Patents by Inventor Huan Chen

Huan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220308150
    Abstract: Disclosed is a method for direction-of-arrival estimation based on sparse reconstruction in the presence of gain-phase error, which comprises the following steps: firstly, estimating a noise power and an gain error from an array received signal by adopting a characteristic decomposition method; then, based on a compensated covariance matrix, transforming a direction-of-arrival estimation problem into a non-convex optimization problem in a sparse frame by a method of sparse reconstruction; finally, estimating a grid angle and a deviation angle by using an alternate optimization method. This estimation method can effectively eliminate the influence of a phase error in direction-of-arrival estimation, and has better adaptability, which improves the resolution and estimation accuracy of the algorithm.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 29, 2022
    Inventors: Chunyi SONG, Dingke YU, Qin CHEN, Yuzhang XI, Xin WANG, Wenwei FANG, Zhiwei XU, Bing LAN, Huan LI
  • Patent number: 11453915
    Abstract: Provided in the present invention is the use of the miR-338 cluster as a marker of postmenopausal osteoporosis. In the present invention, it was found that the miR-338 cluster such as miR-338-3p and/or miR-3065-5p are highly expressed in patients with postmenopausal osteoporosis, and it can be used as a marker of postmenopausal osteoporosis, used for preparing an auxiliary diagnostic kit for postmenopausal osteoporosis, which can specifically detect the expression level of the miR-338 cluster in tissues, and is used for non-invasive and early auxiliary diagnosis of postmenopausal osteoporosis in clinic. In addition, inhibitors of the miR-338 cluster have the efficacy of promoting osteogenesis and can be used for treating or preventing postmenopausal osteoporosis.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: September 27, 2022
    Assignee: Wuhan University
    Inventors: Huan Liu, Chujiao Lin, Zhi Chen
  • Publication number: 20220304131
    Abstract: A method for using an extreme ultraviolet radiation source is provided. The method includes assembling a first droplet generator onto a port of a vessel; ejecting a target droplet from the first droplet generator to a zone of excitation in front of a collector; emitting a laser toward the zone of excitation, such that the target droplet is heated by the laser to generate extreme ultraviolet (EUV) radiation; stopping the ejection of the target droplet; after stopping the ejection of the target droplet, disassembling the first droplet generator from the port of the vessel; after disassembling the first droplet generator from the port of the vessel, inserting a cleaning device into the vessel through the port; and cleaning the collector by using the cleaning device.
    Type: Application
    Filed: July 7, 2021
    Publication date: September 22, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chiao-Hua CHENG, Hsin-Feng CHEN, Yu-Fa LO, Yu-Kuang SUN, Wei-Shin CHENG, Yu-Huan CHEN, Ming-Hsun TSAI, Cheng-Hao LAI, Cheng-Hsuan WU, Shang-Chieh CHIEN, Heng-Hsin LIU, Li-Jui CHEN, Sheng-Kang YU
  • Publication number: 20220301964
    Abstract: A package includes a die, first conductive structures, second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. A shape of the first conductive structures is different a shape of the second conductive structures. The second conductive structures include elliptical columns having straight sidewalls. A distance between the first conductive structure that is closest to the die and the die is greater than a distance between the second conductive structure that is closest to the die and the die. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.
    Type: Application
    Filed: June 8, 2022
    Publication date: September 22, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin, Hsi-Kuei Cheng, Yi-Jen Lai
  • Patent number: 11450081
    Abstract: An examination paper correction method and apparatus, an electronic device, and a storage medium are provided. The method includes: obtaining a first image of a standard examination paper; identifying an area and characters of each standard answer in the first image, and using a marking box to mark an answering area where each standard answer is located; determining position information of each marking box; obtaining a second image of an examination paper to be corrected; determining, according to the position information of each marking box of the first image, an answering area in the second image matching a position of the marking box, and using a marking box to mark the determined answering area; identifying characters of an answer to be corrected in each marking box of the second image; and comparing the characters of the standard answer with the characters of the answer to be corrected.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: September 20, 2022
    Assignee: Hangzhou Dana Technology Inc.
    Inventors: Tao He, Lihui Mao, Huan Luo, Mingquan Chen
  • Patent number: 11449656
    Abstract: A method including selecting a plurality of layout patterns, wherein each of the layout patterns comprises a corresponding via pillar structure that satisfies an electromigration (EM) rule, wherein each of the via pillar structures comprises metal layers and at least one via coupled to the metal layers. The method further includes selecting a layout pattern from the plurality of layout patterns having a smallest physical size. The method further includes performing a placement and routing process by using the selected layout pattern.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: September 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shao-Huan Wang, Sheng-Hsiung Chen, Wen-Hao Chen, Chun-Chen Chen, Hung-Chih Ou
  • Patent number: 11440659
    Abstract: A precision agriculture implementation method by UAV systems and artificial intelligence image processing technologies provides an unmanned aerial vehicle (UAV), a wireless communication device, a central control unit, and a spray device and a multispectral camera installed to the UAV. The farming area is divided into an array of blocks. The central control unit controls the UAV to fly over the blocks according to navigation parameters and the multispectral camera to capture a multispectral image of each block. A projected leaf area index (PLAI) and a normalized difference vegetation index (NDVI) of each block are calculated by the multispectral image, and a spray control mode of the spray device of the corresponding block is set according to the PLAI and NDVI. The spray device is controlled to spray a water solution, salt solution, fertilizer solution, and/or pesticide solution to the corresponding block according to the spray control mode.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: September 13, 2022
    Assignee: National Formosa University
    Inventors: Huan-Jung Lin, I-Chang Yang, Jie-Tong Zou, Suming Chen
  • Patent number: 11442365
    Abstract: A photolithography system utilizes tin droplets to generate extreme ultraviolet radiation for photolithography. The photolithography system irradiates the droplets with a laser. The droplets become energized and emit extreme ultraviolet radiation. A collector reflects the extreme ultraviolet radiation toward a photolithography target. The photolithography system isolates a source of droplets from oxidants to prevent the oxidation of the nozzle or the formation of metal oxides on the nozzle, both of which can adversely affect an ability of the nozzle to generate a sufficient amount of droplets and/or direct the droplets in a desired direction.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: September 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Kuang Sun, Ming-Hsun Tsai, Yu-Huan Chen, Wei-Shin Cheng, Cheng-Hao Lai, Hsin-Feng Chen, Chiao-Hua Cheng, Cheng-Hsuan Wu, Yu-Fa Lo, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
  • Publication number: 20220283517
    Abstract: A semiconductor substrate stage for carrying a substrate is provided. The semiconductor substrate stage includes a base layer, a magnetic shielding layer disposed on the base layer, a carrier layer disposed on the magnetic shielding layer, and a receiver disposed on the carrier layer. The receiver is configured to receive a microwave signal from a signal source electrically isolated from the receiver, and the microwave signal is used for controlling the movement of the semiconductor substrate stage.
    Type: Application
    Filed: July 8, 2021
    Publication date: September 8, 2022
    Inventors: Yu-Huan CHEN, Yu-Chih HUANG, Ya-An PENG, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
  • Patent number: 11437319
    Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: September 6, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Sheng-Hsiung Chen, Chung-Hsing Wang, Fong-yuan Chang, Lee-Chung Lu, Li-Chun Tien, Po-Hsiang Huang, Shao-huan Wang, Ting Yu Chen, Yen-Pin Chen, Chun-Chen Chen, Tzu-Hen Lin, Tai-Yu Cheng
  • Publication number: 20220276572
    Abstract: A photolithographic apparatus includes a droplet generator, a droplet generator maintenance system, and a controller communicating with the droplet generator maintenance system. The droplet generator maintenance system operatively communicates with the droplet generator, a coolant distribution unit, a gas supply unit, and a supporting member. The gas supply unit includes a heat exchange assembly and an air heating assembly. The coolant distribution unit is configured to control the temperature of the droplet generator within the acceptable droplet generator range.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 1, 2022
    Inventors: Yu-Huan CHEN, Cheng-Hsuan WU, Ming-Hsun TSAI, Shang-Chieh CHIEN, Li-Jui CHEN
  • Publication number: 20220266326
    Abstract: Flanges formed on sheet metal parts to increase the part stiffness or create mating surface for further assembly are created in an incremental sheet forming process using forming tool and supporting tool that move along a specified tool path so as to gradually deform a peripherally-clamped sheet metal work piece into the desired geometry. With two universal tools moving along the designed toolpath on the both sides of the part, the process is very flexible. Process time is can also be reduced by utilizing an accumulative double-sided incremental hole-flanging strategy, in which the flange is formed in only one step.
    Type: Application
    Filed: March 11, 2022
    Publication date: August 25, 2022
    Inventors: Huan Zhang, Jian Cao, Kornel Ehmann, Jun Chen
  • Publication number: 20220270963
    Abstract: A chip package structure is provided. The chip package structure includes a first wiring substrate including a substrate, a first pad, a second pad, and an insulating layer. The chip package structure includes a nickel-containing layer over the first pad. The chip package structure includes a conductive protection layer over the nickel-containing layer. The conductive protection layer includes tin, and a recess is surrounded by the conductive protection layer and the insulating layer over the first pad. The chip package structure includes a chip over the second surface of the substrate. The chip package structure includes a conductive bump between the second pad and the chip.
    Type: Application
    Filed: May 16, 2022
    Publication date: August 25, 2022
    Inventors: Yu-Huan CHEN, Kuo-Ching HSU, Chen-Shien CHEN
  • Publication number: 20220271146
    Abstract: In some embodiments, a semiconductor device is provided. The semiconductor device includes a pair of source/drain regions disposed in a semiconductor substrate, where the source/drain regions are laterally spaced. A gate electrode is disposed over the semiconductor substrate between the source/drain regions. Sidewall spacers are disposed over the semiconductor substrate on opposite sides of the gate electrode. A silicide blocking structure is disposed over the sidewalls spacers, where respective sides of the source/drain regions facing the gate electrode are spaced apart from outer sides of the sidewall spacers and are substantially aligned with outer sidewalls of the silicide blocking structure.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 25, 2022
    Inventors: Kong-Beng Thei, Chien-Chih Chou, Hsiao-Chin Tuan, Yi-Huan Chen, Alexander Kalnitsky
  • Patent number: 11415736
    Abstract: The present disclosure provides a backlight module including a light guide plate including a light-emitting surface, a bottom surface opposite to the light-emitting surface, and a light-incident side connecting the light-emitting surface and the bottom surface and light-emitting elements disposed at the light-incident side along a first direction. The light guide plate includes first columnar microstructures extending along a second direction perpendicular to the first direction on the light-emitting surface and columnar microstructure groups with second columnar microstructures, which are 1-15 times the number of the adjacent first columnar microstructures, between the first columnar microstructures extending along the second direction on the light-emitting surface. A first width of the first columnar microstructures is larger than or equal to a second width of the columnar microstructure groups along the first direction.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: August 16, 2022
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Yu-Huan Chiu, Chien-Wei Liao, Yen-Lung Chen
  • Patent number: 11417649
    Abstract: A semiconductor device includes a transistor. The transistor includes an active region in a substrate, a patterned conductive layer being a portion of an interconnection layer for routing, and an insulating layer extending over the substrate and configured to insulate the active region from the patterned conductive layer. The patterned conductive layer and the insulating layer serve as a gate of the transistor.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: August 16, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yi-Sheng Chen, Kong-Beng Thei, Fu-Jier Fan, Jung-Hui Kao, Yi-Huan Chen, Kau-Chu Lin
  • Patent number: 11410407
    Abstract: A method and a device for generating a collection of incorrectly-answered questions are provided. The method includes: acquiring an image of a marked test paper (S101); recognizing regions of respective questions in the marked test paper according to a pre-trained first region recognition model (S102); recognizing a question whose marking result is incorrect in the marked test paper as an incorrectly-answered question according to a pre-trained incorrectly-answered question recognition model (S103); and storing the region of the incorrectly-answered question in an incorrectly-answered question database to generate the collection of incorrectly-answered questions (S104). The above solution may solve the problem of low efficiency in generating the collection of incorrectly-answered questions in the prior art.
    Type: Grant
    Filed: December 25, 2019
    Date of Patent: August 9, 2022
    Assignee: Hangzhou Dana Technology Inc.
    Inventors: Tao He, Lihui Mao, Huan Luo, Mingquan Chen
  • Patent number: 11410999
    Abstract: The present disclosure relates to an integrated circuit (IC) that includes a boundary region defined between a low voltage region and a high voltage region, and a method of formation. In some embodiments, the integrated circuit comprises an isolation structure disposed in the boundary region of the substrate. A first polysilicon component is disposed over the substrate alongside the isolation structure. A boundary dielectric layer is disposed on the isolation structure. A second polysilicon component is disposed on the sacrifice dielectric layer.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Huan Chen, Chien-Chih Chou, Alexander Kalnitsky, Kong-Beng Thei, Ming Chyi Liu, Shih-Chung Hsiao, Jhih-Bin Chen
  • Publication number: 20220247424
    Abstract: A method for outputting a current includes performing a sorting operation on a plurality of current sources according to intensities of currents generated by the current sources, dividing the plurality of current sources into N current source sets according to a result of the sorting operation and a predetermined selection order, and enabling at least one current source set of the N current source sets to output the current according a target output value. The plurality of current sources have a same target current value. Each of the N current source sets includes at least one current source. In the N current source sets, a total quantity of current sources of the nth current source set is twice a total quantity of current sources of the (n?1)th current source set.
    Type: Application
    Filed: September 1, 2021
    Publication date: August 4, 2022
    Inventors: JUEI CHIN SHEN, LIANG HUAN LEI, CHIEN WEN CHEN
  • Patent number: D960049
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: August 9, 2022
    Inventors: Weijun Chen, Huan Zhang