU
  • Patent number: 9030022
    Abstract: A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: May 12, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150108638
    Abstract: A package on package structure includes a first substrate having a first region and a second region, a bump formed on the first region of the first substrate, a first semiconductor die bonded to the second region of the first substrate, and a semiconductor die package bonded to the first substrate. The bump includes a metallic structure and a plurality of minor elements dispersed in the metallic structure. The semiconductor die package includes a connector bonded to the bump, and the first semiconductor die is between the semiconductor die package and the first substrate.
    Type: Application
    Filed: December 1, 2014
    Publication date: April 23, 2015
    Inventors: Chun-Cheng Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150091193
    Abstract: A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 2, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150061115
    Abstract: A conductive interconnect structure includes a contact pad; a conductive body connected to the contact pad at a first end; and a conductive layer positioned on a second end of the conductive body. The conductive body has a longitudinal direction perpendicular to a surface of the contact pad. The conductive body has an average grain size (a) on a cross sectional plane (Plane A) whose normal is perpendicular to the longitudinal direction of the conductive body. The conductive layer has an average grain size (b) on Plane A. The conductive body and the conductive layer are composed of same material, and the average grain size (a) is greater than the average grain size (b).
    Type: Application
    Filed: August 29, 2013
    Publication date: March 5, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: MENG-TSE CHEN, HSIU-JEN LIN, CHIH-WEI LIN, MING-DA CHENG, CHIH-HANG TUNG, CHUNG-SHI LIU
  • Publication number: 20150044819
    Abstract: Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.
    Type: Application
    Filed: October 24, 2014
    Publication date: February 12, 2015
    Inventors: Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen, Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu, Bor-Ping Jang, Hsiu-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin
  • Publication number: 20150008581
    Abstract: A method of packaging includes placing a package component over a release film, wherein solder regions on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder regions remain in physical contact with the release film.
    Type: Application
    Filed: September 23, 2014
    Publication date: January 8, 2015
    Inventors: Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu, Hsiu-Jen Lin, Wen-Hsiung Lu, Chih-Wei Lin, Yu-Peng Tsai, Kuei-Wei Huang, Chun-Cheng Lin
  • Patent number: 8927391
    Abstract: A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: January 6, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chih-Wei Lin, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20140367867
    Abstract: An embodiment is a method including forming a first package and a second package. The first package includes packaging a first die, forming a plurality of solder balls on the first die, and coating the plurality of solder balls with an epoxy flux. The second package includes forming a first electrical connector, attaching a second die adjacent the first electrical connector, forming a interconnect structure over the first die and the first electrical connector, the interconnect structure being a frontside of the second package, forming a second electrical connector over the interconnect structure, and the second electrical connector being coupled to both the first die and the first electrical connector. The method further includes bonding the first package to the backside of the second package with the plurality of solder balls forming a plurality of solder joints, each of the plurality of solder joints being surrounded by the epoxy flux.
    Type: Application
    Filed: August 29, 2014
    Publication date: December 18, 2014
    Inventors: Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Wei-Yu Chen, Hsiu-Jen Lin, Kuei-Wei Huang