Abstract: A water filter includes a filtering head, a filter bottle assembly, a switch member, and a quick release device. The filtering head includes a flow channel module. The filter bottle assembly includes a filter bottle. The quick release device includes a press lever, two links, and two push members. When the press lever is pivoted, the two links and the two push members are driven by the press lever to move the filter bottle simultaneously so that the filter bottle is mounted on or detached from the filtering head quickly. A switch member functions as a waterway switch to control a water supply of the filtering head and functions as a locking mechanism for locking or unlocking the quick release device.

Abstract: A liquid storage tank may include a body with an inner cavity, wherein a first liquid storage area and a second liquid storage area are provided in the body, and a partition is provided between the first liquid storage area and the second liquid storage area. A heater for heating solution is provided in the first liquid storage area. A liquid outlet is provided in the second liquid storage area.

Abstract: A fabricated rapid construction platform for a bridge, wherein the construction platform comprises a fixing frame, an upper-layer tubular pile position control structure (6), a lower-layer tubular pile position control structure (7), and a console; the fixing frame comprises a bottom rail platform (1), supporting posts (3), a top operation platform (2), and several supporting legs (4); the upper-layer tubular pile position control structure (6) and the lower-layer tubular pile position control structure (7) are provided between the bottom rail platform (1) and the top operation platform (2); the upper-layer tubular pile position control structure (6) comprises two sub-structures arranged symmetrically about the central axis of a second through hole, and each sub-structure comprises a braking device (61), a vertical control arm (63), and a horizontal control arm (62).

Abstract: An electronic device includes: a substrate; a plurality of electronic components disposed on the substrate, wherein there is a first pitch between two adjacent electronic components in a first direction; and a protective glue disposed on the substrate and the electronic components, and provided with at least one groove disposed between the two adjacent electronic components, wherein a distance between an edge of one of the two adjacent electronic components and the at least one groove satisfies an equation: 0.3 mm ? D ? 1 < ( P / 2 ) , where D1 is the distance between the edge of the one of the two adjacent electronic components and the at least one groove, and P is the first pitch.

Abstract: An electronic device is configured to execute instructions: compiling a first AI model and second AI model(s) to a first compiled file and second compiled file(s), respectively, wherein the first compiled file comprises a first data set and a first command set, and the second compiled file(s) comprises second data set(s) and second command set(s); generating light version file(s) for the AI model(s), wherein the light version file(s) comprises the second command set(s) and data patch(es); storing the first compiled file and the light version file(s) to a storage device; loading the first compiled file from the storage device to a memory; loading the light version file(s) from the storage device to the memory; generating the second data set(s) according to the first data set and the data patch(es); and executing the second AI model(s) according to the generated second data set(s) and the second command set(s) in the memory.

Abstract: A package comprises at least one first device die, and a redistribution line (RDL) structure having the at least one first device die bonded thereto. The RDL structure comprises a plurality of dielectric layers, and a plurality of RDLs formed through the plurality of dielectric layers. A trench is defined proximate to axial edges of the RDL structure through each of the plurality of dielectric layers. The trench prevents damage to portions of the RDL structure located axially inwards of the trench.

Abstract: An example embodiment of the present disclosure involves a method for semiconductor device fabrication. The method comprises providing a structure that includes a conductive component and an interlayer dielectric (ILD) that includes silicon and surrounds the conductive component, and forming, over the conductive component and the ILD, an etch stop layer (ESL) that includes metal oxide. The ESL includes a first portion in contact with the conductive component and a second portion in contact with the ILD. The method further comprises baking the ESL to transform the metal oxide located in the second portion of the ESL into metal silicon oxide, and selectively etching the ESL so as to remove the first portion of the ESL but not the second portion of the ESL.

Abstract: A lifting control apparatus may include: a base for holding a basket containing silicon wafers; brackets provided on an outside of both ends of the base; and a driver for driving the brackets to move up and down. The driver is provided with a lead screw. The lead screw is connected with the bracket on a same side. The lead screw on one side is driven to rotate the lead screw on another side synchronously, and the lead screws on both sides are driven to move the brackets on both sides and the base between the brackets up and down together. Or the lead screws on both sides are driven to rotate synchronously, so that the lead screws on both sides drive the base between the brackets through the correspondingly brackets to move up and down together.

Abstract: An apparatus for supplying cleaning liquid may include: a stock solution unit configured with a plurality of stock solution tanks; a cleaning unit configured with a plurality of cleaning tanks; and a transfer unit disposed between the stock solution unit and the cleaning unit. The transfer unit is configured with a plurality of independent transfer tanks. Each of the stock solution tanks communicates with at least one of the transfer tanks, each of the transfer tanks communicates with one of the cleaning tanks, and each of the cleaning tanks communicates with at least one of the transfer tanks.

Abstract: A silicon wafer sorting mechanism includes a wafer distribution unit, a sorting unit, and a transmission unit disposed sequentially. The sorting unit includes a sorting table with one terminal hinged to the wafer distribution unit. The sorting table rotates and tilts with a point where the sorting table is hinged to the wafer distribution unit. The sorting table and the transmission unit are arranged up and down in dislocation or the sorting table is placed horizontally against the transmission unit, thereby forming two transmission lines in different directions to sort silicon wafers of different types.

Abstract: Examples described herein provide a computer-implemented method for identifying regression test failures that includes comparing a base code to a new code to locate an updated aspect of a program. The method further includes inserting debug code into corresponding source files for each of the base code and the new code for the updated aspect. The method further includes building a first image for the base code and a second image for the new code, the first and second images running in respective first and second containers. The method further includes comparing debugging outputs from a regression test of the respective first and second containers to identify a regression test failure. The method further includes implementing a corrective action to correct the regression test failure.

Abstract: A semiconductor device includes first IC dies disposed side-by-side, a second IC die overlapping and electrically coupled to the first IC dies, and first conductive features. Each first IC die includes first and second die connectors. A first pitch of the first die connectors is less than a second pitch of the second die connectors and is substantially equal to a third pitch of the third die connectors of the second IC die. The first conductive features are interposed between and electrically coupled to the first and third die connectors. Each first conductive feature includes at least a first conductive bump and at least a first conductive joint.

Abstract: A package structure including IPD and method of forming the same are provided. The package structure includes a die, an encapsulant laterally encapsulating the die, a first RDL structure disposed on the encapsulant and the die, an IPD disposed on the first RDL structure and an underfill layer. The IPD includes a substrate, a first connector on a first side of the substrate and electrically connected to the first RDL structure, a guard structure on a second side of the substrate opposite to the first side and laterally surrounding a connector region, and a second connector disposed within the connector region and electrically connected to a conductive via embedded in the substrate. The underfill layer is disposed to at least fill a space between the first side of the IPD and the first RDL structure. The underfill layer is separated from the connector region by the guard structure.

Abstract: An electronic device includes a circuit board, a shielding member, and a testing pin. The circuit board includes a grounding area. The shielding member is located on a side of the circuit board and includes a shielding layer and an insulating layer. The shielding layer is electrically connected to the grounding area. The insulating layer is located on a side of the shielding layer away from the circuit board. The testing pin is disposed on the circuit board and electrically connected to the shielding layer.

Abstract: A semiconductor package includes a semiconductor die including an active surface and an electrical terminal on the active surface, and a redistribution circuitry disposed on the active surface of the semiconductor die and connected to the electrical terminal. A top surface of the redistribution circuitry includes a planar portion and a concave portion connected to the planar portion, the concave portion is directly over the electrical terminal, and a minimum distance measured from a lowest point of the concave portion to a virtual plane where the planar portion is located is equal to or smaller than 0.5 ?m.

Abstract: Compositions and methods are provided for enzymes with altered properties that involve a systematic approach to mutagenesis and a screening assay that permits selection of the desired proteins. Embodiments of the method are particularly suited for modifying specific properties of restriction endonucleases such as star activity. The compositions includes restriction endonucleases with reduced star activity as defined by an overall fidelity index improvement factor.

Abstract: Embodiments of present disclosure relate to an apparatus and a method for controlling a delta-connected cascaded multilevel converter. The apparatus (100) for controlling a delta-connected cascaded multilevel converter (110) comprises: a converter controller (102) configured to: receive current signals indicating phase currents flowing through respective phase arms of the converter (110); determine a harmonic current signal indicating a circulating current of the converter (110) from the current signals; and generate, based on the determined harmonic current signal and a reference current signal, a harmonic voltage signal to cause an amplitude of the circulating current flowing through the phase arms of the converter (110) to be a predetermined amplitude.

Abstract: Disclosed are an AF (autofocus) motor structure, a camera device, and an electronic product. The AF motor structure includes a base, a housing, a bracket, a main carrier, and a lens, the bracket is provided with a main coil for driving the main carrier to move, and the main carrier is provided with a magnet corresponding to the main coil; the main carrier is provided with a continuous zoom assembly that drives the lens to move, the continuous zoom assembly includes a sub-carrier movable relative to the main carrier in the sliding direction of the main carrier and a sub-coil disposed on the sub-carrier, the lens is connected to the sub-carrier, and the sub-coil corresponds to the magnet.

Abstract: A lithography system includes an immersion lithographic apparatus, a fluid supply device, and a sensor. The fluid supply is configured to supply fluid to the immersion lithographic apparatus. The fluid supply device includes at least one liquid storage tank, an upper liquid pipe and a lower liquid pipe connected to the liquid storage tank. The sensor includes at least one hydraulic pressure gauge. The at least one hydraulic pressure gauge is arranged near a lower part of the liquid storage tank and connected to the lower liquid pipe and the upper liquid pipe so as to measure the hydraulic pressure at a bottom of the liquid storage tank. The height of the liquid level in the liquid storage tank is calculated from the hydraulic pressure.