Abstract: A distance measuring device includes a scanning module including a rotor assembly, the rotor assembly including a rotor, the rotor including a receiving cavity and an optical element disposed in the receiving cavity, the optical element rotating synchronously with the rotor assembly, the optical element including a first end and a second end, the first end and the second end being respectively positioned at two ends in a radial direction of the optical element, a thickness of the first end being greater than a thickness of the second end, a notch being formed on a side of the first end of the rotor or/and the optical element; and a distance measuring module configured to emit a laser pulse to the scanning module.

Abstract: A method for manufacturing a semiconductor device includes forming a first vertical transistor structure in a first device region on a substrate, and forming a second vertical transistor structure in a second device region on the substrate. The first vertical transistor structure includes a first plurality of fins, and the second vertical transistor structure includes a second plurality of fins. A plurality of first source/drain regions are grown from upper portions of the first plurality of fins, and a contact liner layer is formed on the first source/drain regions. The method further includes forming a plurality of first silicide portions from the contact liner layer on the first source/drain regions, and forming a plurality of second silicide portions on a plurality of second source/drain regions extending from upper portions of the second plurality of fins. The second silicide portions have a different composition than the first silicide portions.

Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer, and forming a second dielectric layer stacked on the first dielectric layer. In the method, a plurality of conductive lines are formed in the first and second dielectric layers, and the plurality of conductive lines are recessed to form a plurality of openings in the second dielectric layer. The method also includes forming a plurality of dielectric fill layers on the plurality of conductive lines in the plurality of openings. At least one of the plurality of dielectric fill layers is selectively removed with respect to the second dielectric layer to expose a conductive line of the plurality of conductive lines, and a via is formed in place of the selectively removed dielectric fill layer.

Abstract: A method for fabricating a semiconductor device includes forming one or more layers including at least one of a liner and a barrier along surfaces of a first interlevel dielectric (ILD) layer within a trench, after forming the one or more liners, performing a via etch to form a via opening exposing a first conductive line corresponding to a first metallization level, and forming, within the via opening and on the first conductive line, a barrier-less prefilled via including first conductive material.

Abstract: A laser measuring device includes a light transceiving module configured to emit laser pulses and receive laser pulses reflected by a detection object; a scanning module including a rotatable transmissive optical element, the scanning module being configured to change a transmission direction of the laser pulse passing through the scanning module; and a reflection module including a rotatable reflective optical element, the reflective optical element being configured to reflect the laser pulse passing through the reflective optical element, the scanning module and the reflection module being sequentially disposed on a light exiting path of the light transceiving module.

Abstract: An electronic device with a fingerprint sensing function and a fingerprint image processing method are provided. The electronic device includes a processor, a fingerprint sensor, and a temperature sensor. The fingerprint sensor is coupled to the processor. The fingerprint sensor is configured to obtain a current fingerprint image. The temperature sensor is coupled to the processor. The temperature sensor is configured to obtain current temperature information. The processor obtains current background noise according to the current temperature information, and removes the background noise from the current fingerprint image to generate a corrected fingerprint image.

Abstract: A method for fabricating a semiconductor device including a skip via connection between metallization levels includes subtractively etching first conductive material to form a first via and a skip via on a first conductive line. The first via and the first conductive line are included within a first metallization level. The skip via is used to connect the first metallization level to a third metallization level above a second metallization level. The method further includes forming, on the first via from second conductive material, a second via disposed on a second conductive line. The second via and the second conductive line are included within the second metallization level.

Abstract: Disclosed are techniques for scanning an optical beam in two dimensions (e.g. azimuth and elevation) and for increasing or decreasing a field-of-view (FOV) of the scanned beam. Scanning may be performed by various configurations of prisms, rotatable mirrors, and/or rotatable polygonal mirrors. In some configuration, changes to the FOV of the scanned beam may be performed by prisms positioned with a predetermined angular relationship and may include other optical components, as well. Depending on the predetermined angular relationship, the prisms can expand the FOV along one or more axis and/or may compress the FOV along one or more axis.

Abstract: A laser-ranging device includes an emitter, an optical assembly, a detecter, and a drive system. The emitter is configured to emit a laser pulse sequence. The an optical assembly includes a collimating lens and a converging lens. The collimating lens is configured to collimate the laser pulse sequence emitted by the emitter and emit the laser pulse sequence. The converging lens is configured to converge at least a part of return light reflected by a to-be-detected object. The detecter is configured to receive light converged by the converging lens, convert the light into an electrical signal, and determine a distance between the to-be-detected object and the laser-ranging device according to the electrical signal. The drive system is configured to drive the optical assembly to move in a plane perpendicular to an optical axis of the laser pulse sequence and/or along an optical axis direction of the optical axis.

Abstract: A method for fabricating a semiconductor device includes forming one or more layers including at least one of a liner and a barrier along surfaces of a first interlevel dielectric (ILD) layer within a trench, after forming the one or more liners, performing a via etch to form a via opening exposing a first conductive line corresponding to a first metallization level, and forming, within the via opening and on the first conductive line, a barrier-less prefilled via including first conductive material.

Abstract: The present disclosure provides a distance detection device. The distance detection device includes a housing; and a plurality of distance measuring assemblies disposed in the housing. Two adjacent distance measuring assemblies have overlap field of views. Each distance measuring assembly is configured to measure a distance from an object to be detected in the corresponding field of view to the distance detection device.

Abstract: A method is presented forming a fully-aligned via (FAV) and airgaps within a semiconductor device. The method includes forming a plurality of copper (Cu) trenches within an insulating layer, forming a plurality of ILD regions over exposed portions of the insulating layer, selectively removing a first section of the ILD regions in an airgap region, and maintaining a second section of the ILD regions in a non-airgap region. The method further includes forming airgaps in the airgap region and forming a via in the non-airgap region contacting a Cu trench of the plurality of Cu trenches.

Abstract: The present disclosure provides a distance detection device. The distance detection device includes a light source configured to emit pulse light beams sequentially; and a scanning module including a first optical module, a second optical module, and drivers. The first optical module and the second optical module are sequentially positioned on an optical path of the light beams emitted by the light source, the drivers drive the first optical module and the second optical module to move to sequentially project the light beams emitted by the light source to different directions and form a strip-shaped scanning range after being emitted from the scanning module.

Abstract: A novel imaging system is provided for capturing imaging data. According to the disclosed embodiments, the imaging system comprises one or more cameras configured to capture the same scene within each camera's field of view. The imaging system also includes a plurality of bandpass filters that may be positioned in front of one or more cameras. Each bandpass filter may allow the transmission of incident electromagnetic signals between different pairs of first and second wavelengths. Accordingly, when the bandpass filters are positioned in front of the one or more cameras, each camera captures a different spectral image, i.e., containing only certain frequency components of the same scene being imaged in the cameras. The bandpass filters may be selectively aligned with one or more cameras by rotating and/or translating the filters relative to the cameras' positions in the imaging system.

Abstract: The present disclosure provides a motor state monitoring device. The motor state monitoring device includes a receiver disposed separately from a motor and configured to receive a measured signal emitted by the motor without contact; and a signal processing unit connected to the receiver and configured to determine a state of the motor based on the measured signal, and generate a state signal indicating the state of the motor.

Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.

Abstract: A gimbal system, a mobile platform and a battle system are disclosed. The gimbal system is used for a shooting battle. The gimbal system includes a gimbal and a battle information interactive device, the battle information interactive device 2 is arranged on an outer side surface of the gimbal to send and receive battle information and/or output special effects based on the battle information. The present disclosure may fulfill various interactive functions during a battle and achieve fun. An outer side of the battle information interactive device is not shielded, so that information sending and receiving and/or special effect outputting may be conveniently achieved from and/or by the outside.

Abstract: Systems and techniques associated light detection and ranging (LIDAR) applications are described. In one representative aspect, techniques can be used to implement a packaged semi-conductive apparatus is disclosed. The apparatus includes a substrate; a diode die carried by the substrate and positioned to emit an electromagnetic energy beam; and a shell coupled to the substrate to enclose the diode die. The shell includes an opening or a transparent area to allow the electromagnetic energy beam emitted from the diode die to pass through the shell.

Abstract: Systems, apparatuses and methods for indicating a moveable device such as an unmanned aerial vehicle (UAV) are disclosed herein. The present technology provides an illumination system having a light source and an illuminating component. In a representative embodiment, the light source is carried by a UAV and positioned to emit a light ray in a first direction. The illuminating component is carried by a propeller of the UAV. The illuminating component can include a light entrance portion, a light transmission portion, and a light exit portion. The light entrance portion is positioned to receive the light ray from the light source, the light transmission portion is positioned to transmit the light ray to the light exit portion, and the light exit portion is positioned to direct the light ray in a second direction so as to form a visual indication corresponding to the UAV.

Abstract: The present invention provides interconnects with self-forming wrap-all-around graphene barrier layer. In one aspect, a method of forming an interconnect structure is provided. The method includes: patterning at least one trench in a dielectric; forming an interconnect in the at least one trench embedded in the dielectric; and forming a wrap-all-around graphene barrier surrounding the interconnect. An interconnect structure having a wrap-all-around graphene barrier is also provided.