Patents by Inventor Hul Chun Hsu

Hul Chun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6983791
    Abstract: A heat pipe has a pipe container and a fiber wick structure. The fiber wick structure is arranged on an inner wall of the pipe container, and the fiber wick structure has at least two kinds of fibers with different melting points. Furthermore, when the fiber wick structure is manufactured in a sintering process, the higher melting point of fiber provides a support force for the fiber wick structure coupled to the inner wall of the pipe container, and the lower melting point of fiber is melted in the sintering temperature of the pipe container to adhere to the higher melting point of fiber on the inner wall of the pipe container.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: January 10, 2006
    Inventor: Hul Chun Hsu
  • Publication number: 20050274494
    Abstract: A method for forming an end surface of a heat pipe and the structure thereof are disclosed. Firstly, the mold module is provided for placing the heat pipe therein. The mold module includes a mold chamber to receive the heat pipe. Then, an extruding shaft is pushed forward into the mold chamber from an end of the mold module. Next, the ends of the heat pipe are compressed via the extruding shaft to render the end surface of the heat pipe depressed from outside to inside. Thereby, the heat pipe with a non-protrudent end surface is obtained. As such, the volume occupied by the useless segment of the heat pipe is effectively reduced, or, the heat pipe having a certain length to cooperate with more heat dissipating fins.
    Type: Application
    Filed: May 25, 2004
    Publication date: December 15, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050269064
    Abstract: A planar heat pipe has a hollow planar tube and a wick structure attached to an interior sidewall of the planar tube. A spiral support member is installed to extend along the interior sidewall, so as to press the wick structure against the interior sidewall. The spiral support member has a plurality of interstices extending laterally within the planar tube. A planar support member is inserted between the spiral support member in the hollow planar tube. The planar support member has a plurality of voids extending along an elongate direction of the planar tube. Thereby, cross flowing channels are formed inside of the heat pipe.
    Type: Application
    Filed: June 2, 2004
    Publication date: December 8, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050252650
    Abstract: An integrated heat dissipation apparatus includes a thermal conductor base and a heat sink interlocked with each other. The thermal conductor base has a channel formed in an upper portion thereof and a pair of grooves formed on two opposing elongate sidewalls thereof. The channel extends through the thermal conductor base along an elongate direction thereof. The grooves extending between two opposing ends of the thermal conductor base are proximal to bottom edges of the sidewalls. The heat sink has a bottom surface recessed to form a receiving slot conformal to the upper portion of the thermal conductor base. The receiving slot has a pair of protrusions extending along two elongate bottom edges of the receiving slot between two opposing ends of the heat sink.
    Type: Application
    Filed: May 12, 2004
    Publication date: November 17, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050247436
    Abstract: A composite wick structure of a heat pipe includes wick structure fabricated from a woven mesh and sintered powder. The woven mesh is attached to an internal sidewall of a tubular member, while the sintered powder is coated on at least one side of the internal sidewall. By the better capillary force provided by the sintered powder, the liquid-phase working fluid can reflow to the bottom of the heat pipe quickly to enhance the heat transmission efficiency. Further, the problems of poor capillary effect of the woven mesh and the problems caused by usage of an axial rod during the process of applying sintered powder can be resolved.
    Type: Application
    Filed: April 23, 2004
    Publication date: November 10, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050247435
    Abstract: A wick structure of a heat pipe includes a wick structure attached to an internal wall of a tubular member. The tubular member is fabricated from metal material with good conductive characteristics, and the wick member is formed of a mesh structure and a plurality of particulate members. The mesh structure is in the form of a ring attached to an internal wall of the tubular member, and the particulate members are embedded in the interstices of the mesh structure. The wick structure is attached to the internal wall of the tubular member by sintering, such that a wick structure with a villiform structure is formed. Thereby, the peeling or fracture tendency of the wick structure during the mechanical process of the heat pipe avoided. In addition, the axial rod used for the sintering process is not required, such that the cost is greatly reduced.
    Type: Application
    Filed: April 21, 2004
    Publication date: November 10, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050224216
    Abstract: An end surface structure of a heat pipe having a large gauge used to be contacted with a heat source for dissipation is provided. The heat pipe includes a pipe member, a lid, a base and a wick structure. The hollow tubular pipe member has two opposing open ends. The lid is closely covered on one open end. The base provides an interlocking member including a flange fitly embracing the pipe member to receive the other open end of the pipe member thereinside. The wick structure is attached on an inner wall of the pipe member and an inside surface of the base. Moreover, the thickness of the flange is not larger than the thickness of pipe member at the open end received in the interlocking member. When the base is fitted with the pipe member at the open end, a welding process is performed to permanently connect them together. In the welding process, the flange of the interlocking member is enforced to be liquefied first and is liquefied more than the pipe member at the open end.
    Type: Application
    Filed: March 30, 2004
    Publication date: October 13, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050224215
    Abstract: An end surface structure of a heat pipe having a large gauge used to be contacted with a heat source for dissipation is provided. The heat pipe includes a pipe member, a lid, a base and a wick structure. The hollow tubular pipe member includes two opposing open ends. The lid is closely covered on one open end. The base includes an interlocking member fitly engaged to the other open end of the pipe member and a flange extending radially and outwardly from the interlocking member. Moreover, the thickness of the flange is not larger than the thickness of pipe member at the open end receiving the interlocking member. When the base is fitted with the pipe member at the open end, a welding process is performed to permanently connect them together. In the welding process, the flange is enforced to be liquefied first and is liquefied more than the pipe member at the open end. As such, it can ensure that the pipe member is prevented from being damaged during the welding process.
    Type: Application
    Filed: March 30, 2004
    Publication date: October 13, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050199375
    Abstract: An end surface structure having a pipe member, a first lid and a second lid is disclosed. The pipe member has two opposing open ends. The first and second lids each has an interlocking member to frictionally fit the first and second lids with the pipe member at the open ends. Each of the first and second lids further has a flange extending outwardly and radially from the interlocking member. The thickness of the flanges is larger than the interior periphery of the open ends but no larger than the exterior periphery of the heat pipe. When the first and second lids are fitted with the heat pipe at the open ends, a welding process is performed to permanently connect the heat pipe with the first and second lids.
    Type: Application
    Filed: March 15, 2004
    Publication date: September 15, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050199374
    Abstract: An end-surface wick structure of a heat pipe provided by the present invention has a pipe member and a wick structure. The wick structure has at least one woven mesh to be attached to an internal sidewall of the pipe member and one sintering powder attached to an internal surface of a bottom lid covering a bottom end of the pipe member. Thereby, the sintering powder can be attached to bottom corners of the pipe member to improve heat transfer and conduction of the heat pipe.
    Type: Application
    Filed: March 15, 2004
    Publication date: September 15, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050195569
    Abstract: A heat dissipation structure installed on a computer central processing unit or a heat generating device, has a thermal conductive base, at least one heat pipe and a heat sink. The thermal conductive base has a supporting part and a first interlocking part. The supporting part allows the heat pipe mounted thereon. The heat sink has a plurality of fins configured with a receiving slot and a second interlocking part. The second interlocking part is engaged with the first interlocking part, while the receiving slot and the supporting part of the thermal conductive base enclose the heat pipe therein to form the heat dissipation structure. By the connection between the thermal conductive pipe and the heat sink, the contact intensity between various devices is increased, such that the heat conduction performance is improved.
    Type: Application
    Filed: March 5, 2004
    Publication date: September 8, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050167984
    Abstract: A shrinkage-free sealing structure of a heat pipe. The sealing structure is in the form of a double-layered structure formed by transversely pressing a first side of an open end of the heat pipe towards a second side of the open end for at least once and transversely pressing the second side towards the first side for at least once. Preferably, the double-layered structure has a semi-circular cross section after the first side is pressed towards the second side of the open end, and the sealing structure has an arrowhead structure after the second side is pressed towards the first side.
    Type: Application
    Filed: February 4, 2004
    Publication date: August 4, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050145373
    Abstract: A heat pipe structure includes a tubular member, and a wick structure having a base portion formed at one end of the tubular member and a surrounding portion extending from the base portion for attaching to an interior wall of the tubular member. Therefore, an end portion of a heat pipe can be used to contact a heat source for dissipation to provide more efficient dissipation and prevent from limitation of use.
    Type: Application
    Filed: January 5, 2004
    Publication date: July 7, 2005
    Inventor: Hul Chun Hsu
  • Publication number: 20050022414
    Abstract: A method and an apparatus for removing vapor within a heat pipe. A predetermined amount of working fluid is injected into the heat pipe. The opening of the heat pipe is communicated with a vacuum environment. By controlling the working fluid to be evaporating instead of being boiling, the vapor is exhausted. The apparatus includes a valve, a vacuum apparatus and a vacuum conduit serially connected between the vacuum apparatus and the valve. The valve has one end distal to the vacuum apparatus connected to the heat pipe. The valve is normally off and intermittently switched on and off.
    Type: Application
    Filed: May 12, 2004
    Publication date: February 3, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20050012254
    Abstract: An annealing apparatus includes a gas tight hollow main body, a conveying apparatus and a gas grid. A heating apparatus and a cooling apparatus are installed at an inlet and an outlet of the main body, respectively. The gas grid is installed between the inlet and the outlet to blow the protecting gas into the main body, so as to form a gas screen. The conveying apparatus extends to the inlet and the outlet to convey process material such as heat pipe. Thereby, an open, non-pressure differential environment is established for performing annealing on the process material.
    Type: Application
    Filed: May 12, 2004
    Publication date: January 20, 2005
    Inventor: Hul-Chun Hsu
  • Publication number: 20040194311
    Abstract: A method and an apparatus for removing non-condensing gas within a heat pipe are disclosed. A predetermined amount of a working fluid is filled into the heat pipe with an opening formed on a top end. The heat pipe is heated to obtain the working fluid with a saturated temperature and then the saturated temperature is maintained to have the working fluid being evaporated and boiled, such that the non-condensing gas is expelled by vapor of the working fluid. Finally, the opening is sealed when a predetermined amount of the vapor of the working fluid is discharged. The apparatus to perform the method includes a heater assembly providing the heat pipe installed therein and having a holder for holding the heat pipe to be positioned, and a sealer unit located above the heat assembly and having a clamping element and a driving mechanism to operate the clamping element.
    Type: Application
    Filed: December 15, 2003
    Publication date: October 7, 2004
    Inventor: Hul Chun Hsu
  • Publication number: 20040112450
    Abstract: A heat pipe has a pipe container and a fiber wick structure. The fiber wick structure is arranged on an inner wall of the pipe container, and the fiber wick structure has at least two kinds of fibers with different melting points. Furthermore, when the fiber wick structure is manufactured in a sintering process, the higher melting point of fiber provides a support force for the fiber wick structure coupled to the inner wall of the pipe container, and the lower melting point of fiber is melted in the sintering temperature of the pipe container to adhere to the higher melting point of fiber on the inner wall of the pipe container.
    Type: Application
    Filed: December 5, 2003
    Publication date: June 17, 2004
    Inventor: Hul Chun Hsu
  • Publication number: 20040111887
    Abstract: A method for installing heat pipe wick structures and the like is described. The method provides a rod clamping wick structures and penetrating through the heat pipe for installing the wick structures in a heat pipe, and includes steps of (a) fabricating the wick structures into an elongated continuous coil tape, (b) rolling an end of the coil tape in a width direction and clamping the coil tape to a rod, which has an external diameter originally narrower than an internal diameter of the heat pipe, and narrowing the end of the coil tape rolled to be smaller than the internal diameter of the heat pipe; (c) drawing the rod to carry the coil tape from an end of the heat pipe to an opposite end thereof, and installing the rolled coil tape in the heat pipe; and (d) cutting off the coil tape extending out from the heat pipe.
    Type: Application
    Filed: December 5, 2003
    Publication date: June 17, 2004
    Inventor: Hul Chun Hsu
  • Patent number: 6382306
    Abstract: A geometrical streamline flow guiding and heat-dissipating structure is formed by a heat-transferring seat, a heat-dissipating device and a fan. The heat-transferring seat has at least one heat conductive surface for being connected to the heat source. The heat-transferring seat further has at least one heat-transferring seat for heat dissipation with the radiating surface. The radiating surface has a three dimensional form, i.e. one side of the radiating surface is higher than another side thereof so as to be beneficial to guide the airflow. The heat-transferring seat is covered with the heat-dissipating device having a shape matching with the bottom thereof. The heat-transferring seat is formed by many pieces or is formed by a continuous folded structure, or is formed integrally through die casting, forging or slitting. The heat-dissipating device is buckled to the heat source through a buckle; the heat-dissipating device is connected to the fan.
    Type: Grant
    Filed: August 15, 2000
    Date of Patent: May 7, 2002
    Inventor: Hul Chun Hsu
  • Publication number: 20020020517
    Abstract: A geometrical streamline flow guiding and heat-dissipating structure is formed by a heat-transferring seat, a heat-dissipating device and a fan. The heat-transferring seat has at least one heat conductive surface for being connected to the heat source. The heat-transferring seat further has at least one heat-transferring seat for heat dissipation with the radiating surface. The radiating surface has a three dimensional form, i.e. one side of the radiating surface is higher than another side thereof so as to be beneficial to guide the airflow. The heat-transferring'seat is covered with the heat-dissipating device having a shape matching with the bottom thereof. The heat-transferring seat is formed by many pieces or is formed by a continuous folded structure, or is formed integrally through die casting, forging or slitting. The heat-dissipating device is buckled to the heat source through a buckle; the heat-dissipating device is connected to the fan.
    Type: Application
    Filed: July 27, 2001
    Publication date: February 21, 2002
    Inventor: Hul Chun Hsu