Patents by Inventor Hul Chun Hsu

Hul Chun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7275588
    Abstract: A planar heat pipe has a hollow planar tube and a wick structure attached to an interior sidewall of the planar tube. A spiral support member is installed to extend along the interior sidewall, so as to press the wick structure against the interior sidewall. The spiral support member has a plurality of interstices extending laterally within the planar tube. A planar support member is inserted between the spiral support member in the hollow planar tube. The planar support member has a plurality of voids extending along an elongate direction of the planar tube. Thereby, cross flowing channels are formed inside of the heat pipe.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: October 2, 2007
    Inventor: Hul-Chun Hsu
  • Patent number: 7231715
    Abstract: A method for forming an end surface of a heat pipe and the structure thereof are disclosed. Firstly, the mold module is provided for placing the heat pipe therein. The mold module includes a mold chamber to receive the heat pipe. Then, an extruding shaft is pushed forward into the mold chamber from an end of the mold module. Next, the ends of the heat pipe are compressed via the extruding shaft to render the end surface of the heat pipe depressed from outside to inside. Thereby, the heat pipe with a non-protrudent end surface is obtained. As such, the volume occupied by the useless segment of the heat pipe is effectively reduced, or, the heat pipe having a certain length to cooperate with more heat dissipating fins.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: June 19, 2007
    Inventor: Hul-Chun Hsu
  • Patent number: 7229104
    Abstract: A shrinkage-free sealing structure of a heat pipe. The sealing structure is in the form of a double-layered structure formed by transversely pressing a first side of an open end of the heat pipe towards a second side of the open end and transversely pressing the second side towards the first side. Preferably, the double-layered structure has a semi-circular cross section after the first side is pressed towards the second side of the open end, and the sealing structure has an arrowhead structure after the second side is pressed towards the first side.
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: June 12, 2007
    Inventor: Hul- Chun Hsu
  • Publication number: 20070116087
    Abstract: A clamping device with flexible contact for heat pipe includes a clamping body and a thermal couple wire. The clamping body includes a clamping section formed by at least two claws. The thermal couple wire has one end enclosing a pressing element and includes a temperature-sensing head at end of the pressing element. A first clamping block is provided on the claw and comprises an accommodating space. An opening is defined at end of the accommodating space near the first clamping block. The pressing element is elastically pressed in the accommodating space such that the temperature-sensing head is exposed out of the opening.
    Type: Application
    Filed: November 23, 2005
    Publication date: May 24, 2007
    Inventor: Hul-Chun Hsu
  • Publication number: 20070110121
    Abstract: A temperature sensing apparatus with flexible contact includes a rod-shaped body, a temperature-sensing head elastically arranged at one end of the body and a clamping rod transversely locked to the body. The temperature-sensing head is connected to a temperature-sensing wire. Another end of the clamping rod is defined with a locking section such that the clamping rod can be connected to a heat-pipe temperature sensing apparatus. Both straight heat pipe and curved heat pipe can be examined by the temperature sensing apparatus with flexible contact.
    Type: Application
    Filed: November 14, 2005
    Publication date: May 17, 2007
    Inventor: Hul-Chun Hsu
  • Patent number: 7192064
    Abstract: An extrusion sealed structure of a heat pipe. A heat pipe that has been extrusion-sealed includes a circular tubular body with two free ends connected to conical shrunk tubular portions. One end of each shrunk tubular portions is connected to the circular tubular body, and the other end of the shrunk tubular portion has one side surface extruded into a recessed portion and the other side surface retains the shape of the circuit tubular body and the shrunk tubular portion. The sealing portion is located at a central axis of the tubular body.
    Type: Grant
    Filed: March 10, 2005
    Date of Patent: March 20, 2007
    Inventor: Hul-Chun Hsu
  • Patent number: 7159647
    Abstract: A heat pipe assembly includes at least a flattened portion formed on the heat pipe. The internal surface of the heat pipe includes a wick structure attached thereon, and a mesh supporting member disposed therein. The wick structure is compressed on the internal surface of the heat pipe by using the mesh supporting member. The mesh supporting member includes a plurality of radially and axially arranged stripes. The radially and axially arranged stripes are orthogonally stacked, thereby forming mutually communicable working fluid channels in the flattened portion of the heat pipe.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: January 9, 2007
    Inventor: Hul-Chun Hsu
  • Publication number: 20060283578
    Abstract: A method for removing vapor within a heat pipe includes providing a predetermined amount of working fluid injected into the heat pipe. An opening is reserved at one end of the heat pipe. The opening is communicated with a vacuum environment. A normally off is maintained between the opening and the vacuum environment to isolate the vacuum environment from the heat pipe, such that at the instant the isolation status is relieved, the vacuum level of the vacuum environment is maintained at a certain range. The isolation status between the opening of the heat pipe and the vacuum environment is intermittently relieved for several times. Within the duration while the isolation status between the opening and the vacuum environment is relieved, the working fluid is evaporated without being boiled and vapor is exhausted from the opening.
    Type: Application
    Filed: August 24, 2006
    Publication date: December 21, 2006
    Inventor: Hul-Chun Hsu
  • Patent number: 7150350
    Abstract: A processing apparatus for continuously conveying heat pipes includes a feeder, a conveying unit and at least one processing station. The feeder includes a processing stage, which includes a feeding end and an exiting end opposite to the feeding end. A feeding direction is defined from the feeding end and toward the exiting end and the processing station is arranged along the feeding direction. The conveying unit is arranged on the processing stage.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: December 19, 2006
    Inventor: Hul-Chun Hsu
  • Publication number: 20060278383
    Abstract: A method of forming a sealing structure at an open end of a heat pipe includes shrinking the open end to form a shrunk end with a cone-shaped portion, pressing the shrunk end to form a pinched portion so that the shrunk end and regions adjacent to the cone-shaped portion are deformed exceedingly outer than a circumference of the heat pipe, soldering an edge of the shrunk end, and modifying the shrunk end and the regions without any deformation exceeded outer than an original annular size of heat pipe. As such, the sealing structure includes a pinched portion with internal surfaces closely contacted, and at least two edges formed on the pinched portion to be flatly and smoothly extended from an end of the heat pipe.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 14, 2006
    Inventor: Hul-Chun Hsu
  • Patent number: 7147044
    Abstract: A processing apparatus for continuously conveying heat pipes includes a feeder and at least one processing station. The feeder includes a processing stage, which includes a feeding end and an exiting end opposite to the feeding end. A feeding direction is defined from the feeding end and toward the exiting end and the processing station is arranged along the feeding direction. The feeding end is higher than the exiting end.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: December 12, 2006
    Inventor: Hul-Chun Hsu
  • Patent number: 7149083
    Abstract: A heat dissipation structure installed on a computer central processing unit or a heat generating device, has a thermal conductive base, at least one heat pipe and a heat sink. The thermal conductive base has a supporting part and a first interlocking part. The supporting part allows the heat pipe mounted thereon. The heat sink has a plurality of fins configured with a receiving slot and a second interlocking part. The second interlocking part is engaged with the first interlocking part, while the receiving slot and the supporting part of the thermal conductive base enclose the heat pipe therein to form the heat dissipation structure. By the connection between the thermal conductive pipe and the heat sink, the contact intensity between various devices is increased, such that the heat conduction performance is improved.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: December 12, 2006
    Inventor: Hul-Chun Hsu
  • Patent number: 7140421
    Abstract: A wick structure is attached on an internal sidewall of a heat pipe. The wick structure includes a plurality of orthogonal woven fibers. The fibers extending along a longitudinal direction of the heat pipe are thinner; therefore the wick structure is capably of providing enhanced capillary action and good attachment to the heat pipe.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: November 28, 2006
    Inventor: Hul-Chun Hsu
  • Publication number: 20060260786
    Abstract: A composite multi-layer wick structure includes a tubular member with an internal sidewall, and a composite wick structure including a multi-layer woven mesh and a sintered-powder layer. The multi-layer woven mesh is curled to cover on and extend over the internal sidewall. The sintered-powder layer is coated on a portion of the multi-layer woven mesh and the internal sidewall to extend along a longitudinal direction of the tubular member. By the strong capillary force provided by the sintered-powder layer, the working fluid at the liquid phase easily reflows back to the bottom of the heat pipe, such that the heat transmission efficiency is greatly enhanced.
    Type: Application
    Filed: May 23, 2005
    Publication date: November 23, 2006
    Inventor: Hul-Chun Hsu
  • Patent number: 7137441
    Abstract: An end-surface wick structure of a heat pipe provided by the present invention has a pipe member and a wick structure. The wick structure has at least one woven mesh to be attached to an internal sidewall of the pipe member and one sintering powder attached to an internal surface of a bottom lid covering a bottom end of the pipe member. Thereby, the sintering powder can be attached to bottom corners of the pipe member to improve heat transfer and conduction of the heat pipe.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: November 21, 2006
    Inventor: Hul-Chun Hsu
  • Publication number: 20060243426
    Abstract: A wick structure of a heat pipe, having a wick structure attached to an internal wall of a tubular member. The tubular member is fabricated from metal material with good conductive characteristics, and the wick member is formed of a metal mesh and a metal powder. The metal mesh is in the form of a ring attached to an internal wall of the tubular member, and the metal powder is embedded in the interstices of the metal mesh. The wick structure is attached to the internal wall of the tubular member by sintering, such that a wick structure with a villiform structure is formed. Thereby, the peeling or fracture tendency of the wick structure during the mechanical process of the heat pipe avoided. In addition, the axial rod used for the sintering process is not required, such that the cost is greatly reduced.
    Type: Application
    Filed: July 24, 2006
    Publication date: November 2, 2006
    Inventor: Hul-Chun Hsu
  • Publication number: 20060213646
    Abstract: A wick structure is attached on an internal sidewall of a heat pipe. The wick structure is a one-layer woven wick. At least one weaving direction of the meshes of the woven wick contains a plurality of fiber bundles each including two more woven fibers to weave to a plurality of single fiber. As such, the fiber bundles of the one-layer woven wick provide enhanced capillary force like a multi-layer wick structure.
    Type: Application
    Filed: March 28, 2005
    Publication date: September 28, 2006
    Inventor: Hul-Chun Hsu
  • Publication number: 20060207749
    Abstract: A multi-layer wick structure attached to a tubular member of a heat pipe includes a first weaving mesh of wick layer attached to an interior surface of the tubular member, and a second weaving mesh of wick layer encircled by the first wick layer so that the first wick layer is sandwich between the tubular member and the second wick layer. The first and the second weaving meshes of the wick layer include a plurality of first and second weaving wires, respectively, and the first weaving wire has the diameter smaller than that of the second weaving wire.
    Type: Application
    Filed: March 18, 2005
    Publication date: September 21, 2006
    Inventor: Hul-Chun Hsu
  • Publication number: 20060202000
    Abstract: An eccentric rotation soldering method and apparatus, forming a curved sealing portion at one end of a heating after the heat pipe is pressed sealed, and aligning the electrode of a soldering unit with the pressed edge of the sealing portion of the heat pipe. When the heat pipe is rotating, the electrode of the soldering unit is not aligned with the central axis of the heat pipe, such that an eccentric rotation soldering is performed on the pressed edge. Therefore, a rotation soldering trace is formed at the pressed edge to improve the aesthetic effect and integrality of the sealing portion.
    Type: Application
    Filed: March 10, 2005
    Publication date: September 14, 2006
    Inventor: Hul-Chun Hsu
  • Publication number: 20060202474
    Abstract: An extrusion sealed structure of a heat pipe. A heat pipe that has been extrusion-sealed includes a circular tubular body with two free ends connected to conical shrunk tubular portions. One end of each shrunk tubular portions is connected to the circular tubular body, and the other end of the shrunk tubular portion has one side surface extruded into a recessed portion and the other side surface retains the shape of the circuit tubular body and the shrunk tubular portion. The sealing portion is located at a central axis of the tubular body.
    Type: Application
    Filed: March 10, 2005
    Publication date: September 14, 2006
    Inventor: Hul-Chun Hsu