Abstract: A method for etching a tungsten containing layer is provided. An etch gas is provided comprising O2 and a fluorine containing component, wherein the etch gas has at least as many oxygen atoms as fluorine atoms. A plasma is formed from the etch gas. The tungsten containing layer is etched with the plasma formed from the etch gas.

Abstract: A label affixing machine includes a holder, a storing device, a storing device, a peeling device and a conveyer. The storing device, the peeling device and the conveyer are fixed in position on the holder. The picking device is coupled to the conveyer. The label includes a bottom board affixed under the label, the label affixing machine configured to affix the label on an object. The picking device is configured for picking the label. The peeling device includes a second fixing module fixed in position on the holder, a second moving module coupled to the second fixing module and a robotic arm fixed in position on the second moving module. The robotic arm is configured for clamping the bottom board and peeling the bottom board from the label. The conveyer moves the picking device and affixes the label on the object.

Abstract: An automatic film peeling machine for peeling a film adhered on a board, includes a workbench, a frame mounted on the workbench including a movable pushing block, a supporting plate mounted on the frame, a suction plate for locating the board on the supporting plate, and a peeling module. The peeling module includes a sliding member, a resisting member and a movable clamping member mounted on the sliding member. The clamping member includes a clamping portion with a plurality of vents. Air is blown out from the vents for rotating a movable un-adhered portion of the film into a space between the clamping portion and the resisting member. The clamping member is moved toward the resisting member for clamping the movable un-adhered portion. The pushing block is moved to push the sliding member away from the frame, for peeling the first film from the board.

Abstract: A product positioning device includes a support, a first guide rail, a second guide rail, a support platform, a latching device, and a driving device. The first guide rail and the second guide rail are positioned on the support. The support platform is configured to receive a product to be positioned. The support platform is movable to an end of the first guide rail. The latching device is movable to a position holding the product to be positioned against the support platform. The driving device is movable to a position nearer the support platform. The driving device is further slidably engaged with the second guide rail. The driving device moves to the driving device position as the support platform moves to the end of the first guide rail, and the latching device moves to the latching device position as the driving device moves to the driving device position.

Abstract: A method for etching a tungsten containing layer is provided. An etch gas is provided comprising O2 and a fluorine containing component, wherein the etch gas has at least as many oxygen atoms as fluorine atoms. A plasma is formed from the etch gas. The tungsten containing layer is etched with the plasma formed from the etch gas.

Abstract: An auxiliary device includes a base, two rotatable arms, and an elastic member. The two arms are rotatably connected to the base and each includes a mating surface that defines a recess. The recesses of the two arms cooperatively form a through hole when the mating surface is in contact with each other. The through hole includes, from top to bottom, a first tapered hole portion, an annular groove, a second tapered hole portion, and a round hole portion. The annular groove is used to receive a head of a screw, and the round hole portion has a lateral surface is used to contact a shank of the screw to keep the screw upright. The elastic member is arranged between the two rotatable arms and applies a pushing force to the two rotatable arms.

Abstract: Disclosed herein are methods of filling a 3-D structure of a semiconductor substrate with a tungsten-containing material. The 3-D structure may include sidewalls, a plurality of openings in the sidewalls leading to a plurality of features having a plurality of interior regions. The methods may include depositing a first layer of the tungsten-containing material within the 3-D structure such that the first layer partially fills a plurality of interior regions of the 3-D structure, etching vertically and horizontally after depositing the first layer, and depositing a second layer of the tungsten-containing material within the 3-D structure after the vertical and horizontal etching such that the second layer fills at least a portion of the interior regions left unfilled by the first layer. Also disclosed herein are apparatuses for filling a 3-D structure of a semiconductor substrate with a tungsten-containing material having a controller with instructions for etching vertically and horizontally.

Abstract: A system and method is provided which predicts problematic areas for lithography in a circuit design, and more specifically, which uses modeling data from a modeling tool to accurately predict problematic lithographic areas. The method includes identifying surface heights of plurality of tiles of a modeled wafer, and mathematically mimicking a lithographic tool to determine best planes of focus for exposure for the plurality of tiles.

Abstract: A chip card ejecting mechanism includes a base body, a push member, a rotating member and an elastic member resisting between the base body and the rotating member. The base body includes a guiding member defining a hole and having a number of guiding rails. Each guiding rail includes a resisting surface and a guiding surface. The push member includes a push rod extending through the hole and a number of active gears. Each active gear defines an active cooperative surface. The rotating member includes a number of the passive gears. Each passive gear includes a passive cooperative surface. When the push member is pressed toward the rotating member by a transient external force, the rotating member compresses the elastic member until the active cooperative surface arrives at the guiding surface, the elastic member releases and drives the passive cooperative gears to slide along the first sliding slot.

Abstract: A screwdriver includes a screw rod including a first end and a second end opposite to the first end. The screwdriver defines a screw slot on an external portion adjacent to the second end. The screwdriver further includes a screwdriver bit fixed to the first end of the screw rod, a resisting portion fixed to the second end of the screw rod, a handle placed over a portion of the screw rod adjacent to the second end. A movable element fixed to an inside wall of the handle and tightly closed to an inside surface of the screw slot, and an elastic element placed over the screw rod between the first end and the handle.

Abstract: Disclosed herein are methods of filling a 3-D structure of a semiconductor substrate with a tungsten-containing material. The 3-D structure may include sidewalls, a plurality of openings in the sidewalls leading to a plurality of features having a plurality of interior regions. The methods may include depositing a first layer of the tungsten-containing material within the 3-D structure such that the first layer partially fills a plurality of interior regions of the 3-D structure, etching vertically and horizontally after depositing the first layer, and depositing a second layer of the tungsten-containing material within the 3-D structure after the vertical and horizontal etching such that the second layer fills at least a portion of the interior regions left unfilled by the first layer. Also disclosed herein are apparatuses for filling a 3-D structure of a semiconductor substrate with a tungsten-containing material having a controller with instructions for etching vertically and horizontally.

Abstract: Isoflavone fatty acid ester derivatives of formula (I) or (II), the preparation method thereof and the pharmaceutical compositions containing such compounds are disclosed. The uses of such compounds in preparation of medicaments for preventing or treating hyperlipidemia, obesity or type II diabetes are also disclosed.

Abstract: An auxiliary device includes a base, two rotatable arms, and an elastic member. The two arms are rotatably connected to the base and each includes a mating surface that defines a recess. The recesses of the two arms cooperatively form a through hole when the mating surface is in contact with each other. The through hole includes, from top to bottom, a first tapered hole portion, an annular groove, a second tapered hole portion, and a round hole portion. The annular groove is used to receive a head of a screw, and the round hole portion has a lateral surface is used to contact a shank of the screw to keep the screw upright. The elastic member is arranged between the two rotatable arms and applies a pushing force to the two rotatable arms.

Abstract: Systems and methods for relative ordering circuit synthesis are provided herein. One aspect provides for generating at least one circuit design via at least one processor accessible by a computing device; wherein generating at least one circuit design comprises: generating at least one relative order structure based on at least one circuit design layout, the at least one relative order structure comprising at least one placement constraint associated with at least one circuit element; placing the at least one circuit element associated with the at least one placement constraint within a circuit design according to the at least one placement constraint; and placing circuit elements not associated with the at least one placement constraint within the circuit design. Other embodiments and aspects are also described herein.

Abstract: A method and apparatus for stress effect model optimization in IC SPICE model and an IC fabrication method are disclosed. The method for optimizing a stress effect model in an integrated circuit model including obtaining values of at least one layout parameter for a plurality of layout areas in an integrated circuit layout; obtaining values of at least one processing parameter for a plurality of wafer areas corresponding to the layout areas; based on the obtained values of the layout parameter and the obtained values of the process parameter, establishing a function representative of dependency of the process parameter on the layout parameter; and applying the function as a process model parameter to the stress effect model.

Abstract: Isolated immunogens including a HIV-1 gp120 polypeptide or immunogenic fragment thereof stabilized in a CD4 bound confirmation by crosslinked cysteines, and methods of their use are disclosed. The immunogens are useful, for example, for generating an immune response to HIV-1 gp120 in a subject.

Abstract: Indenoisoquinolinone derivatives (I), the manufacturing method and the medical use thereof, which belong to pharmaceutical chemistry and organic chemistry field, are disclosed. These compounds can be used for treating several medical symptoms related to postmenopausal syndrome, uterine fibers deterioration and aortic smooth muscle cells proliferation, especially ER-(+) depend breast cancer. Meanwhile, these compounds can also be used for treating glioma and lung cancer, and have inhibiting effect on tumor metastasis effect on tumor metastasis.

Abstract: A surface contact card holder includes a main body defining an entrance and a recess communicating with the entrance, a tray for receiving a surface contact card, and a door attached to an end of the tray and releasably received in the entrance. The tray is slidably received in the main body through the entrance. The door includes an operation board comprising elastic material and a fastening board attached to the operation board. The fastening board is movably connected to the tray. The operation board is positioned adjacent to the recess.

Abstract: A latching assembly is used in an electronic device. The electronic device includes a first housing and a second housing. The latching assembly includes at least a pair of latching elements and at least a pair of locking elements corresponding to the latching elements. Each latching element includes a hook located in the first housing, and a catch member defined in the second housing. Each locking element includes a movable member received in the first housing. Each hook clasps one of catch members to engage the first housing and the second housing. Then the movable member moves to the second housing to resist against the hook, thereby limiting the movement of the hook relative to the catch member. An electronic device using the latching assembly is also described.

Abstract: Latches and local-clock-buffers are automatically placed during integrated circuit physical synthesis. Prior to physically laying out the datapath, locations are assigned for the latches based on a logical representation of the datapath and on the fixed placements of pins. The computed latch locations optimize the datapath according to some predetermined criteria. Local-clock-buffers are also preplaced together with the latches further improving datapath performance.