Patents by Inventor Hung Chih Chen

Hung Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fast substrate loading on polishing head without membrane inflation step
    Patent number: 7527271
    Abstract: The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: May 5, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Andrew Nagengast, Steven M. Zuniga, Hung Chih Chen
  • Composite retaining ring
    Patent number: 7503837
    Abstract: A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have thick and thin subportions to increase the flexibility of the lower ring.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: March 17, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Hung Chih Chen, Thomas B. Brezoczky, Douglas R. McAllister, David Datong Huo
  • KEYBOARD OF HANDHELD ELECTRONIC DEVICE
    Publication number: 20090058689
    Abstract: A keyboard of a handheld electronic device is provided. The keyboard is divided into a number of key areas arranged in array. The keyboard includes character keys and function keys. Each of the character keys respectively occupies one of the key areas and has a first character symbol, while some of the character keys further have a second character symbol respectively. Some of the function keys have an activation key occupying one key area. The other function keys respectively include an ENTER key, a SPACE key, and a SHIFT key, each of which occupies approximately two key areas transversely. The arrangement of the keys enable users to press the key quickly, correctly, and conveniently.
    Type: Application
    Filed: May 29, 2008
    Publication date: March 5, 2009
    Applicant: HIGH TECH COMPUTER, CORP.
    Inventors: Yu-Hsien Chang, Allen Ming-kuang Han, Ming-Hsiang Yen, Hung-Chih Chen
  • Vibration damping during chemical mechanical polishing
    Patent number: 7497767
    Abstract: A carrier head for chemical mechanical polishing is described. The carrier head includes a backing assembly, a housing and a damping material. The backing assembly includes a substrate support surface. The housing is connectable to a drive shaft to rotate with the drive shaft about a rotation axis. In one implementation, the damping material is in a load path between the backing assembly and the housing to reduce transmission of vibrations from the backing assembly to the housing.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: March 3, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Shijian Li, John M. White, Ramin Emami, Fred C. Redeker, Steven M. Zuniga, Ramakrishna Cheboli
  • SUBSTRATE RETAINER
    Publication number: 20090047873
    Abstract: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
    Type: Application
    Filed: October 28, 2008
    Publication date: February 19, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Steven M. Zuniga, Hung Chih Chen
  • APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD
    Publication number: 20090036035
    Abstract: Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the polishing pad with a linearly variable amount of force. A first force is produced with the actuator. The first force is scaled by a linearly variable amount to a second force that is applied to the polishing pad by a conditioning disk. Numerous other aspects are disclosed.
    Type: Application
    Filed: October 5, 2008
    Publication date: February 5, 2009
    Inventors: Roy C. Nangoy, Shou-Sung Chang, Donald J.K. Olgado, Hung Chih Chen, Gerald John Alonzo
  • ELECTROLYTE RETAINING ON A ROTATING PLATEN BY DIRECTIONAL AIR FLOW
    Publication number: 20090032408
    Abstract: A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.
    Type: Application
    Filed: October 7, 2008
    Publication date: February 5, 2009
    Inventors: Hung Chih Chen, Rashid A. Mavliev
  • APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD
    Publication number: 20090036036
    Abstract: Apparatus and methods for conditioning a polishing pad are provided. An apparatus includes a base, an arm adapted to support a conditioning disk; and a drive mechanism coupled between the arm and the conditioning disk, wherein the drive mechanism is adapted to directly rotate the conditioning disk relative to the arm. Numerous other aspects are disclosed.
    Type: Application
    Filed: October 5, 2008
    Publication date: February 5, 2009
    Inventors: Roy C. Nangoy, Shou-Sung Chang, Donald J.K. Olgado, Hung Chih Chen, Gerald John Alonzo
  • Substrate retainer
    Patent number: 7459057
    Abstract: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: December 2, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen
  • Pad cleaning method
    Patent number: 7452264
    Abstract: A method for cleaning a polishing pad is disclosed. In CMP and ECMP, a polishing pad must be conditioned to obtain good and predictable polishing results. During conditioning, debris is generated that must be removed to prevent processing defects. An effective method to clean a polishing pad is disclosed herein. In one embodiment, a washing fluid is directed at the pad to clean debris from the while a second fluid is utilized to remove the washing fluid. In another embodiment, the washing fluid is provided by a high pressure water jet while the second fluid is provided by an air knife.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: November 18, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Rashid A. Mavliev, Hung Chih Chen
  • NON-CONTACT WET WAFER HOLDER
    Publication number: 20080268753
    Abstract: The present invention relates to a load cup configured to speed up substrate transferring to and from a carrier head and to reduce corrosion during the transferring. One embodiment of the present invention provides a non-contact substrate holder comprising a pedestal having a top surface configured to support a substrate, and at least one injection port configured to eject a high velocity liquid stream on the top surface of the pedestal, wherein the liquid stream in configured to secure the substrate on the pedestal without the substrate contacting the top surface of the pedestal.
    Type: Application
    Filed: April 24, 2007
    Publication date: October 30, 2008
    Inventors: Tetsuya Ishikawa, Donald J.K. Olgado, Hung Chih Chen
  • RETAINING RING WITH SHAPED SURFACE
    Publication number: 20080196833
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Application
    Filed: March 17, 2008
    Publication date: August 21, 2008
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Dual display module
    Patent number: 7406338
    Abstract: A dual display module is provided. The dual display module comprises a common circuit board, a first display panel and a second display panel. The common circuit board has a first surface and a second surface. The first display panel and the second display panel are respectively set up on the first surface and the second surface. At least one of the display panels is directly attached to the common circuit board through a connecting interface. The dual display module has a lower manufacturing cost and provides a better yield.
    Type: Grant
    Filed: April 5, 2004
    Date of Patent: July 29, 2008
    Assignee: Au Optronics corporation
    Inventor: Hung-Chih Chen
  • Retaining ring with shaped surface
    Patent number: 7344434
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: March 18, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Stacy Meyer, Trung T. Doan, Daniel Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Vibration damping in chemical mechanical polishing system
    Patent number: 7331847
    Abstract: A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. A polishing station includes a platen, a vibration damper mounted on the platen and a substrate polishing pad mounted on the vibration damper. The vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: February 19, 2008
    Assignee: Applied Materials, Inc
    Inventors: Hung Chih Chen, John M. White, Shijian Li, Fred C. Redeker, Ramin Emami
  • Electrolyte retaining on a rotating platen by directional air flow
    Publication number: 20070295610
    Abstract: A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Inventors: Hung Chih Chen, Rashid A. Mavliev
  • Pad cleaning method
    Publication number: 20070298692
    Abstract: A method for cleaning a polishing pad is disclosed. In CMP and ECMP, a polishing pad must be conditioned to obtain good and predictable polishing results. During conditioning, debris is generated that must be removed to prevent processing defects. An effective method to clean a polishing pad is disclosed herein. In one embodiment, a washing fluid is directed at the pad to clean debris from the while a second fluid is utilized to remove the washing fluid. In another embodiment, the washing fluid is provided by a high pressure water jet while the second fluid is provided by an air knife.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Inventors: Rashid A. Mavliev, Hung Chih Chen
  • FAST SUBSTRATE LOADING ON POLISHING HEAD WITHOUT MEMBRANE INFLATION STEP
    Publication number: 20070289124
    Abstract: The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 20, 2007
    Inventors: Jeonghoon Oh, Andrew Nagengast, Steven M. Zuniga, Hung Chih Chen
  • ROTATIONAL ALIGNMENT MECHANISM FOR LOAD CUPS
    Publication number: 20070281589
    Abstract: The present invention generally relates to a substrate transferring system having an alignment mechanism of a surface and to two points. One embodiment of the present invention provides a load cup for transferring a substrate. The load cup comprises a cup having a substrate supporting surface configured to support the substrate thereon, and two alignment pins protruding from the cup outside the substrate supporting surface, wherein the two alignment pins are both positioned at a first distance away from a center of the substrate supporting surface, and the cup is pivotable about a pivoting point positioned at a second distance away from the center.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 6, 2007
    Inventors: Jeonghoon Oh, Hung Chih Chen, Steven M. Zuniga
  • Keyboard
    Patent number: D594462
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: June 16, 2009
    Assignee: HTC Corporation
    Inventors: Yu-Hsien Chang, Allen Ming-kuang Han, Ming-Hsiang Yen, Hung-Chih Chen