Patents by Inventor Hua Wei

Hua Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190258770
    Abstract: A method of manufacturing an integrated circuit (IC) includes receiving a layout of the IC having a first region interposed between two second regions. The layout includes a first layer having first features and second and third layer having second and third features in the first region. The second and third features collectively form cut patterns for the first features. The method further includes modifying the second and third features by a mask house tool, resulting in modified second and third features, which collectively form modified cut patterns for the first features. The modifying of the second and third features meets at least one of following conditions: total spacing between adjacent modified second (third) features is greater than total spacing between adjacent second (third) features, and total length of the modified second (third) features is smaller than total length of the second (third) features.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Inventors: Yun-Lin Wu, Cheng-Cheng Kuo, Chia-Ping Chiang, Chih-Wei Hsu, Hua-Tai Lin, Kuei-Shun Chen, Yuan-Hsiang Lung, Yan-Tso Tsai
  • Patent number: 10386718
    Abstract: A computer-implemented method includes modeling, using the computer, a photoresist profile in accordance with a magnitude of a gradient of an inhibitor concentration disposed in the photoresist. The photoresist is used during a process to form an integrated circuit. In one embodiment, the computer-implemented method further includes applying the modeled photoresist profile to reduce a distortion in a printed photoresist pattern caused by a response of the photoresist to an electromagnetic wave and/or particle beam during the process.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: August 20, 2019
    Assignee: SYNOPSYS, INC.
    Inventors: Cheng En Wu, Haiqing Wei, Qiaolin Zhang, Hua Song
  • Patent number: 10377945
    Abstract: Mixed halide scintillation materials of the general formula AB(1-y)MyX?wX?(3-w), where 0?y?1, 0.05?w?1, A may be an alkali metal, B may be an alkali earth metal, and X? and X? may be two different halogen atoms, and of the general formula A(1-y)BMyX?wX?(3-w), where 0?y?1, 0.05?w?1, A maybe an alkali metal, B may be an alkali earth metal, and X? and X? are two different halogen atoms. The scintillation materials of formula (1) include a divalent external activator, M, such as Eu2+ or Yb2+. The scintillation materials of formula (2) include a monovalent external activator, M, such as Tl+, Na+ and In+.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: August 13, 2019
    Assignee: UNIVERSITY OF TENNESSEE RESEARCH FOUNDATION
    Inventors: Luis Stand, Charles L. Melcher, Mariya Zhuravleva, Hua Wei
  • Publication number: 20190244849
    Abstract: Etch uniformity is improved by providing a thermal pad between an insert ring and electrostatic chuck in an etching chamber. The thermal pad provides a continuous passive heat path to dissipate heat from the insert ring and wafer edge to the electrostatic chuck. The thermal pad helps to keep the temperature of the various components in contact with or near the wafer at a more consistent temperature. Because temperature may affect etch rate, such as with etching hard masks over dummy gate formations, a more consistent etch rate is attained. The thermal pad also provides for etch rate uniformity across the whole wafer and not just at the edge. The thermal pad may be used in an etch process to perform gate replacement by removing hard mask layer(s) over a dummy gate electrode.
    Type: Application
    Filed: February 4, 2019
    Publication date: August 8, 2019
    Inventors: Chin-Huei Chiu, Tsung Fan Yin, Chen-Yi Liu, Hua-Li Hung, Xi-Zong Chen, Yi-Wei Chiu
  • Publication number: 20190237454
    Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.
    Type: Application
    Filed: August 1, 2018
    Publication date: August 1, 2019
    Inventors: Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang, Hsing-Kuo Hsia, Chih-Chieh Hung, Ying-Ching Shih, Chin-Fu Kao, Wen-Hsin Wei, Li-Chung Kuo, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20190191063
    Abstract: Disclosed are a lens driving device, a camera device and an electronic apparatus equipped with the lens driving device. When the lens driving device is mounted on the circuit board, the power supply terminal is less likely to fall off from the base. The lens driving device of the present disclosure includes a base, a lens support, and a driving mechanism that drives the lens support in the optical axial direction. The base is integrally provided with a power supply terminal mounted on an external circuit board and used for supplying power to the driving mechanism. A fall-off preventive portion is formed in at least a part of a contact portion that is in contact with the base on the power supply terminal.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 20, 2019
    Inventor: Hua Wei
  • Patent number: 10319400
    Abstract: A method includes moving a heat-assisted magnetic recording (HAMR) slider relative to a magnetic recording medium. The slider comprises a writer, a writer heater, and a near-field transducer (NFT). For each of a plurality of different head-to media spacings a test tone is written to a track of the medium, the test tone is read and a Discrete Fourier Transform (DFT) of an amplitude of the read test tone is captured. A first DFT curve is generated at a beginning of writing the test tones. A second DFT curve is generated at a saturated state of writing the test tones. An amount of horizontal shift between the first and second DFT curves is computed. The amount of horizontal shift corresponding to writer heater power required to compensate for NFT clearance offset due to laser induced writer protrusion.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: June 11, 2019
    Assignee: Seagate Technology LLC
    Inventors: Zhen Wei, Hua Liu
  • Patent number: 10319699
    Abstract: Structures and formation methods of a chip package are provided. The chip package includes a chip stack including a number of semiconductor dies. The chip package also includes a semiconductor chip, and the semiconductor chip is higher than the chip stack. The chip package further includes a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: June 11, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen
  • Publication number: 20190170355
    Abstract: A lean burn fuel injector comprises a fuel feed arm and a fuel injector head. The fuel feed arm has a single pilot fuel supply passage and a single main fuel supply passage extending there-through. The fuel injector head has a coaxial arrangement of an inner pilot air-blast fuel injector and a coaxially arranged outer main air-blast fuel injector. The inner pilot air-blast fuel injector comprises a coaxial arrangement of a pilot inner air swirler passage and a pilot outer air swirler passage. The outer main air-blast fuel injector comprises a coaxial arrangement of a main inner air swirler passage and a main outer air swirler passage. The single main fuel supply passage is arranged to supply main fuel to the main inner air swirler passage. The single pilot fuel supply passage is arranged to supply pilot fuel onto the pre-filming surfaces in the pilot inner and outer air swirler passages.
    Type: Application
    Filed: November 13, 2018
    Publication date: June 6, 2019
    Applicant: ROLLS-ROYCE plc
    Inventors: Luca TENTORIO, Hua Wei HUANG, Carl MULDAL, Juan Carlos ROMAN CASADO
  • Publication number: 20190148166
    Abstract: An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.
    Type: Application
    Filed: August 1, 2018
    Publication date: May 16, 2019
    Inventors: Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang, Chun-Che Chen, Jhih-Ming Lin, Chih-Ching Lin, Shih-Wen Huang, Chun Hua Chang, Tsung-Yang Hsieh
  • Patent number: 10290610
    Abstract: A PoP device includes a first package structure, a second package structure and an underfill layer is provided. The first package structure includes a die, a TIV and an encapsulant. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and a portion of sidewalls of the TIV. The second package structure is connected to the first package structure through a connector. The underfill layer is disposed to fill a space between the first package structure and the second package structure. A portion of the underfill layer is disposed between the encapsulant and the TIV to cover a portion of sidewalls of the TIV.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: May 14, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hui Cheng, Po-Hao Tsai, Wei-Yu Chen, Ming-Shih Yeh
  • Patent number: 10287309
    Abstract: The present invention relates to a disaccharide intermediate and a synthesis method thereof, relates to the chemical pharmaceutical field, and more specifically relates to a method for preparing a disaccharide segment of a key intermediate for chemically synthesizing heparin and heparinoid compounds. Disclosed are a new disaccharide intermediate and three methods for synthesizing the disaccharide intermediate, that is, compounds of a formula (4) and glucopyranose protected by different anomeric carbon are made to react in the presence of an active agent, to obtain the disaccharide intermediate. According to the technical solutions of the present invention, synthetic raw materials are easy to obtain, have a mild reaction condition, and are suitable for industrialized production.
    Type: Grant
    Filed: April 28, 2014
    Date of Patent: May 14, 2019
    Assignee: Zhejiang Hisun Pharmaceutical Co., Ltd.
    Inventors: Yanghui Guo, Junhui Zhou, Qingfeng Cai, Hegeng Wei, Hua Bai, Fei Long, Yue Zhang, Yingqiu Wu
  • Patent number: 10276542
    Abstract: A package structure has first and second dies, a molding compound, a first redistribution layer, at least one first through interlayer via (TIV), second through interlayer vias (TIVs), an electromagnetic interference shielding layer and conductive elements. The first die is molded in the molding compound. The second die is disposed on the molding compound. The first redistribution layer is located between the conductive elements and the molding compound and electrically connected to the first and second dies. The molding compound is located between the second die and the first redistribution layer. The first and second TIVs are molded in the molding compound and electrically connected to the first redistribution layer. The second TIVs are located between the first die and the first TIV. The electromagnetic interference shielding layer is in contact with the first TIV. The conductive elements are connected to the first redistribution layer.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen, Hua-Wei Tseng, Jo-Mei Wang, Tien-Chung Yang, Kuan-Chung Lu
  • Publication number: 20190078784
    Abstract: A fuel spray nozzle, for atomising liquid fuel in gas, including: an gas passage; a liquid fuel passage; a swirler provided in the gas passage and including vanes such that, when gas passes through the gas passage, the swirler produces a jet flow of gas from between adjacent vanes and a turbulent flow of gas in the wake of each vane; a prefilming surface for receiving liquid fuel from the liquid fuel passage, and gas from the gas passage, wherein the prefilming surface includes areas that receive jet flow of gas from the gas passage, in use; wherein the fuel spray nozzle is configured to direct the liquid fuel passing through the liquid fuel passage to the areas on the prefilming surface that receive a jet flow of gas from the gas passage.
    Type: Application
    Filed: August 31, 2018
    Publication date: March 14, 2019
    Applicant: ROLLS-ROYCE plc
    Inventors: Luca TENTORIO, Carl L MULDAL, Hua Wei HUANG, Evangelos BACHAROUDIS, Juan Carlos ROMAN CASADO
  • Publication number: 20190067249
    Abstract: A PoP device includes a first package structure, a second package structure and an underfill layer is provided. The first package structure includes a die, a TIV and an encapsulant. The TIV is aside the die. The encapsulant encapsulates sidewalls of the die and a portion of sidewalls of the TIV. The second package structure is connected to the first package structure through a connector. The underfill layer is disposed to fill a space between the first package structure and the second package structure. A portion of the underfill layer is disposed between the encapsulant and the TIV to cover a portion of sidewalls of the TIV.
    Type: Application
    Filed: August 29, 2017
    Publication date: February 28, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hui Cheng, Po-Hao Tsai, Wei-Yu Chen, Ming-Shih Yeh
  • Publication number: 20190052298
    Abstract: Aspects of the technology relate to a cover (e.g., for a handheld electronic device). The cover may include a cover body configured for securement to a handheld electronic device and comprising an accessory attachment area, wherein the accessory attachment area includes a plurality of receivers, and wherein the accessory attachment area is configured for coupling with an accessory in at least one of a plurality of orientations. In some aspects, each receiver further includes a space recessed into the cover body that is bounded, at least partially, by a recess wall, wherein each receiver includes an engagement surface configured for abutting engagement with a projection associated with an accessory when the projection is disposed in a secured configuration within a respective space. An electrical device cover and various attachment devices are also provided.
    Type: Application
    Filed: October 19, 2018
    Publication date: February 14, 2019
    Applicant: HTC Corporation
    Inventors: Hsin-Hao Lee, Cheng-Lin Wang, Ernest Euan Tien, Yin-Chou Chen, Tsung-Peng Lin, Cheng-Yen Lee, Yu-Hui Lin, Chang-Hua Wei, Jen-Yang Chang, Shih-Hsiu Lee, Jui Hsiang Lin, Hung Chuan Wen, Yen-Cheng Lin, Yen-Yi Lee, Ting-An Chien, Hsin-Hui Huang, Sheng Cherng Lin, Yung-Lung Chang
  • Publication number: 20190052299
    Abstract: Aspects of the technology relate to a cover (e.g., for a handheld electronic device). The cover may include a cover body configured for securement to a handheld electronic device and comprising an accessory attachment area, wherein the accessory attachment area includes a plurality of receivers, and wherein the accessory attachment area is configured for coupling with an accessory in at least one of a plurality of orientations. In some aspects, each receiver further includes a space recessed into the cover body that is bounded, at least partially, by a recess wall, wherein each receiver includes an engagement surface configured for abutting engagement with a projection associated with an accessory when the projection is disposed in a secured configuration within a respective space. An electrical device cover and various attachment devices are also provided.
    Type: Application
    Filed: October 19, 2018
    Publication date: February 14, 2019
    Applicant: HTC Corporation
    Inventors: Hsin-Hao Lee, Cheng-Lin Wang, Ernest Euan Tien, Yin-Chou Chen, Tsung-Peng Lin, Cheng-Yen Lee, Yu-Hui Lin, Chang-Hua Wei, Jen-Yang Chang, Shih-Hsiu Lee, Jui Hsiang Lin, Hung Chuan Wen, Yen-Cheng Lin, Yen-Yi Lee, Ting-An Chien, Hsin-Hui Huang, Sheng Cherng Lin, Yung-Lung Chang
  • Publication number: 20190052297
    Abstract: Aspects of the technology relate to a cover (e.g., for a handheld electronic device). The cover may include a cover body configured for securement to a handheld electronic device and comprising an accessory attachment area, wherein the accessory attachment area includes a plurality of receivers, and wherein the accessory attachment area is configured for coupling with an accessory in at least one of a plurality of orientations. In some aspects, each receiver further includes a space recessed into the cover body that is bounded, at least partially, by a recess wall, wherein each receiver includes an engagement surface configured for abutting engagement with a projection associated with an accessory when the projection is disposed in a secured configuration within a respective space. An electrical device cover and various attachment devices are also provided.
    Type: Application
    Filed: October 19, 2018
    Publication date: February 14, 2019
    Applicant: HTC Corporation
    Inventors: Hsin-Hao Lee, Cheng-Lin Wang, Ernest Euan Tien, Yin-Chou Chen, Tsung-Peng Lin, Cheng-Yen Lee, Yu-Hui Lin, Chang-Hua Wei, Jen-Yang Chang, Shih-Hsiu Lee, Jui Hsiang Lin, Hung Chuan Wen, Yen-Cheng Lin, Yen-Yi Lee, Ting-An Chien, Hsin-Hui Huang, Sheng Cherng Lin, Yung-Lung Chang
  • Patent number: D856330
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: August 13, 2019
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D862442
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: October 8, 2019
    Assignee: HTC Corporation
    Inventors: Chang-Hua Wei, Wei-Hsin Chang, Jen-Yang Chang