Abstract: A package structure includes a frontside redistribution layer (RDL) structure with a recessed portion, a lower encapsulation layer on the frontside RDL structure and a plurality of through vias connected to the frontside RDL structure to an upper package, a first semiconductor die on the frontside RDL structure and in the lower encapsulation layer, and an integrated passive device (IPD) connected to the frontside RDL structure in the recessed portion that connects to the first semiconductor die. A method of forming a package structure includes forming a molded portion with a lower encapsulation layer, a plurality of through vias in the lower encapsulation layer and a first semiconductor die in the lower encapsulation layer, forming a RDL structure with a recessed portion on the molded portion, the plurality of through vias connect the frontside RDL structure to an upper package, and attaching an IPD in the recessed portion.

Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.

Abstract: In a semiconductor package having a redistribution structure, two or more semiconductor dies are connected to a first side of the redistribution structure and an encapsulant surrounds the two or more semiconductor dies. An integrated passive device (IPD) is connected on a second side of the redistribution structure. The second side is opposite to the first side and the IPD is electrically coupled to the redistribution structure. An interconnect device is connected on the second side of the redistribution structure and is electrically coupled to the redistribution structure. Two or more external connections are on the second side of the redistribution structure and are electrically coupled to the redistribution structure.

Abstract: An image sensor includes a pixel array, a dielectric layer, a plurality of first conductive shielding regions, and a plurality of second conductive shielding regions. The pixel array includes photodiodes within a substrate. The dielectric layer is over the substrate. From a plan view, the first conductive shielding regions are adjacent four corners of the pixel array, and the second conductive shielding regions are adjacent four sides of the pixel array. The second conductive region has a length-to-width ratio greater than a length-to-width ratio of the first conductive region.

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Abstract: A method includes forming a metal pad, depositing a passivation layer on the metal pad, and planarizing the passivation layer, so that the passivation layer includes a planar top surface. The method further includes etching the passivation layer to form an opening in the passivation layer, wherein the metal pad is exposed to the opening, and forming a conductive via including a lower portion in the opening, and an upper portion higher than the passivation layer. A polymer layer is then dispensed to cover the conductive via.

Abstract: The disclosure provides a display device and an operation method thereof. The display device includes a display panel and a driving circuit. The display panel has at least one native conductive line for a display driving operation. The driving circuit is coupled to the at least one native conductive line. During a display driving period, the driving circuit performs the display driving operation on the display panel through the at least one native conductive line. During a heating period, the driving circuit performs a heating operation on the display panel through the at least one native conductive line.

Abstract: A package comprises at least one first device die, and a redistribution line (RDL) structure having the at least one first device die bonded thereto. The RDL structure comprises a plurality of dielectric layers, and a plurality of RDLs formed through the plurality of dielectric layers. A trench is defined proximate to axial edges of the RDL structure through each of the plurality of dielectric layers. The trench prevents damage to portions of the RDL structure located axially inwards of the trench.

Abstract: A management method for multiple communication devices, wherein the multiple communication devices include a host device and a first peripheral device configured to electrically connect to a device platform, and the management method includes: by the host device, detecting a connection of the first peripheral device through the device platform; by the host device, receiving a first device identifier provided by the first peripheral device through the device platform; by the host device, storing the first device identifier in the host device; and by the host device, wirelessly pairing the host device with the first peripheral device, according to the first device identifier stored in the host device, to enable a first wireless communication between the host device and the first peripheral device.

Abstract: A buffering device for a filter bottle. The buffering device is disposed on a body of the filter bottle and has a sidewall, a top, a bottom, and a chamber. The top of the buffering device is moveable up and down along the sidewall of the buffering device. The chamber is formed between the sidewall, the top, and the bottom of the buffering device, and does not communicate with an interior of the filter bottle. The chamber communicates with an exterior via an air gap for air exchange. A filter bottle having the buffering device can provide a function of anti-water-hammer, can reduce a risk of leakage at a connection between the filter bottle and a valve head, and can provide an anti-freeze effect to reduce a risk of rupture of the filter bottle.

Abstract: A lithography system includes an immersion lithographic apparatus, a fluid supply device, and a sensor. The fluid supply is configured to supply fluid to the immersion lithographic apparatus. The fluid supply device includes at least one liquid storage tank, an upper liquid pipe and a lower liquid pipe connected to the liquid storage tank. The sensor includes at least one hydraulic pressure gauge. The at least one hydraulic pressure gauge is arranged near a lower part of the liquid storage tank and connected to the lower liquid pipe and the upper liquid pipe so as to measure the hydraulic pressure at a bottom of the liquid storage tank. The height of the liquid level in the liquid storage tank is calculated from the hydraulic pressure.

Abstract: Techniques for a unified relational database framework for hybrid vector search are provided. In one technique, multiple documents are accessed and a vector table and a text table are generated. For each accessed document, data within the document is converted to plaintext, multiple chunks are generated based on the plaintext, an embedding model generates a vector for each of the chunks, the vectors are stored in the vector table along with a document identifier that identifies the accessed document, tokens are generated based on the plaintext, the tokens are stored in the text table along with the document identifier. Such processing may be performed in a database system in response to a single database statement to create a hybrid index. In response to receiving a hybrid query, a vector query and a text query are generated and executed and the respective results may be combined.

Abstract: Embodiments of the present disclosure are directed to a system for monitoring moving and stepping silicon wafers and a method adopts the system. The system includes a first sensing element to monitor whether a gap between adjacent silicon wafers exists, and a second sensing element to monitor whether two silicon wafers are laminated. The first sensing element and the second sensing element are both disposed in a slot where the silicon wafers are turned over, and suspended on a front side of a sorting wheel in the slot and obliquely arranged towards one side of the sorting wheel. The system installed in the narrow space between the cleaning tank and the sorting tank has simple structure and is capable of quickly and accurately monitoring the silicon wafer turnover, and accurately determining whether there is a continuous or laminated silicon wafer during the silicon wafer turnover process.

Abstract: Methods, machine readable media and systems for evaluating, through one or more simulations, the leakage of sensitive data in an integrated circuit, such as cryptographic data or keys, are described. The embodiments can use machine learning models, such as one or more neural networks to generate one or more leakage related scores for each portion in a set of portions of the cryptographic data. In one embodiment, leakage data associated the first set of POIs with one or more neural networks is processed by the one or more neural networks to identify the POIs that leak the most and determine one or more scores for each portion in the set of portions of the cryptographic data.

Abstract: A silicon wafer transfer auxiliary device includes blowpipes disposed on a side of a sorting wheel. Nozzles of the blowpipes are inclined towards the side of the sorting wheel. The blowpipes are capable of spraying liquid or gas towards a silicon wafer during transfer to increase an adsorption force between the silicon wafer and the sorting wheel and to successfully complete a turning of the silicon wafer from a vertical direction to a side close to the sorting wheel.

Abstract: The disclosure provides a device and a method for testing mechanical properties of a material under a high rotation speed and a high temperature. A sample chuck is installed on a main shaft of a centrifugal machine and rotates synchronously. A test sample is installed on the sample chuck. The induction heating system is installed on the centrifugal machine and does not rotate. The induction heating system is connected to a circulating water cooling system. A temperature controlling system is connected to the circulating water cooling system and the test sample. Parameters of the centrifugal machine, the test sample, etc. are determined. A temperature-controlling thermocouple and a strain gauge are installed on a standard section. A rotation speed of the centrifugal machine reaches the speed and is maintained until it breaks. Data is collected, and then the centrifugal machine is turned off and air-cooled to a room temperature.

Abstract: A controller includes a body and a surrounding part. The body has a control area for sending a control signal according to a movement of a thumb of a user. The surrounding part is connected to the body and used to surround and be fixed to a proximal phalange of an index finger of the user. The body is away from a joint between the proximal phalange and a metacarpal bone of the user.

Abstract: A semiconductor die and methods of forming the same and a package structure are provided. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads over the semiconductor substrate, a passivation layer over the semiconductor substrate and partially covering the plurality of conductive pads, an interconnecting line disposed on the passivation layer, and a plurality of connectors disposed on and electrically connected to the plurality of conductive pads. Each of the plurality of connectors includes a stacked structure of a first conductive pillar and a second conductive pillar disposed directly on the first conductive pillar, wherein a span of the second conductive pillar is smaller than a span of the first conductive pillar, and an orthogonal projection of the second conductive pillar falls within an orthogonal projection of the first conductive pillar, and the interconnecting line is located beside and spaced apart from the plurality of connectors.