Patents by Inventor Hua Feng

Hua Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150004823
    Abstract: A smart card securing mechanism for securing a first smart card and a second smart card includes a base, a first latching member, a second latching member, and an elastic sheet. The base includes a first connector. The first latching member is positioned on one side of the base. The second latching member includes a second connector and is positioned on another side of the base. The elastic sheet is mounted to the base. The first smart card is received in a space defined between the base and the first latching member. The second smart card is received in a space defined between the base and the second latching member. The elastic sheet abuts against the second smart card.
    Type: Application
    Filed: November 5, 2013
    Publication date: January 1, 2015
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: BAI-HANG WAN, HUA-FENG HAO
  • Patent number: 8920748
    Abstract: The present invention relates to a biochip with a piezoelectric element for ultrasonic standing wave generation. The biochip comprises an upper module, a lower module, and a chemical sensor. The piezoelectric element is integrated within the upper module of the biochip. The piezoelectric element can generate ultrasonic standing waves (USW) in the reaction chamber of the biochip by manipulating the operation frequency so the particles being detected can effectively move toward the QCM sensing surface. Hence, the biochip significantly increases the sensitivity and reduces the time required to reach equilibrium when undergoing USW excitation. The biochip of the present invention can be broadly applied to the bio-detection in medical and pharmaceutical fields.
    Type: Grant
    Filed: May 2, 2011
    Date of Patent: December 30, 2014
    Assignee: National Chung Cheng University
    Inventors: Guo-Hua Feng, Lai-Kwan Chau, Shu-Xiang Yang
  • Publication number: 20140356301
    Abstract: The present invention is related to a galactolipids-enriched plant extract, prepared by extracting a plant sample selected from a group consisting of: Gynura divaricata subsp. formosana (Asteraceae) (GD), Murdannia bracteata (C. B. Clarke) J. K. Morton ex D. Y. Hong (Commelinaceae) (MB), and Crassocephalum rabens S. Moore (Asteraceae) (CR) with a series of solvents. A pharmaceutical, nutritional, or healthcare composition for protecting or treating acute fulminant hepatitis, for protecting or treating sepsis or related indication thereof, and a composition for skin whitening are also provided herein. These compositions all comprise effective amounts of the galactolipids-enriched plant extracts or purified compounds thereof as bioactive ingredients.
    Type: Application
    Filed: June 3, 2014
    Publication date: December 4, 2014
    Applicant: Academia Sinica
    Inventors: Lie-Fen SHYUR, Jia-Hua FENG, Maria Karmella APAYA
  • Publication number: 20140359053
    Abstract: Techniques, systems, and articles of manufacture for coordinating application migration processes. A method includes selecting at least one migration service for an application based on analysis of application information and information pertaining to multiple migration services, creating a migration plan to migrate the application to a target cloud based on the at least one selected migration service, and executing the migration plan, utilizing the at least one selected migration service, to migrate the application to the target cloud.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 4, 2014
    Applicant: International Business Machines Corporation
    Inventors: Kamal K. Bhattacharya, Chen Hua Feng, Yun-Wu Huang, Ying Huang, Hani Jamjoom, Pu Jin, Fan Jing Meng, Michael Montinarelli, Mark E. Podlaseck, Zon-Yin Shae, Daniel J. Williams
  • Publication number: 20140359128
    Abstract: Systems and articles of manufacture for coordinating application migration processes include selecting at least one migration service for an application based on analysis of application information and information pertaining to multiple migration services, creating a migration plan to migrate the application to a target cloud based on the at least one selected migration service, and executing the migration plan, utilizing the at least one selected migration service, to migrate the application to the target cloud.
    Type: Application
    Filed: August 19, 2013
    Publication date: December 4, 2014
    Inventors: Kamal K. Bhattacharya, Chen Hua Feng, Yun-Wu Huang, Ying Huang, Hani Jamjoom, Pu Jin, Fan Jing Meng, Michael Montinarelli, Mark E. Podlaseck, Zon-Yin Shae, Daniel J. Williams
  • Patent number: 8900260
    Abstract: A surgical milling cutter includes a milling cutter bracket, a locking device and a bottom electric motor connected successively. The milling cutter bracket includes a fixing seat with a through hole. A finger guide apparatus with an L-type first bracket at the top end thereof is provided on the upper part of the fixing seat. The end of the L-type first bracket's short side is provided with a downward projection. The lowest point of the projection is lower than that of the milling cutter's cylindrical head when the milling cutter is working normally. The surgical milling cutter utilizes the projection to prevent the possibility of an object contacting with the cylindrical head, thus avoiding an object being cut unevenly. Meanwhile, the L-type bracket can be driven by the finger guide apparatus to rotate so as to change the running direction of the milling cutter, thus facilitating surgical procedures.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: December 2, 2014
    Assignee: Chongqing Runze Pharmaceutical Co., Ltd
    Inventors: Lei Ye, Jian Zhou, Hua Feng, Fei Li, Hengyang Zhu, Congxiao Li
  • Publication number: 20140349458
    Abstract: A device includes a semiconductor fin over a substrate, a gate dielectric on sidewalls of the semiconductor fin, and a gate electrode over the gate dielectric. A source/drain region is on a side of the gate electrode. A dislocation plane is in the source/drain region.
    Type: Application
    Filed: August 12, 2014
    Publication date: November 27, 2014
    Inventors: Zhiqiang Wu, Wen-Hsing Hsieh, Hua Feng Chen, Ting-Yun Wu, Carlos H. Diaz, Tzer-Min Shen, Ya-Yun Cheng
  • Publication number: 20140350978
    Abstract: This document publishes a method, a device and a storage medium for reservation based on panoramic map. In one embodiment, the method includes the following steps: obtaining and displaying a panoramic map corresponding to a destination, the panoramic map having a plurality of reservations displayed thereon; detecting a navigation operation on the panoramic map by a user; in response to the navigation operation, displaying a part of the panoramic map corresponding to the navigation operation; receiving a selection request for selecting a reservation from the plurality of reservations on the part of the panoramic map; and sending the selection request to a server. According to the method, the device and the storage medium, it is possible to know the actual location and surroundings of various tables in the real world when the user makes reservation, so the intuition and accuracy of reservation is significantly improved.
    Type: Application
    Filed: August 9, 2014
    Publication date: November 27, 2014
    Inventor: HUA-FENG LI
  • Patent number: 8897012
    Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: November 25, 2014
    Assignees: Inventec (Pudong) Technology Corporation, Inventec Corporation
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chih-Kai Yang, Wei-Hsin Wu, Hua-Feng Chen, Ming-Hung Lin
  • Patent number: 8866235
    Abstract: A device includes a semiconductor fin over a substrate, a gate dielectric on sidewalls of the semiconductor fin, and a gate electrode over the gate dielectric. A source/drain region is on a side of the gate electrode. A dislocation plane is in the source/drain region.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: October 21, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zhiqiang Wu, Wen-Hsing Hsieh, Hua Feng Chen, Ting-Yun Wu, Carlos H. Diaz, Ya-Yun Cheng, Tzer-Min Shen
  • Patent number: 8825855
    Abstract: A method and apparatus for Single Sign-on, wherein the user accesses a platform server and at least one service provider on the platform server. The method includes intercepting a request sent by the user via a client browser and extracting a domain name included in the request. If the domain name is an original domain name of the platform server, a global session ID is generated for uniquely identifying a session between the user and the platform server. A new domain name of the platform server associated with the global session ID is generated and the URL in the request is redirected to a new URL including the new domain name of the platform server. The request, including the new URL of the platform server, is forwarded to the platform server.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: September 2, 2014
    Assignee: International Business Machines Corporation
    Inventors: Chen Hua Feng, Kai Tang, Yun Tao Wang, Jian Ming Zhang
  • Publication number: 20140131812
    Abstract: A device includes a semiconductor fin over a substrate, a gate dielectric on sidewalls of the semiconductor fin, and a gate electrode over the gate dielectric. A source/drain region is on a side of the gate electrode. A dislocation plane is in the source/drain region.
    Type: Application
    Filed: November 9, 2012
    Publication date: May 15, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zhiqiang Wu, Wen-Hsing Hsieh, Hua Feng Chen, Ting-Yun Wu, Carlos H. Diaz, Ya-Yun Cheng, Tzer-Min Shen
  • Publication number: 20140116655
    Abstract: A heat dissipation module includes multiple heat sink fins. The heat sink fins are assembled to one another along an assembly axis, and each of the heat sink fins includes a main body and an extension plate. The extension plate extends from one side of the main body towards an opposite side of the main body. An acute angle is formed between the extension plate and the main body. Each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.
    Type: Application
    Filed: March 13, 2013
    Publication date: May 1, 2014
    Applicants: INVENTEC CORPORATION, Inventec (Pudong) Technology Corporation
    Inventors: Yi-Lun Cheng, Chih-Kai Yang, Hua-Feng Chen
  • Publication number: 20140090819
    Abstract: A heat dissipation device includes a fan module, a first plate structure and a fin assembly. The fan module includes a fan outlet. The first plate structure is disposed at the fan outlet. The thermal conductance of the first plate structure is above 100 W/(m·K). The first plate structure includes a heat-absorbing and a heat-dissipation surface. The heat-absorbing surface includes a heat-absorbing region in thermal contact with a heat source. The heat-dissipation surface includes a heat-dissipation region. The fin assembly is disposed on the heat-dissipation surface and in thermal contact with the heat-dissipation surface. The fan module is adapted to exhaust an air flow flowing above the heat-dissipation surface via the fan outlet. The air flow flows through the heat-dissipation region before through the fin assembly. The distance between the fan outlet and the heat-dissipation region is greater than the distance between the fan outlet and the fin assembly.
    Type: Application
    Filed: March 16, 2013
    Publication date: April 3, 2014
    Applicants: INVENTEC CORPORATION, Inventec (Pudong) Technology Corporation
    Inventors: Wei-Yi Lin, Ting-Chiang Huang, Te-Chuan Wang, Hua-Feng Chen, Li-Ting Wang
  • Publication number: 20140079544
    Abstract: A fan structure used for connecting with a plate body includes a main body, a fan blade, a sliding member and a locating member. The main body has an accommodating space and an adjustment slot. The fan blade is pivotally disposed on the main body and is located inside the accommodating space. The sliding member has a base and a joining portion. The base is accommodated in the adjustment slot. The sliding member is joined to the plate body through the joining portion. The locating member is used for joining the sliding member and the main body together, so as to fix the relative position of the sliding member and the main body.
    Type: Application
    Filed: March 11, 2013
    Publication date: March 20, 2014
    Applicants: INVENTEC CORPORATION, INVENTEC (PUDONG) TECHNOLOGY CORPORATION
    Inventors: Hua-Feng Chen, Ting-Chiang Huang, Te-Chuan Wang
  • Publication number: 20130341731
    Abstract: A semiconductor structure can include a resistor on a substrate formed simultaneously with other devices, such as transistors. A diffusion barrier layer formed on a substrate is patterned to form a resistor and barrier layers under a transistor gate. A filler material, a first connector, and a second connector are formed on the resistor at the same manner and time as the gate of the transistor. The filler material is removed to form a resistor on a substrate.
    Type: Application
    Filed: June 26, 2012
    Publication date: December 26, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hua Feng Chen, Shu-Hui Wang, Mu-Chi Chiang
  • Publication number: 20130328704
    Abstract: According to an exemplary embodiment, a serializer includes upper and lower shift registers configured to perform a load function where parallel input data is loaded from a parallel input bus and a shift function where the parallel input data is shifted to an output register. The upper shift register is configured to perform the load function while the lower shift register performs the shift function, and the lower shift register is configured to perform the load function while the upper shift register performs the shift function. An output register is configured to alternately receive the parallel input data from the upper shift register and the parallel input data from the lower shift register. The upper and lower shift registers and the output register can comprise scan flip-flops.
    Type: Application
    Filed: August 15, 2013
    Publication date: December 12, 2013
    Applicant: Broadcom Corporation
    Inventors: Hua-Feng Chen, Karthik Chandrasekharan, Ramamurthy Gorti, Gregory Djaja, Douglas Smith
  • Publication number: 20130294030
    Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.
    Type: Application
    Filed: December 14, 2012
    Publication date: November 7, 2013
    Applicants: INVENTEC CORPORATION, Inventec (Pudong) Technology Corporation
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chih-Kai Yang, Wei-Hsin Wu, Hua-Feng Chen, Ming-Hung Lin
  • Publication number: 20130279624
    Abstract: According to an exemplary implementation, a transmitter includes a decoder circuit receiving a digital input from a digital back-end circuit. The decoder circuit includes a plurality of decoder cells. Each of the plurality of decoder cells is configured to drive a respective current source cell in a current source circuit so as to convert the digital input into an analog output. Each of the plurality of decoder cells has respective decoder logic. Furthermore, the digital input from the digital back-end circuit is respectively received by each of the plurality of decoder cells.
    Type: Application
    Filed: September 24, 2012
    Publication date: October 24, 2013
    Applicant: BROADCOM CORPORATION
    Inventors: Silvian Spiridon, Johan van der Tang, Han Yan, Hua-Feng Chen
  • Publication number: 20130273711
    Abstract: A method for fabricating a device is disclosed. An exemplary method includes providing a substrate and forming a plurality of fins over the substrate. The method further includes forming a first opening in the substrate in a first longitudinal direction. The method further includes forming a second opening in the substrate in a second longitudinal direction. The first and second longitudinal directions are different. The method further includes depositing a filling material in the first and second openings.
    Type: Application
    Filed: April 17, 2012
    Publication date: October 17, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Chu Liu, Kuei-Shun Chen, Chih-Hsiung Peng, Chi-Kang Chang, Chiang Mu-Chi, Sheng-Yu Chang, Hua Feng Chen, Chao-Cheng Chen, Ryan Chia-Jen Chen