Abstract: The locking movement and/or the unlocking movement of a bimetallic drive of an electrothermally-controlled locking apparatus, for example for household-device doors, is or are driven by a separate bimetal member (10, 11) over only a first segment of its movement path. In the process, energy is supplied to the energy store (28) of a tipping over-center device until a dead-center position is attained, the energy being released as a moving drive for the remaining segment of the movement path when the dead-center position is exceeded, thereby cutting off the bimetal drive and stabilizing the locking member (2) in its end position.

Abstract: A door locking device for an electrical apparatus, in particular a household appliance, including a lock having a locking slide, supported in the lock and movable back and forth between an opening position and a closing position, having a blocking device for arresting the locking slide in its closing position, and having a locking tang (1, 51) which drops into the lock as the appliance door is being closed and once the appliance door is in its closed state is in engagement with the locking slide, in which a gear mechanism is permanently operative between the locking slide and the locking tang, for converting the drop-in motion of the locking tang upon closure or the dropping-out motion of the locking tang upon opening of the appliance door into a displacement motion of the locking slide (9, 69) once the blocking device is deactivated, and having a compulsory guidance of the locking tang in the lock in such a way that every opening motion of the appliance door from any arbitrary door position, once the blockin

Abstract: The invention relates to a method for reducing a transient thermal mismatch between a first component and a second component which are in mechanical contact with one another. The temperature of the first component is controlled by the amount of energy dissipated thereby. The amount of energy dissipated is controlled as a function of a data pattern input into the first component which causes a certain number of gates within the component to switch per clock cycle. By determining the desired energy dissipation in terms of the number of gates which are to be switched and arranging the input data pattern accordingly, the thermal mismatch between the components may be reduced.

Abstract: The invention relates to a multilayer module 20 for packaging of at least one electronic component, such as the integrated circuit chips 21, 22. The module 20 comprises a thickfilm structure and a thinfilm structure. The thinfilm structure provides an interface between the electronic components and the thickfilm structure. The thinfilm structure comprises a first powerplane and a redistribution wiring structure. The topmost layer of conductors of the thickfilm structure is a second powerplane so that an electrical structure approaching a triplate structure is realized.

Abstract: A multilayer module for packaging at least one electronic component 50. The module includes a plurality of thickfilm layers, and a wiring structure 45 to permit the connection of on-module capacitors. The multilayer module is fabricated such that the wiring structure includes a partial mesh plane 46, 47, 48, and 49 between the topmost and second topmost layers of the thickfilm. Logic noise is reduced in the multilayer module by maximizing the mutual inductance between adjacent mesh planes.