Patents by Inventor Hul Chun Hsu

Hul Chun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6324060
    Abstract: A heat transfer interface is disclosed. The surface of the heat dissipating panel of a radiator formed by a heat dissipating substrate is machined, and then a second heat transfer layer is added thereon. The heat transfer layer is connected to the heat dissipating substrate through plating, physical vapor deposition, hot forging, or soldering. The second heat dissipating layer is a thin layer for enhancing the lightness of the contact surface of the heat dissipating substrate, reducing the hole gap on the surface of the heat dissipating substrate, reducing the amount of the soft filling material, reducing the filling thickness of the soft filling material, increasing the heat spreading, and thus reducing contact resistance.
    Type: Grant
    Filed: August 15, 2000
    Date of Patent: November 27, 2001
    Inventor: Hul Chun Hsu