Patents by Inventor Hua Wei

Hua Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250108320
    Abstract: A buffering device for a filter bottle. The buffering device is disposed on a body of the filter bottle and has a sidewall, a top, a bottom, and a chamber. The top of the buffering device is moveable up and down along the sidewall of the buffering device. The chamber is formed between the sidewall, the top, and the bottom of the buffering device, and does not communicate with an interior of the filter bottle. The chamber communicates with an exterior via an air gap for air exchange. A filter bottle having the buffering device can provide a function of anti-water-hammer, can reduce a risk of leakage at a connection between the filter bottle and a valve head, and can provide an anti-freeze effect to reduce a risk of rupture of the filter bottle.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 3, 2025
    Inventors: Sheng-Nan LIN, Hao-Chan WEI, Zhe-Hua OU
  • Patent number: 12259657
    Abstract: A lithography system includes an immersion lithographic apparatus, a fluid supply device, and a sensor. The fluid supply is configured to supply fluid to the immersion lithographic apparatus. The fluid supply device includes at least one liquid storage tank, an upper liquid pipe and a lower liquid pipe connected to the liquid storage tank. The sensor includes at least one hydraulic pressure gauge. The at least one hydraulic pressure gauge is arranged near a lower part of the liquid storage tank and connected to the lower liquid pipe and the upper liquid pipe so as to measure the hydraulic pressure at a bottom of the liquid storage tank. The height of the liquid level in the liquid storage tank is calculated from the hydraulic pressure.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: March 25, 2025
    Assignee: United Microelectronics Corp.
    Inventors: Zhi Fan Sun, Kuo Feng Huang, Ming Hsien Chung, Hua-Wei Peng, Chih Chung Kuo
  • Publication number: 20250094398
    Abstract: Techniques for a unified relational database framework for hybrid vector search are provided. In one technique, multiple documents are accessed and a vector table and a text table are generated. For each accessed document, data within the document is converted to plaintext, multiple chunks are generated based on the plaintext, an embedding model generates a vector for each of the chunks, the vectors are stored in the vector table along with a document identifier that identifies the accessed document, tokens are generated based on the plaintext, the tokens are stored in the text table along with the document identifier. Such processing may be performed in a database system in response to a single database statement to create a hybrid index. In response to receiving a hybrid query, a vector query and a text query are generated and executed and the respective results may be combined.
    Type: Application
    Filed: September 13, 2024
    Publication date: March 20, 2025
    Inventors: Aleksandra Czarlinska, Saurabh Naresh Netravalkar, Denis B. Mukhin, Harichandan Roy, Zhen Hua Liu, Sebastian de la Hoz Luna, Beda Christoph Hammerschmidt, George R. Krupka, Bo Xia, David Chih-Wei Jiang
  • Publication number: 20250087510
    Abstract: Embodiments of the present disclosure are directed to a system for monitoring moving and stepping silicon wafers and a method adopts the system. The system includes a first sensing element to monitor whether a gap between adjacent silicon wafers exists, and a second sensing element to monitor whether two silicon wafers are laminated. The first sensing element and the second sensing element are both disposed in a slot where the silicon wafers are turned over, and suspended on a front side of a sorting wheel in the slot and obliquely arranged towards one side of the sorting wheel. The system installed in the narrow space between the cleaning tank and the sorting tank has simple structure and is capable of quickly and accurately monitoring the silicon wafer turnover, and accurately determining whether there is a continuous or laminated silicon wafer during the silicon wafer turnover process.
    Type: Application
    Filed: June 26, 2023
    Publication date: March 13, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Lihui JIN, Hua YANG, Zhigao REN, Mingqiang GENG, Huan WANG, Chuanling AI, Dawei WANG, Zhijun WU, Hongxia CEN, Chen WEI
  • Publication number: 20250088358
    Abstract: Methods, machine readable media and systems for evaluating, through one or more simulations, the leakage of sensitive data in an integrated circuit, such as cryptographic data or keys, are described. The embodiments can use machine learning models, such as one or more neural networks to generate one or more leakage related scores for each portion in a set of portions of the cryptographic data. In one embodiment, leakage data associated the first set of POIs with one or more neural networks is processed by the one or more neural networks to identify the POIs that leak the most and determine one or more scores for each portion in the set of portions of the cryptographic data.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Inventors: Jimin Wen, Hua Chen, Deqi Zhu, Lang Lin, Norman Chang, Chia-Wei Chen
  • Publication number: 20250076169
    Abstract: The disclosure provides a device and a method for testing mechanical properties of a material under a high rotation speed and a high temperature. A sample chuck is installed on a main shaft of a centrifugal machine and rotates synchronously. A test sample is installed on the sample chuck. The induction heating system is installed on the centrifugal machine and does not rotate. The induction heating system is connected to a circulating water cooling system. A temperature controlling system is connected to the circulating water cooling system and the test sample. Parameters of the centrifugal machine, the test sample, etc. are determined. A temperature-controlling thermocouple and a strain gauge are installed on a standard section. A rotation speed of the centrifugal machine reaches the speed and is maintained until it breaks. Data is collected, and then the centrifugal machine is turned off and air-cooled to a room temperature.
    Type: Application
    Filed: November 21, 2024
    Publication date: March 6, 2025
    Applicant: ZHEJIANG UNIVERSITY
    Inventors: Hua WEI, Jianjiang ZHAO, Keman LIU, Weian LIN, Yunmin CHEN, Ze ZHANG
  • Publication number: 20250079219
    Abstract: A silicon wafer transfer auxiliary device includes blowpipes disposed on a side of a sorting wheel. Nozzles of the blowpipes are inclined towards the side of the sorting wheel. The blowpipes are capable of spraying liquid or gas towards a silicon wafer during transfer to increase an adsorption force between the silicon wafer and the sorting wheel and to successfully complete a turning of the silicon wafer from a vertical direction to a side close to the sorting wheel.
    Type: Application
    Filed: July 18, 2023
    Publication date: March 6, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Lihui JIN, Hua YANG, Zhigao REN, Haodong GUO, Chuanling AI, Dawei WANG, Zhijun WU, Hongxia CEN, Chen WEI
  • Publication number: 20250060818
    Abstract: A controller includes a body and a surrounding part. The body has a control area for sending a control signal according to a movement of a thumb of a user. The surrounding part is connected to the body and used to surround and be fixed to a proximal phalange of an index finger of the user. The body is away from a joint between the proximal phalange and a metacarpal bone of the user.
    Type: Application
    Filed: July 3, 2024
    Publication date: February 20, 2025
    Applicant: HTC Corporation
    Inventors: Chang-Hua Wei, Yu-Ling Huang, Pei-Pin Huang, Yen Chun Chen, Tung-Ting Cheng, Reinaldo Yang, Chih-Ting Chen
  • Publication number: 20250062202
    Abstract: A semiconductor die and methods of forming the same and a package structure are provided. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads over the semiconductor substrate, a passivation layer over the semiconductor substrate and partially covering the plurality of conductive pads, an interconnecting line disposed on the passivation layer, and a plurality of connectors disposed on and electrically connected to the plurality of conductive pads. Each of the plurality of connectors includes a stacked structure of a first conductive pillar and a second conductive pillar disposed directly on the first conductive pillar, wherein a span of the second conductive pillar is smaller than a span of the first conductive pillar, and an orthogonal projection of the second conductive pillar falls within an orthogonal projection of the first conductive pillar, and the interconnecting line is located beside and spaced apart from the plurality of connectors.
    Type: Application
    Filed: August 17, 2023
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Yi Sung, Ta-Hsuan Lin, Hua-Wei Tseng, Mill-Jer Wang
  • Patent number: 12228714
    Abstract: An optical system includes an objective lens module, an image inverting module, and an eyepiece module. The objective lens module includes a first lens group, a second lens group, a third lens group, a fourth lens group, and a fifth lens group. The optical system satisfies at least one of the following conditions: 0.45?LG4D/LG1D?0.8; 0.015 mm?1?1/fG3?0.045 mm?1; 0.045 mm?1?|1/fG4|?0.07 mm?1; 0.35?|fG4/fG3|?0.75; 0.15?fG1/f?1.6; wherein LG4D is an effective optical diameter of the fourth lens group, LG1D is an effective optical diameter of the first lens group, fG1 is an effective focal length of the first lens group, fG3 is an effective focal length of the third lens group, fG4 is an effective focal length of the fourth lens group, and f is an effective focal length of the objective lens module.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: February 18, 2025
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Fang-Li Ma, Bin Liu, Fei Han, Ling-Wei Zhao, Yue-Ye Chen, Hua-Tang Liu
  • Publication number: 20250051507
    Abstract: The disclosure relates to a polyol composition, a corresponding polyurethane reaction system and a polyurethane foam prepared therefrom. The polyol composition includes: B1) an EO- and/or PO-based polyether polyol having a functionality of 2-6 and a weight-average molecular weight of 3000-12000 g/mol; B2) a PO- and/or EO-terminated polyarea polyol having a functionality of 2-4, and a weight-average molecular weight of 3000-8000 g/mol; optionally B3) a polyester polyol having a functionality of 2-4, and a weight-average molecular weight of 1000-1800 g/mol; and B4) at least one ?-dicarbonyl compound.
    Type: Application
    Filed: December 7, 2022
    Publication date: February 13, 2025
    Inventors: Yefen Wei, Marcel Schornstein, Hua Lu, Wenping Wei
  • Publication number: 20250054894
    Abstract: A device includes a first die, an interconnect structure, a RDL layer, a guard structure and an underfill layer. The interconnect structure is electrically connected to the first die. The RDL layer is disposed in a dielectric layer. The guard structure is disposed in the dielectric layer to define a connector region, wherein the guard structure and the interconnect structure are disposed on opposite sides of the die. The underfill layer surrounds the interconnect structure, the first die and the guard structure, wherein the underfill layer is kept outside of the connector region by the guard structure.
    Type: Application
    Filed: October 29, 2024
    Publication date: February 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh, Der-Chyang Yeh
  • Patent number: 12215041
    Abstract: A water filter includes a filtering head, a filter bottle assembly, a switch member, and a quick release device. The filtering head includes a flow channel module. The filter bottle assembly includes a filter bottle. The quick release device includes a press lever, two links, and two push members. When the press lever is pivoted, the two links and the two push members are driven by the press lever to move the filter bottle simultaneously so that the filter bottle is mounted on or detached from the filtering head quickly. A switch member functions as a waterway switch to control a water supply of the filtering head and functions as a locking mechanism for locking or unlocking the quick release device.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: February 4, 2025
    Assignee: Kemflo International Co., Ltd.
    Inventors: Sheng-Nan Lin, Hao-Chan Wei, Yi-Wen Liao, Zhe-Hua Ou
  • Publication number: 20250034821
    Abstract: A fabricated rapid construction platform for a bridge, wherein the construction platform comprises a fixing frame, an upper-layer tubular pile position control structure (6), a lower-layer tubular pile position control structure (7), and a console; the fixing frame comprises a bottom rail platform (1), supporting posts (3), a top operation platform (2), and several supporting legs (4); the upper-layer tubular pile position control structure (6) and the lower-layer tubular pile position control structure (7) are provided between the bottom rail platform (1) and the top operation platform (2); the upper-layer tubular pile position control structure (6) comprises two sub-structures arranged symmetrically about the central axis of a second through hole, and each sub-structure comprises a braking device (61), a vertical control arm (63), and a horizontal control arm (62).
    Type: Application
    Filed: October 9, 2021
    Publication date: January 30, 2025
    Applicant: GUANGXI TRANSPORTATION SCIENCE AND TECHNOLOGY GROUP CO., LTD
    Inventors: Hua WANG, Longlin WANG, Xirui WANG, Tianzhi HAO, Gangrong WEI, Litao LI, Bo QIU, Jizhi LUO, Yuhou YANG, Shijian LIU, Mengsheng YU, Xiaoli ZHUO, Kainan HUANG, Jianheng CHEN, Zengke LI, Jipeng CHEN
  • Publication number: 20250036977
    Abstract: An electronic device is configured to execute instructions: compiling a first AI model and second AI model(s) to a first compiled file and second compiled file(s), respectively, wherein the first compiled file comprises a first data set and a first command set, and the second compiled file(s) comprises second data set(s) and second command set(s); generating light version file(s) for the AI model(s), wherein the light version file(s) comprises the second command set(s) and data patch(es); storing the first compiled file and the light version file(s) to a storage device; loading the first compiled file from the storage device to a memory; loading the light version file(s) from the storage device to the memory; generating the second data set(s) according to the first data set and the data patch(es); and executing the second AI model(s) according to the generated second data set(s) and the second command set(s) in the memory.
    Type: Application
    Filed: June 23, 2024
    Publication date: January 30, 2025
    Applicant: MEDIATEK INC.
    Inventors: Chia-Wei Hsu, Yu-Lung Lu, Yen-Ting Chiang, Chih-wei Chen, Yi-Cheng Lu, Jia-Sian Hong, Kuan-Yu Chen, Pei-Kuei Tsung, Hua Wu
  • Publication number: 20250040318
    Abstract: An electronic device includes: a substrate; a plurality of electronic components disposed on the substrate, wherein there is a first pitch between two adjacent electronic components in a first direction; and a protective glue disposed on the substrate and the electronic components, and provided with at least one groove disposed between the two adjacent electronic components, wherein a distance between an edge of one of the two adjacent electronic components and the at least one groove satisfies an equation: 0.3 mm ? D ? 1 < ( P / 2 ) , where D1 is the distance between the edge of the one of the two adjacent electronic components and the at least one groove, and P is the first pitch.
    Type: Application
    Filed: June 28, 2024
    Publication date: January 30, 2025
    Inventors: Zhi-Wei ZHANG, Hua-Pin CHEN, Shuai WANG, Chien-Hao KUO
  • Publication number: 20250033096
    Abstract: A liquid storage tank may include a body with an inner cavity, wherein a first liquid storage area and a second liquid storage area are provided in the body, and a partition is provided between the first liquid storage area and the second liquid storage area. A heater for heating solution is provided in the first liquid storage area. A liquid outlet is provided in the second liquid storage area.
    Type: Application
    Filed: July 31, 2023
    Publication date: January 30, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Lihui JIN, Hua YANG, Zhigao REN, Huan WANG, Liang REN, Chuanling AI, Dawei WANG, Zhijun WU, Hongxia CEN, Chen WEI
  • Patent number: 12211782
    Abstract: A package comprises at least one first device die, and a redistribution line (RDL) structure having the at least one first device die bonded thereto. The RDL structure comprises a plurality of dielectric layers, and a plurality of RDLs formed through the plurality of dielectric layers. A trench is defined proximate to axial edges of the RDL structure through each of the plurality of dielectric layers. The trench prevents damage to portions of the RDL structure located axially inwards of the trench.
    Type: Grant
    Filed: August 10, 2023
    Date of Patent: January 28, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yueh-Ting Lin, Hua-Wei Tseng, Ming Shih Yeh, Der-Chyang Yeh
  • Patent number: D1060066
    Type: Grant
    Filed: September 5, 2023
    Date of Patent: February 4, 2025
    Assignee: HTC CORPORATION
    Inventors: Pei-Pin Huang, Chang-Hua Wei
  • Patent number: D1065184
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: March 4, 2025
    Assignee: HTC Corporation
    Inventors: Chang-Hua Wei, Yu-Lin Huang