Patents by Inventor Hung Chih Chen

Hung Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • In-situ performance prediction of pad conditioning disk by closed loop torque monitoring
    Patent number: 8096852
    Abstract: Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioning disk. The conditioning disk removes enough material so the polishing surface can properly process the wafers but does not remove any excess material. Preventing excess material removal extends the life of the polishing pad. During CMP processing, the controller receives data concerning the torque applied to the conditioning disk and the torque applied to the arm to sweep the conditioning disk across the polishing pad. Based upon the detected operating conditions, the system can predict the rate of material removal and adjust the forces applied to the conditioning disk so that the life of the polishing pad is optimized.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: January 17, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Sameer Deshpande, Shou-Sung Chang, Hung Chih Chen, Roy C Nangoy, Stan D Tsai
  • Multiple zone carrier head with flexible membrane
    Patent number: 8088299
    Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: January 3, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas Brezoczky, Steven M. Zuniga
  • APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD
    Publication number: 20110318997
    Abstract: Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to tilt while transmitting rotary motion from the drive mechanism to the conditioning disk. Numerous other aspects are disclosed.
    Type: Application
    Filed: June 20, 2011
    Publication date: December 29, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Roy C. Nangoy, Shou-Sung Chang, Donald J. K. Olgado, Hung Chih Chen, Gerald John Alonzo
  • Retaining ring with shaped surface
    Patent number: 8066551
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: November 29, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • SIDE PAD DESIGN FOR EDGE PEDESTAL
    Publication number: 20110244763
    Abstract: A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning device, the extension device includes a body that is movable relative to the polishing pad, and a sacrificial pad comprising a polishing material coupled to a mounting surface of the body.
    Type: Application
    Filed: March 31, 2010
    Publication date: October 6, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Yin Yuan, Hung Chih Chen, Shou-Sung Chang
  • Substrate holder with liquid supporting surface
    Patent number: 8021211
    Abstract: Embodiments of the present invention generally relate to a substrate transferring system. One embodiment of the present invention provides a substrate holder comprising a pedestal plate, a basin wall extending from a top surface of the pedestal plate, wherein the basin wall has a substantially leveled top surface, the basin wall and the pedestal plate define a basin configured to retain a liquid therein, and a liquid port opening to the basin, wherein the liquid port is configured to flow a liquid to the basin and allow the liquid to overflow from the basin wall, and a top surface of the overflow liquid in the basin is configured to support a substrate without contacting the basin wall or the pedestal plate.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: September 20, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Yin Yuan, Stephen Jew
  • Dishwasher having multiple spray zones
    Patent number: 8007598
    Abstract: A method and apparatus for providing multiple spray zones, including a localized spray zone for an upper rack and a silverware spray zone for a silverware basket, within the wash chamber of a dishwasher.
    Type: Grant
    Filed: October 27, 2008
    Date of Patent: August 30, 2011
    Assignee: Whirlpool Corporation
    Inventors: David Hung-Chih Chen, Brian Lee Greenhaw, Mark D. Kerber, Carl A. Rotter, Jeffrey R. Taylor
  • RETAINING RING WITH SHAPED SURFACE
    Publication number: 20110195639
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Application
    Filed: April 18, 2011
    Publication date: August 11, 2011
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Platen exhaust for chemical mechanical polishing system
    Patent number: 7988535
    Abstract: The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen having a polishing surface configured to polish the substrate by contacting the substrate while moving relatively to the substrate, a polishing head configured to support the substrate and position the substrate to be in contact with the polishing surface during polishing, a solution nozzle configured to dispense a polishing solution on the polishing surface, and an exhaust assembly configured to remove fume, vapor and other byproducts generated during polishing.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: August 2, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Allen L. D'Ambra, Donald J. K. Olgado
  • Apparatus and methods for conditioning a polishing pad
    Patent number: 7963826
    Abstract: Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to tilt while transmitting rotary motion from the drive mechanism to the conditioning disk. Numerous other aspects are disclosed.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: June 21, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Roy C. Nangoy, Shou-Sung Chang, Donald J. K. Olgado, Hung Chih Chen, Gerald John Alonzo
  • Substrate Retainer
    Publication number: 20110104990
    Abstract: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
    Type: Application
    Filed: January 10, 2011
    Publication date: May 5, 2011
    Inventors: Steven M. Zuniga, Hung Chih Chen
  • Retaining ring with shaped surface
    Patent number: 7927190
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: April 19, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • ROLLER ASSEMBLY FOR A BRUSH CLEANING DEVICE IN A CLEANING MODULE
    Publication number: 20110079245
    Abstract: Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.
    Type: Application
    Filed: October 5, 2009
    Publication date: April 7, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Lakshmanan Karuppiah, Dan Zhang, Simon Yavelberg, Jim K. Atkinson, Hung Chih Chen, Noel Manto, Jonathan Domin
  • BRUSH ALIGNMENT CONTROL MECHANISM
    Publication number: 20110067727
    Abstract: A method and apparatus for providing uniform pressure, friction and/or contact between a substrate and a cylindrical roller in a brush-type cleaning system is described. The apparatus includes an alignment member adapted to allow pivotal movement of the cylindrical roller based on the topography of a substrate and/or the outer surface of the cylindrical roller. The method includes positioning a substrate between two cylindrical rollers, moving each of the two cylindrical rollers to a position where at least a portion of an outer surface of each of the cylindrical rollers are in contact with the major surfaces of the substrate, and rotating one or both of the substrate and the two cylindrical rollers relative to each other while allowing a longitudinal axis of one or both of the two cylindrical rollers to pivot relative to a plane defined by one of the major surfaces of the substrate.
    Type: Application
    Filed: September 22, 2009
    Publication date: March 24, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: HUNG CHIH CHEN, HUI CHEN, DAN ZHANG
  • MULTIPLE ZONE CARRIER HEAD WITH FLEXIBLE MEMBRANE
    Publication number: 20110070810
    Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.
    Type: Application
    Filed: November 29, 2010
    Publication date: March 24, 2011
    Inventors: Hung Chih Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas Brezoczky, Steven M. Zuniga
  • Substrate retainer
    Patent number: 7883397
    Abstract: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
    Type: Grant
    Filed: October 28, 2008
    Date of Patent: February 8, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen
  • Multiple zone carrier head with flexible membrane
    Patent number: 7842158
    Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: November 30, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas B. Brezoczky, Steven M. Zuniga
  • POLISHING HEAD ZONE BOUNDARY SMOOTHING
    Publication number: 20100291842
    Abstract: A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.
    Type: Application
    Filed: March 10, 2010
    Publication date: November 18, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: HUNG CHIH CHEN, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate, Denis M. Koosau
  • Electrolyte retaining on a rotating platen by directional air flow
    Patent number: 7815787
    Abstract: A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: October 19, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Rashid A. Mavliev
  • Keyboard
    Patent number: D620013
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: July 20, 2010
    Assignee: HTC Corporation
    Inventors: Yu-Hsien Chang, Allen Ming-kuang Han, Ming-Hsiang Yen, Hung-Chih Chen