Patents by Inventor Hua Wei

Hua Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12152908
    Abstract: A lens assembly for display includes a display, a lens assembly, and a prism assembly. The display emits a first light beam. The lens assembly includes a first, second, and third lenses. The prism assembly includes a first, second prisms, and an optical multilayer film, wherein the first prism includes a first, second, and third surfaces and the second prism includes a fourth, fifth, sixth, seventh, and eighth surfaces. The lens assembly for display satisfies at least one of following conditions: 0.60?Din/TTL?0.75; 0.28?Din/f123?0.35; 4.56 mm?Din?5.02 mm; wherein Din is an effective optical diameter of the light incident surface, TTL is an interval from the light incident surface to the light emitting surface along the optical axis, and f123 is an effective focal length of a combination of the first lens, the second lens, and the third lens.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: November 26, 2024
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Fang-Li Ma, Yue-Ye Chen, Bin Liu, Jun-Wei Che, We-Jie Lou, Hua-Tang Liu
  • Publication number: 20240377605
    Abstract: An optical system and the adjusting device thereof. The optical system includes an optical device. The adjusting device is configured for adjusting a location of a center of the optical device. The adjusting device includes a first adjusting element which is movable along a first axis and is propped against the optical device, a second adjusting element which is movable along a second axis and is propped against the optical device, and a third adjusting element which is movable along a third axis and is propped against the optical device. The center of the optical device is spaced apart from where the first axis and the second axis meet and/or where the first axis and the third axis meet.
    Type: Application
    Filed: April 26, 2024
    Publication date: November 14, 2024
    Inventors: Jiang-Lin Liu, Hua-Tang Liu, Sheng Luo, Jun-Wei Che, Lian Zhao
  • Patent number: 12144106
    Abstract: An electronic device includes a circuit board, a shielding member, and a testing pin. The circuit board includes a grounding area. The shielding member is located on a side of the circuit board and includes a shielding layer and an insulating layer. The shielding layer is electrically connected to the grounding area. The insulating layer is located on a side of the shielding layer away from the circuit board. The testing pin is disposed on the circuit board and electrically connected to the shielding layer.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: November 12, 2024
    Assignee: TPK Auto Tech (Xiamen) Limited
    Inventors: Li Hua Wei, Ming Hsiang Lin, Shih Hao Chen, Cai Jin Ye
  • Publication number: 20240359084
    Abstract: Various powered personal mobility vehicles are disclosed. In some embodiments, the vehicle can include a deck having a forward portion, a rearward portion, and a neck portion. A front swivel wheel assembly and a rear swivel wheel assembly can be connected with the deck. In some embodiments, the front swivel wheel assembly comprises a motor.
    Type: Application
    Filed: April 5, 2024
    Publication date: October 31, 2024
    Inventors: Robert (Wei-Pin) Chen, Hua Tao, Huolai Guo
  • Publication number: 20240352447
    Abstract: Compositions and methods are provided for enzymes with altered properties that involve a systematic approach to mutagenesis and a screening assay that permits selection of the desired proteins. Embodiments of the method are particularly suited for modifying specific properties of restriction endonucleases such as star activity. The compositions includes restriction endonucleases with reduced star activity as defined by an overall fidelity index improvement factor.
    Type: Application
    Filed: June 21, 2024
    Publication date: October 24, 2024
    Applicant: New England Biolabs, Inc.
    Inventors: Zhenyu Zhu, Aine Quimby, Shuang-Yong Xu, Shengxi Guan, Hua Wei, Penghua Zhang, Dapeng Sun, Siu-hong Chan
  • Publication number: 20240355721
    Abstract: A semiconductor package includes a semiconductor die including an active surface and an electrical terminal on the active surface, and a redistribution circuitry disposed on the active surface of the semiconductor die and connected to the electrical terminal. A top surface of the redistribution circuitry includes a planar portion and a concave portion connected to the planar portion, the concave portion is directly over the electrical terminal, and a minimum distance measured from a lowest point of the concave portion to a virtual plane where the planar portion is located is equal to or smaller than 0.5 ?m.
    Type: Application
    Filed: July 1, 2024
    Publication date: October 24, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang Lin, Ming-Shih Yeh
  • Publication number: 20240336035
    Abstract: Provided are a chromium-free passivated and film-covered tinned plate, a passivation treatment solution for manufacturing a passivation film, and a manufacturing method for a tinned plate. The chromium-free passivated and film-covered tinned plate comprises a tinned plate and a polyester film laminated on a surface of the tinned plate. The tinned plate comprises a substrate, a tin coating and a passivation film covering a surface of the tin coating. The passivation film does not contain chromium, and contains 2.0-20 mg/m2 of zinc and 10-60 mg/m2 of silicon. A solvent in the passivation treatment solution is water, and the solution contains 0.5-5.0 wt % of a zinc salt and 10-30 wt % of an organosiloxane or a polysiloxane.
    Type: Application
    Filed: October 12, 2022
    Publication date: October 10, 2024
    Inventors: Zhangwei Wang, Junsheng Wei, Peng Li, Hongxing Chen, Hua Ni
  • Patent number: 12113456
    Abstract: Embodiments of present disclosure relate to an apparatus and a method for controlling a delta-connected cascaded multilevel converter. The apparatus (100) for controlling a delta-connected cascaded multilevel converter (110) comprises: a converter controller (102) configured to: receive current signals indicating phase currents flowing through respective phase arms of the converter (110); determine a harmonic current signal indicating a circulating current of the converter (110) from the current signals; and generate, based on the determined harmonic current signal and a reference current signal, a harmonic voltage signal to cause an amplitude of the circulating current flowing through the phase arms of the converter (110) to be a predetermined amplitude.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: October 8, 2024
    Assignee: ABB SCHWEIZ AG
    Inventors: Xing Huang, Hailian Xie, Guangming Pei, Hua Wei, Min Li
  • Publication number: 20240331257
    Abstract: This application describes an animation data generation method and apparatus, and a related product, which may be applied to scenarios such as a cloud technology, artificial intelligence (AI), intelligent transportation, assisted driving, digital human, virtual human, gaming, virtual reality, and extended reality (XR). Features of a virtual object in a virtual scene are obtained, and animation data of the virtual object is generated through a trained neural network based on the features. The use of the neural network omits storage of massive data into an internal memory and query of the massive data for a matched animation during generation of the animation data, and only requires storage of weight data related to the neural network in advance. Therefore, only a small internal memory is occupied, thereby avoiding problems such as large internal memory occupation and poor query performance during generation of the animation data.
    Type: Application
    Filed: June 11, 2024
    Publication date: October 3, 2024
    Inventors: Shun CAO, Hua KOU, Yifan CAO, Nan WEI, Yu WU, Congbing LI, Xiaochun CUI
  • Patent number: 12105400
    Abstract: Disclosed are an AF (autofocus) motor structure, a camera device, and an electronic product. The AF motor structure includes a base, a housing, a bracket, a main carrier, and a lens, the bracket is provided with a main coil for driving the main carrier to move, and the main carrier is provided with a magnet corresponding to the main coil; the main carrier is provided with a continuous zoom assembly that drives the lens to move, the continuous zoom assembly includes a sub-carrier movable relative to the main carrier in the sliding direction of the main carrier and a sub-coil disposed on the sub-carrier, the lens is connected to the sub-carrier, and the sub-coil corresponds to the magnet.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: October 1, 2024
    Assignee: New Shicoh Motor Co., Ltd
    Inventor: Hua Wei
  • Publication number: 20240319611
    Abstract: A lithography system includes an immersion lithographic apparatus, a fluid supply device, and a sensor. The fluid supply is configured to supply fluid to the immersion lithographic apparatus. The fluid supply device includes at least one liquid storage tank, an upper liquid pipe and a lower liquid pipe connected to the liquid storage tank. The sensor includes at least one hydraulic pressure gauge. The at least one hydraulic pressure gauge is arranged near a lower part of the liquid storage tank and connected to the lower liquid pipe and the upper liquid pipe so as to measure the hydraulic pressure at a bottom of the liquid storage tank. The height of the liquid level in the liquid storage tank is calculated from the hydraulic pressure.
    Type: Application
    Filed: April 25, 2023
    Publication date: September 26, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Zhi Fan Sun, Kuo Feng Huang, Ming Hsien Chung, Hua-Wei Peng, Chih Chung Kuo
  • Publication number: 20240321010
    Abstract: The embodiments of the disclosure provide a method for hand tracking. The method includes: obtaining, through a head-mounted device, a first image of a hand; determining, through the processor, a first pose of a first part of the hand based on the first image; obtaining, through a hand-held device, a second image of the hand; determining, through the processor, a second pose of a second part of the hand based on the second image, wherein the first part and the second part complementarily form an entirety of the hand; and determining, through the processor, a gesture of the hand based on the first pose and the second pose.
    Type: Application
    Filed: March 11, 2024
    Publication date: September 26, 2024
    Applicant: HTC Corporation
    Inventors: Chang-Hua Wei, Yu-Ling Huang
  • Patent number: 12093442
    Abstract: A handheld controller is adapted to control an electronic device. The handheld controller includes a first body, a second body, and a connecting portion. The first body is adapted to be held by a user's hand. The second body is connected to the first body through the connecting portion. The connecting portion is adapted to be clamped between user's fingers. A distance between the first body and at least a portion of the second body is variable.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: September 17, 2024
    Assignee: HTC Corporation
    Inventors: Chang-Hua Wei, Yu-Ling Huang
  • Publication number: 20240297166
    Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.
    Type: Application
    Filed: May 15, 2024
    Publication date: September 5, 2024
    Inventors: Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang, Hsing-Kuo Hsia, Chih-Chieh Hung, Ying-Ching Shih, Chin-Fu Kao, Wen-Hsin Wei, Li-Chung Kuo, Chi-Hsi Wu, Chen-Hua Yu
  • Patent number: 12073520
    Abstract: An augmented reality implementing method applied to a server, which includes a plurality of augmented reality objects and a plurality of setting records corresponding to the augmented reality objects respectively is provided. Firstly, the server receives an augmented reality request from a mobile device, where the augmented reality request is related to a target device. Then, the server is communicated with the target device to access current information. Then, the server determines the current information corresponds to which one of the setting records, and selects one of the augmented reality objects based on the determined setting record as a virtual object provided to the mobile device.
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: August 27, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Kuo-Chung Chiu, Hsuan-Wu Wei, Yen-Ting Liu, Shang-Chih Liang, Shih-Hua Ma, Yi-Hsuan Tsai, Jun-Ting Chen, Kuan-Ling Chen
  • Patent number: 12062602
    Abstract: A method of manufacturing a semiconductor package includes forming an encapsulated semiconductor device and forming a redistribution structure over the encapsulated semiconductor device, where the encapsulated semiconductor device includes a semiconductor device encapsulated by an encapsulating material. Forming the redistribution structure includes forming a first dielectric layer on the encapsulated semiconductor device, and forming a first redistribution circuit layer on the first dielectric layer by a plating process carried out at a current density of substantially 4˜6 amperes per square decimeter, where the first dielectric layer comprises a first via opening. An upper surface of the first redistribution circuit layer filling the first via opening is substantially coplanar with an upper surface of the rest of the first redistribution circuit layer.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: August 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang Lin, Ming-Shih Yeh
  • Patent number: 12054707
    Abstract: Compositions and methods are provided for enzymes with altered properties that involve a systematic approach to mutagenesis and a screening assay that permits selection of the desired proteins. Embodiments of the method are particularly suited for modifying specific properties of restriction endonucleases such as star activity. The compositions includes restriction endonucleases with reduced star activity as defined by an overall fidelity index improvement factor.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: August 6, 2024
    Assignee: New England Biolabs, Inc.
    Inventors: Zhenyu Zhu, Aine Quimby, Shuang-Yong Xu, Shengxi Guan, Hua Wei, Penghua Zhang, Dapeng Sun, Siu-hong Chan
  • Publication number: 20240241098
    Abstract: A wall mountable sensor module includes a housing defining an internal space that is segmented into a first internal space and a second internal space. The first internal space defines an air channel that extends from an air inlet to an air outlet. Two or more sensors are configured to be exposed to the air flow channel. A first sensor is configured to detect a first air parameter and a second sensor is configured to detect a second different air parameter, wherein the second sensor is situated downstream of the first sensor in the air flow channel. The sensor module includes a fan housed by the housing, the fan configured to cause an airflow to flow in through the air inlet, through the air flow channel thereby exposing each of the sensors to the airflow, and out through the air outlet.
    Type: Application
    Filed: October 11, 2022
    Publication date: July 18, 2024
    Inventors: Chao Chen, Yu Zhi Yan, Hua Tang, Kaixuan Qin, Zhi Yi Sun, Jian Wang, Ke Wei Han, Qixiang Hu
  • Patent number: D1036552
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: July 23, 2024
    Assignee: HTC Corporation
    Inventors: Chang-Hua Wei, Pei-Pin Huang, Yu-Lin Huang
  • Patent number: D1040771
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: September 3, 2024
    Assignee: HTC Corporation
    Inventors: Pei-Pin Huang, Chang-Hua Wei, Chung-Wei Li, Yu-Lin Huang