Abstract: The disclosure provides a device and a method for testing mechanical properties of a material under a high rotation speed and a high temperature. A sample chuck is installed on a main shaft of a centrifugal machine and rotates synchronously. A test sample is installed on the sample chuck. The induction heating system is installed on the centrifugal machine and does not rotate. The induction heating system is connected to a circulating water cooling system. A temperature controlling system is connected to the circulating water cooling system and the test sample. Parameters of the centrifugal machine, the test sample, etc. are determined. A temperature-controlling thermocouple and a strain gauge are installed on a standard section. A rotation speed of the centrifugal machine reaches the speed and is maintained until it breaks. Data is collected, and then the centrifugal machine is turned off and air-cooled to a room temperature.

Abstract: A silicon wafer transfer auxiliary device includes blowpipes disposed on a side of a sorting wheel. Nozzles of the blowpipes are inclined towards the side of the sorting wheel. The blowpipes are capable of spraying liquid or gas towards a silicon wafer during transfer to increase an adsorption force between the silicon wafer and the sorting wheel and to successfully complete a turning of the silicon wafer from a vertical direction to a side close to the sorting wheel.

Abstract: A controller includes a body and a surrounding part. The body has a control area for sending a control signal according to a movement of a thumb of a user. The surrounding part is connected to the body and used to surround and be fixed to a proximal phalange of an index finger of the user. The body is away from a joint between the proximal phalange and a metacarpal bone of the user.

Abstract: A semiconductor die and methods of forming the same and a package structure are provided. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads over the semiconductor substrate, a passivation layer over the semiconductor substrate and partially covering the plurality of conductive pads, an interconnecting line disposed on the passivation layer, and a plurality of connectors disposed on and electrically connected to the plurality of conductive pads. Each of the plurality of connectors includes a stacked structure of a first conductive pillar and a second conductive pillar disposed directly on the first conductive pillar, wherein a span of the second conductive pillar is smaller than a span of the first conductive pillar, and an orthogonal projection of the second conductive pillar falls within an orthogonal projection of the first conductive pillar, and the interconnecting line is located beside and spaced apart from the plurality of connectors.

Abstract: An optical system includes an objective lens module, an image inverting module, and an eyepiece module. The objective lens module includes a first lens group, a second lens group, a third lens group, a fourth lens group, and a fifth lens group. The optical system satisfies at least one of the following conditions: 0.45?LG4D/LG1D?0.8; 0.015 mm?1?1/fG3?0.045 mm?1; 0.045 mm?1?|1/fG4|?0.07 mm?1; 0.35?|fG4/fG3|?0.75; 0.15?fG1/f?1.6; wherein LG4D is an effective optical diameter of the fourth lens group, LG1D is an effective optical diameter of the first lens group, fG1 is an effective focal length of the first lens group, fG3 is an effective focal length of the third lens group, fG4 is an effective focal length of the fourth lens group, and f is an effective focal length of the objective lens module.

Abstract: A device includes a first die, an interconnect structure, a RDL layer, a guard structure and an underfill layer. The interconnect structure is electrically connected to the first die. The RDL layer is disposed in a dielectric layer. The guard structure is disposed in the dielectric layer to define a connector region, wherein the guard structure and the interconnect structure are disposed on opposite sides of the die. The underfill layer surrounds the interconnect structure, the first die and the guard structure, wherein the underfill layer is kept outside of the connector region by the guard structure.

Abstract: The disclosure relates to a polyol composition, a corresponding polyurethane reaction system and a polyurethane foam prepared therefrom. The polyol composition includes: B1) an EO- and/or PO-based polyether polyol having a functionality of 2-6 and a weight-average molecular weight of 3000-12000 g/mol; B2) a PO- and/or EO-terminated polyarea polyol having a functionality of 2-4, and a weight-average molecular weight of 3000-8000 g/mol; optionally B3) a polyester polyol having a functionality of 2-4, and a weight-average molecular weight of 1000-1800 g/mol; and B4) at least one ?-dicarbonyl compound.

Abstract: A water filter includes a filtering head, a filter bottle assembly, a switch member, and a quick release device. The filtering head includes a flow channel module. The filter bottle assembly includes a filter bottle. The quick release device includes a press lever, two links, and two push members. When the press lever is pivoted, the two links and the two push members are driven by the press lever to move the filter bottle simultaneously so that the filter bottle is mounted on or detached from the filtering head quickly. A switch member functions as a waterway switch to control a water supply of the filtering head and functions as a locking mechanism for locking or unlocking the quick release device.

Abstract: A liquid storage tank may include a body with an inner cavity, wherein a first liquid storage area and a second liquid storage area are provided in the body, and a partition is provided between the first liquid storage area and the second liquid storage area. A heater for heating solution is provided in the first liquid storage area. A liquid outlet is provided in the second liquid storage area.

Abstract: A fabricated rapid construction platform for a bridge, wherein the construction platform comprises a fixing frame, an upper-layer tubular pile position control structure (6), a lower-layer tubular pile position control structure (7), and a console; the fixing frame comprises a bottom rail platform (1), supporting posts (3), a top operation platform (2), and several supporting legs (4); the upper-layer tubular pile position control structure (6) and the lower-layer tubular pile position control structure (7) are provided between the bottom rail platform (1) and the top operation platform (2); the upper-layer tubular pile position control structure (6) comprises two sub-structures arranged symmetrically about the central axis of a second through hole, and each sub-structure comprises a braking device (61), a vertical control arm (63), and a horizontal control arm (62).

Abstract: An electronic device includes: a substrate; a plurality of electronic components disposed on the substrate, wherein there is a first pitch between two adjacent electronic components in a first direction; and a protective glue disposed on the substrate and the electronic components, and provided with at least one groove disposed between the two adjacent electronic components, wherein a distance between an edge of one of the two adjacent electronic components and the at least one groove satisfies an equation: 0.3 mm ? D ? 1 < ( P / 2 ) , where D1 is the distance between the edge of the one of the two adjacent electronic components and the at least one groove, and P is the first pitch.

Abstract: An electronic device is configured to execute instructions: compiling a first AI model and second AI model(s) to a first compiled file and second compiled file(s), respectively, wherein the first compiled file comprises a first data set and a first command set, and the second compiled file(s) comprises second data set(s) and second command set(s); generating light version file(s) for the AI model(s), wherein the light version file(s) comprises the second command set(s) and data patch(es); storing the first compiled file and the light version file(s) to a storage device; loading the first compiled file from the storage device to a memory; loading the light version file(s) from the storage device to the memory; generating the second data set(s) according to the first data set and the data patch(es); and executing the second AI model(s) according to the generated second data set(s) and the second command set(s) in the memory.

Abstract: A package comprises at least one first device die, and a redistribution line (RDL) structure having the at least one first device die bonded thereto. The RDL structure comprises a plurality of dielectric layers, and a plurality of RDLs formed through the plurality of dielectric layers. A trench is defined proximate to axial edges of the RDL structure through each of the plurality of dielectric layers. The trench prevents damage to portions of the RDL structure located axially inwards of the trench.

Abstract: An example embodiment of the present disclosure involves a method for semiconductor device fabrication. The method comprises providing a structure that includes a conductive component and an interlayer dielectric (ILD) that includes silicon and surrounds the conductive component, and forming, over the conductive component and the ILD, an etch stop layer (ESL) that includes metal oxide. The ESL includes a first portion in contact with the conductive component and a second portion in contact with the ILD. The method further comprises baking the ESL to transform the metal oxide located in the second portion of the ESL into metal silicon oxide, and selectively etching the ESL so as to remove the first portion of the ESL but not the second portion of the ESL.

Abstract: A silicon wafer sorting mechanism includes a wafer distribution unit, a sorting unit, and a transmission unit disposed sequentially. The sorting unit includes a sorting table with one terminal hinged to the wafer distribution unit. The sorting table rotates and tilts with a point where the sorting table is hinged to the wafer distribution unit. The sorting table and the transmission unit are arranged up and down in dislocation or the sorting table is placed horizontally against the transmission unit, thereby forming two transmission lines in different directions to sort silicon wafers of different types.

Abstract: An apparatus for supplying cleaning liquid may include: a stock solution unit configured with a plurality of stock solution tanks; a cleaning unit configured with a plurality of cleaning tanks; and a transfer unit disposed between the stock solution unit and the cleaning unit. The transfer unit is configured with a plurality of independent transfer tanks. Each of the stock solution tanks communicates with at least one of the transfer tanks, each of the transfer tanks communicates with one of the cleaning tanks, and each of the cleaning tanks communicates with at least one of the transfer tanks.

Abstract: A lifting control apparatus may include: a base for holding a basket containing silicon wafers; brackets provided on an outside of both ends of the base; and a driver for driving the brackets to move up and down. The driver is provided with a lead screw. The lead screw is connected with the bracket on a same side. The lead screw on one side is driven to rotate the lead screw on another side synchronously, and the lead screws on both sides are driven to move the brackets on both sides and the base between the brackets up and down together. Or the lead screws on both sides are driven to rotate synchronously, so that the lead screws on both sides drive the base between the brackets through the correspondingly brackets to move up and down together.

Abstract: Examples described herein provide a computer-implemented method for identifying regression test failures that includes comparing a base code to a new code to locate an updated aspect of a program. The method further includes inserting debug code into corresponding source files for each of the base code and the new code for the updated aspect. The method further includes building a first image for the base code and a second image for the new code, the first and second images running in respective first and second containers. The method further includes comparing debugging outputs from a regression test of the respective first and second containers to identify a regression test failure. The method further includes implementing a corrective action to correct the regression test failure.