Abstract: A semiconductor device is provided. The semiconductor device includes a first semiconductor layer; a second semiconductor layer on the first semiconductor layer; an active region between the second semiconductor layer and the first semiconductor layer; an electron blocking structure on the active region; a first In-containing layer between the active region and the electron blocking structure; and a second In-containing layer on the electron blocking structure; wherein the first In-containing layer has a first indium content, the second In-containing layer has a second indium content, and the second indium content is different from the first indium content.

Abstract: The invention provides a pH-sensitive linker that can simultaneously bind metallic nanoparticles and one or more agents with various molecular size. The linker of the invention can deliver the agents into cells involved in disease processes or close to cells so that the agents can selectively target and effect on the cells. The target delivery provided by the linker of the invention can be used for example for disease sensing, imaging, drug delivery, and therapy.

Abstract: An electrodeless LED display and a method for fabricating the same are disclosed. In the method, an epitaxial layer is provided and a transparent conduction layer is formed on the epitaxial layer to bond a substrate. The epitaxial layer is etched to form dies deposition metal films on the transparent conduction layer. Conduction channels are formed on the substrate, and two ends of each conduction channel are respectively provided two conduction metal blocks. First metal members are formed on the metal film formed on the dies and the conduction metal blocks to connect with the dies on the different conduction channels. Then, second metal members are formed on the first metal members formed on the conduction metal blocks, whereby the second metal members and the first metal members formed on the dies are located on an identical plane.

Abstract: An electrodeless LED display and a method for fabricating the same are disclosed. In the method, an epitaxial layer is provided and a transparent conduction layer is formed on the epitaxial layer to bond a substrate. The epitaxial layer is etched to form dies deposition metal films on the transparent conduction layer. Conduction channels are formed on the substrate, and two ends of each conduction channel are respectively provided two conduction metal blocks. First metal members are formed on the metal film formed on the dies and the conduction metal blocks to connect with the dies on the different conduction channels. Then, second metal members are formed on the first metal members formed on the conduction metal blocks, whereby the second metal members and the first metal members formed on the dies are located on an identical plane.

Abstract: A vacuum-keeping multistage vacuum-generating and vacuum-destructing valve includes a main body, which includes an introduction port, a vacuum port, a discharge port, and a vacuum-generating valve, in combination with a vacuum-destructing valve. The vacuum-destructing valve is arranged in combination with a flow conducting passage formed in the main body and connected to the vacuum port to allow a pressure fluid received through the introduction port to partly flow through the vacuum-destructing valve, and a vacuum-destructing two-port two-position valve is arranged in the flow conducting passage to increase flow rate of the pressure fluid passing therethrough to make a response of the vacuum port more sensitive in switching to a vacuum-destructing state. The ports of the main body are arranged in a detachable manner to increase service efficiency and ease part replacement. Two side seats are arranged to couple multiple such main bodies together to cope with complicated automatic processing operations.

Abstract: An optical transceiver includes a substrate, a transceiver module, an optical lens and an adhesive. The transceiver module is disposed on an outer surface of the substrate. The optical lens is disposed on the outer surface for guiding light to the transceiver module. The optical lens defines a contact surface and at least one hole. The contact surface faces the outer surface, and an opening of the hole is located on the contact surface. The adhesive is accommodated into the hole from the opening, and the contact surface of the optical lens is adhered to the outer surface of the substrate by an adhesive.

Abstract: A laser projector includes a light-mixing module and a light-splitting module. The light-mixing module provides a laser beam which includes first polarized light and second polarized light. The light-splitting module includes a dichroic mirror, a half-wave plate, a phosphor wheel module, and a light-guiding rod. The dichroic mirror allows the first polarized light to pass and reflects the second polarized light. The half-wave plate receives the first polarized light which passes the dichroic mirror and converts the first polarized light into third polarized light. The phosphor wheel module receives the second polarized light reflected by the dichroic mirror, and provides a stimulated light which passes the dichroic mirror. The light-guiding rod receives the stimulated light and the third polarized light, thereby providing an illumination beam.

Abstract: Provided is a method and computer program product for producing an enhanced audio signal for an output device from audio signals received by 2 or more microphones in close proximity to each other. For example, one embodiment of the present invention comprises the steps of receiving a first input audio signal from the first microphone, digitizing the first input audio signal to produce a first digitized audio input signal, receiving a second input audio input signal from the second microphone, digitizing the second input audio input signal to produce a second digitized audio input signal, using the first digitized audio input signal as a reference signal to an adaptive prediction filter, using the second digitized audio input signal as input to said adaptive prediction filter and finally adding a prediction result signal from the adaptive prediction filter to the first digitized audio input signal to produce the enhanced audio signal.

Abstract: A control circuit module and a control method thereof are provided. The method includes enabling a first discharge circuit by a controller, instructing a first battery cell of a battery module to operate in a ship mode, and disabling the first discharge circuit.

Abstract: A semiconductor device is provided. The semiconductor device includes a first semiconductor layer; a second semiconductor layer on the first semiconductor layer; an active region between the second semiconductor layer and the first semiconductor layer; an electron blocking structure on the active region; a first In-containing layer between the active region and the electron blocking structure; and a second In-containing layer on the electron blocking structure; wherein the first In-containing layer has a first indium content, the second In-containing layer has a second indium content, and the second indium content is different from the first indium content.

Abstract: An optical transceiver, pluggable into a cage, includes a case, a fastening component, and a driving component. The case defines a supporting surface. The fastening component is movably disposed in the case to be at either a fastening position or a releasing position. The fastening component defines a pressed slope, and the pressed slope defines a first end and a second end connected to each other. A vertical distance between the first end and the supporting surface is different from a vertical distance between the second end and the supporting surface. The driving component is disposed in the case. The driving component is movable relative to the fastening component along a pressing direction to press the pressed slope. The fastening component is movable to the releasing position by interaction between the fastening component and the driving component.

Abstract: An optical transceiver includes a substrate, a housing, a ferrule and a fixture. The housing is disposed on an outer surface of the substrate and includes a pressed portion and an inset portion connected to each other. The pressed portion defines a first pressed surface, and the ferrule is disposed on the inset portion. The fixture is disposed on the housing, a first pressing surface of the fixture is pressed against the first pressed surface of the housing, and a second pressing surface of the fixture is pressed against a second pressed surface of the ferrule. The fixture detached from the housing is in a force-free condition, and a distance between the first pressing surface and the second pressing surface in the force-free condition is smaller than a distance between the first pressed surface and the second pressed surface.

Abstract: In a method of manufacturing a high-electron mobility transistor (HEMT), a first Group III-V semiconductor layer is formed on a substrate. The first Group III-V semiconductor layer is patterned to form a fin and a recessed surface. A second Group III-V semiconductor layer is formed to cover a top surface and all side surfaces of the fin and the recessed surface. The second Group III-V semiconductor layer is formed by a plasma-enhanced atomic layer deposition, in which a plasma treatment is performed on every time an as-deposited mono-layer is formed.

Abstract: An optical transceiver includes casing, fastening member and driving member. The fastening member is movably disposed in the casing to be either in fastened position or released position. The fastening member has a first inclined surface. The first inclined surface has a start end and a stop end. Distance between the start end and the supporting surface is larger than distance between the stop end and the supporting surface. The driving member is movable in the casing. When the driving member presses the first inclined surface from the start end to the stop end, the driving member facilitates the movement of the fastening member from the fastened position to the released position. When the fastening member is in the fastened position, the fastening member is fastened to the fastening portion. When the fastening member is in the released position, the fastening member is removed from the fastening portion.

Abstract: An optical transceiver, pluggable into a cage, includes a case, a fastening component, and a driving component. The case defines a supporting surface. The fastening component is movably disposed in the case to be at either a fastening position or a releasing position. The fastening component defines a pressed slope, and the pressed slope defines a first end and a second end connected to each other. A vertical distance between the first end and the supporting surface is different from a vertical distance between the second end and the supporting surface. The driving component is disposed in the case. The driving component is movable relative to the fastening component along a pressing direction to press the pressed slope. The fastening component is movable to the releasing position by interaction between the fastening component and the driving component.

Abstract: An optical transceiver includes a substrate, a transceiver module, an optical lens and an adhesive. The transceiver module is disposed on an outer surface of the substrate. The optical lens is disposed on the outer surface for guiding light to the transceiver module. The optical lens defines a contact surface and at least one hole. The contact surface faces the outer surface, and an opening of the hole is located on the contact surface. The adhesive is accommodated into the hole from the opening, and the contact surface of the optical lens is adhered to the outer surface of the substrate by an adhesive.

Abstract: A light emitting diode device with flip-chip structure includes a transparent protective substrate, a transparent conductor layer, a glue layer, a group III-V stack layer, a first conductivity metal electrode, a second conductivity metal electrode and an insulating layer. The transparent conductor layer is formed on the transparent protective substrate. The glue layer bonds the transparent protective substrate and the transparent conductor layer. The group III-V stack layer and the first conductivity metal electrode are respectively formed on a first portion and a second portion of the transparent conductor layer. The second conductivity metal electrode is formed on a portion of the group III-V stack layer. The insulating layer covers exposed portions of the transparent conductor layer and the group III-V stack layer, and the insulating layer further covers portions of the first and second conductivity metal electrodes, so as to expose the first and second conductivity metal electrodes.

Abstract: An optical transceiver includes a substrate, a transceiver module, an optical lens and a ferrule. The transceiver module is disposed on an outer surface of the substrate. The optical lens includes a supporting portion and at least one extension portion connected to the supporting portion. The extension portion is located between the supporting portion and the substrate. The supporting portion defines a bottom surface facing the outer surface. The bottom surface is spaced apart from the outer surface. The extension portion defines a lateral surface connected to the bottom surface. The bottom surface of the supporting portion, the lateral surface of the at least one extension portion and the outer surface of the substrate jointly form an accommodation groove. The ferrule is disposed in the accommodation groove through an opening of the accommodation groove, and the ferrule is supported by the supporting portion.

Abstract: An uninterruptible power control method includes the steps of: reading a detection result from a motion sensor of an electronic device, determining whether the detection result meets a movement condition, and turning on a power supply path of a sub-battery module of the electronic device when the detection result meets the movement condition. The electronic device is powered by a primary battery module in normal state, and the sub-battery module is built in the electronic device.

Abstract: An electrodeless LED display and a method for fabricating the same are disclosed. In the method, an epitaxial layer is provided and a transparent conduction layer is formed on the epitaxial layer to bond a substrate. The epitaxial layer is etched to form dies deposition metal films on the transparent conduction layer. Conduction channels are formed on the substrate, and two ends of each conduction channel are respectively provided two conduction metal blocks. First metal members are formed on the metal film formed on the dies and the conduction metal blocks to connect with the dies on the different conduction channels. Then, second metal members are formed on the first metal members formed on the conduction metal blocks, whereby the second metal members and the first metal members formed on the dies are located on an identical plane.