Patents by Inventor Huai Huang

Huai Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200303239
    Abstract: Techniques are provided to fabricate semiconductor devices. For example, a semiconductor device can include an alternating arrangement of vertical metallic lines defining openings therebetween on a substrate. An interlevel dielectric layer is disposed on a consecutive first opening and a second opening to seal an air gap between a top surface of the substrate and a bottom surface of the interlevel dielectric layer.
    Type: Application
    Filed: March 22, 2019
    Publication date: September 24, 2020
    Inventors: Christopher J. Penny, Benjamin D. Briggs, Michael Rizzolo, Lawrence A. Clevenger, Huai Huang, Hosadurga Shobha
  • Patent number: 10784156
    Abstract: A conductive line structure comprises a first conductive line arranged in a first dielectric layer, a second conductive line arranged in the first dielectric layer, a cap layer arranged on the first conductive line and the second conductive line, and an airgap arranged between the first conductive line and the second conductive line, the airgap defined by the first dielectric layer and the cap layer.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 22, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. Deprospo, Huai Huang, Christopher J. Penny, Michael Rizzolo
  • Patent number: 10784197
    Abstract: A method for manufacturing a semiconductor device includes forming a plurality of trenches in a dielectric layer, wherein the plurality of trenches each comprise a rounded surface, depositing a liner layer on the rounded surface of each of plurality of trenches, and depositing a conductive layer on the liner layer in each of the plurality of trenches, wherein the conductive layer and the liner layer form a plurality of interconnects, and each of the plurality of interconnects has a cylindrical shape.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: September 22, 2020
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha
  • Patent number: 10777411
    Abstract: Techniques are provided to fabricate semiconductor devices. For example, a semiconductor device can include a substrate including a central portion and a pair of outer portions. A first self-assembled monolayer is attached to the central portion of the substrate. A second self-assembled monolayer is attached to the first self-assembled monolayer. A first dielectric layer is disposed on each of the outer portions. A second dielectric layer is disposed on the first dielectric layer.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: September 15, 2020
    Assignee: International Business Machines Corporation
    Inventors: Son Nguyen, Benjamin D. Briggs, Huai Huang
  • Patent number: 10763160
    Abstract: Techniques are provided to fabricate semiconductor devices. For example, a semiconductor device can include an alternating arrangement of vertical metallic lines defining openings therebetween on a substrate. An interlevel dielectric layer is disposed on a consecutive first opening and a second opening to seal an air gap between a top surface of the substrate and a bottom surface of the interlevel dielectric layer.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: September 1, 2020
    Assignee: International Business Machines Corporation
    Inventors: Christopher J. Penny, Benjamin D. Briggs, Michael Rizzolo, Lawrence A. Clevenger, Huai Huang, Hosadurga Shobha
  • Patent number: 10764475
    Abstract: A driving mechanism is provided, including a housing, a hollow frame, a holder, and a driving assembly. The frame is fixed to the housing and has a stop surface. The holder is movably disposed in the housing for holding the optical element. The driving assembly is disposed in the housing to drive the holder and the optical element moving along the optical axis of the optical element relative to the frame. Specifically, the stop surface is parallel to the optical axis to contact the holder and restrict the holder in a limit position.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: September 1, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Bing-Ru Song, Yi-Ho Chen, Chia-Pin Hsu, Chih-Wei Weng, Shin-Hua Chen, Chien-Lun Huang, Chao-Chun Chang, Shou-Jen Liu, Kun-Shih Lin, Nai-Wen Hsu, Yu-Cheng Lin, Shang-Yu Hsu, Yu-Huai Liao, Yi-Hsin Nieh, Shih-Ting Huang, Kuo-Chun Kao, Fu-Yuan Wu
  • Publication number: 20200243383
    Abstract: The present invention provides interconnects with self-forming wrap-all-around graphene barrier layer. In one aspect, a method of forming an interconnect structure is provided. The method includes: patterning at least one trench in a dielectric; forming an interconnect in the at least one trench embedded in the dielectric; and forming a wrap-all-around graphene barrier surrounding the interconnect. An interconnect structure having a wrap-all-around graphene barrier is also provided.
    Type: Application
    Filed: January 30, 2019
    Publication date: July 30, 2020
    Inventors: Huai Huang, Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Nicholas A. Lanzillo, Christian Lavoie, Devika Sil, Prasad Bhosale, James Kelly
  • Patent number: 10714889
    Abstract: A sensor system can comprise a light source generating a light pulse that is collimated, and a plurality of optical elements. Each of the plurality of optical elements is configured to rotate independently about an axis that is substantially common, and the plurality of optical elements operate to collectively direct the light pulse to one or more objects in an angle of view of the sensor system. Furthermore, the sensor system can comprise a detector configured to receive, via the plurality of optical elements, at least a portion of photon energy of the light pulse that is reflected back from the one or more objects in the angle of view of the sensor system, and convert the received photon energy into at least one electrical signal.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: July 14, 2020
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Xiaoping Hong, Huai Huang, Jiebin Xie
  • Patent number: 10705827
    Abstract: A method for updating system information of a computer device is provided. The computer device includes a baseboard management controller (BMC) and a non-volatile memory. The method includes steps of: a) upon activation of the BMC, determining whether the BMC is in a power on reset (PoR) state, and obtaining current system information that is associated with the computer device; b) when it is determined that the BMC is in the PoR state, determining whether system information stored in the non-volatile memory conforms with the current system information; and c) when the determination made in step b) is negative, storing the current system information in the non-volatile memory.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: July 7, 2020
    Assignee: MITAC COMPUTING TECHNOLOGY CORPORATION
    Inventors: Chien-Huai Su, Yi-Tung Huang, Chia-An Huang, Yen-Ting Yueh
  • Publication number: 20200204038
    Abstract: Hollow motor apparatuses and associated systems and methods for manufacturing hollow motor apparatuses may be provided. In one implementation, a hollow motor apparatus may include a rotor assembly rotatable about a rotation axis, a stator assembly positioned adjacent to, and coaxially with, the rotor assembly, and a bearing assembly configured to maintain a position of the rotor assembly relative to the stator assembly. The rotor assembly may include an inner portion disposed around an opening configured to receive and to rotate at least a portion of a payload. The bearing assembly may be disposed outside of the inner portion of the rotor assembly.
    Type: Application
    Filed: January 9, 2020
    Publication date: June 25, 2020
    Applicant: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Huai HUANG, Jin ZHAO, Peng WANG, Xiaoping HONG, Zhenhao ZHOU
  • Patent number: 10692203
    Abstract: Techniques for measuring defectivity using model-less scatterometry with cognitive machine learning are provided. In one aspect, a method for defectivity detection includes: capturing SEM images of defects from a plurality of training wafers; classifying type and density of the defects from the SEM images; making training scatterometry scans of a same location on the training wafers as the SEM images; training a machine learning model to correlate the training scatterometry scans with the type and density of the defects from the same location in the SEM images; making scatterometry scans of production wafers; and detecting defectivity in the production wafers by measuring the type and density of the defects in the production wafers using the machine learning model, as trained, and the scatterometry scans of the production wafers. A system for defectivity detection is also provided.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: June 23, 2020
    Assignee: International Business Machines Corporation
    Inventors: Dexin Kong, Robin Hsin Kuo Chao, Huai Huang
  • Patent number: 10679934
    Abstract: A semiconductor interconnect structure and a method of fabricating the same are provided. The semiconductor interconnect structure includes a sea of interconnect lines including metal lines and neighboring dummy lines. The semiconductor interconnect structure further includes a dielectric layer arranged between the sea of lines.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: June 9, 2020
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha
  • Publication number: 20200175142
    Abstract: An electronic device with a fingerprint sensing function and a fingerprint image processing method are provided. The electronic device includes a processor, a fingerprint sensor, and a temperature sensor. The fingerprint sensor is coupled to the processor. The fingerprint sensor is configured to obtain a current fingerprint image. The temperature sensor is coupled to the processor. The temperature sensor is configured to obtain current temperature information. The processor obtains current background noise according to the current temperature information, and removes the background noise from the current fingerprint image to generate a corrected fingerprint image.
    Type: Application
    Filed: September 23, 2019
    Publication date: June 4, 2020
    Applicant: Egis Technology Inc.
    Inventors: Yuan-Lin Chiang, Yu-Chun Cheng, Yong-Huai Huang
  • Patent number: 10651078
    Abstract: A method is presented forming a fully-aligned via (FAV) and airgaps within a semiconductor device. The method includes forming a plurality of copper (Cu) trenches within an insulating layer, forming a plurality of ILD regions over exposed portions of the insulating layer, selectively removing a first section of the ILD regions in an airgap region, and maintaining a second section of the ILD regions in a non-airgap region. The method further includes forming airgaps in the airgap region and forming a via in the non-airgap region contacting a Cu trench of the plurality of Cu trenches.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: May 12, 2020
    Assignee: Tessera, Inc.
    Inventors: Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha
  • Patent number: 10629529
    Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: April 21, 2020
    Assignee: Tessera, Inc.
    Inventors: Benjamin David Briggs, Lawrence A. Clevenger, Bartlet H. Deprospo, Huai Huang, Christopher J. Penny, Michael Rizzolo
  • Patent number: 10629478
    Abstract: A method of forming a semiconductor device includes forming a dielectric spacer along sidewalls of a plurality of interconnect openings extending through a sacrificial dielectric layer and a first dielectric layer until a top portion of a first conductive material, the dielectric spacer includes a dielectric material having a dielectric constant higher than a dielectric constant of the sacrificial dielectric layer and higher than a dielectric constant of the first dielectric layer, conformally depositing a barrier liner within the plurality of interconnect openings above and in direct contact with the dielectric spacer, filling the interconnect openings with a second conductive material, removing the sacrificial dielectric layer to expose portions of the dielectric spacer above the first dielectric layer, and reducing a thickness of exposed portions of the dielectric spacer.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: April 21, 2020
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha
  • Publication number: 20200096728
    Abstract: An optical element driving mechanism is provided, including: a movable portion for holding an optical element; a fixed portion comprising a case and a bottom arranged along a main axis, wherein the case includes: a top plate extended along a direction that is perpendicular to the main axis; a sidewall extended from edges of the top plate along the main axis and fixed on the bottom, wherein the sidewall includes: a first surface parallel to the main axis; a second surface connected to the first surface and is not parallel to the first surface; and a third surface opposite to the second surface and is not parallel to the first surface; and an adhesive element, wherein the case is connected to the bottom through the adhesive element, and the adhesive element is in direct contact with the second surface and the third surface.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Inventors: Kun-Shih LIN, Yu-Sheng LI, Shih-Ting HUANG, Yi-Hsin NIEH, Yu-Huai LIAO
  • Publication number: 20200064275
    Abstract: A method for machine learning enhanced optical-based screening for in-line wafer testing includes receiving optical spectra data for a wafer-under-test by performing scatterometry on the wafer-under-test, performing predictive model screening by applying a predictive model based on the optical spectra data, determining whether a device associated with the wafer-under-test is defective based on the predictive model screening, and if the device is determined to be defective, dynamically modifying a yield map associated with the wafer-under-test, including reassigning at least one die.
    Type: Application
    Filed: August 23, 2018
    Publication date: February 27, 2020
    Inventors: Robin Hsin Kuo Chao, Mary Breton, Huai Huang, Dexin Kong, Lawrence A. Clevenger
  • Publication number: 20200067390
    Abstract: A driving device includes two rotor assemblies, a stator assembly, and a positioning assembly. Each rotor assembly includes a rotation axis and a rotor. The rotor includes a hollow chamber. The two rotor assemblies include a first rotor assembly and a second rotor assembly, a rotation axis of the first rotor assembly is parallel with a rotation axis of the second rotor assembly, a rotor of the first rotor assembly is at least partially embedded in a chamber of a rotor of the second rotor assembly. The stator assembly is surroundingly disposed at an outer side of the two rotor assemblies and drives a rotor. The rotor driven by the stator assembly causes another rotor of one of the first rotor assembly and the second rotor assembly to rotate. The positioning assembly is located outside of the rotors, and limits the rotors to rotate around corresponding fixed rotation axes.
    Type: Application
    Filed: October 28, 2019
    Publication date: February 27, 2020
    Inventors: Zheyang Li, Huai Huang, Jin Zhao, Xiaoping Hong, Peng Wang
  • Patent number: D891504
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: July 28, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Fu-Yuan Wu, Kun-Shih Lin, Shang-Yu Hsu, Yi-Ho Chen, Shih-Ting Huang, Shou-Jen Liu, Chien-Lun Huang, Yi-Hsin Nieh, Chen-Chi Kuo, Chia-Pin Hsu, Yu-Huai Liao, Shin-Hua Chen, Yu-Cheng Lin, Shao-Chung Chang, Kuo-Chun Kao, Chia-Hsiu Liu, Chao-Chun Chang, Yuan-Shih Liao