Patents by Inventor Hung Chih Chen

Hung Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8597084
    Abstract: Embodiments described herein generally relate to the planarization of substrates. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus comprises a rotatable platen having a textured upper surface, at least one groove formed in the upper surface, and a pad disposed on the textured upper surface and bridging the at least one groove.
    Type: Grant
    Filed: October 12, 2009
    Date of Patent: December 3, 2013
    Assignee: Applied Materials, Inc.
    Inventor: Hung Chih Chen
  • Patent number: 8591286
    Abstract: Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: November 26, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate, Denis M. Koosau
  • Patent number: 8585468
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: November 19, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20130301239
    Abstract: A backlight module includes a bezel, a supporting frame, and a light source module. The bezel includes a back plate and a side wall connected to an edge of the back plate; the supporting frame includes a lower frame body and an upper frame body extending from a top of the lower frame body, wherein the lower frame body is disposed on the back plate and surrounded by the side wall. The upper frame body has at least a portion laterally shifted relative to the lower frame body to be located over the side wall. The light source module is surrounded by the lower frame body, wherein the portion of the upper frame body located over the side wall encloses a panel accommodation space above a top of the light source module. A display device includes the above-mentioned backlight module and a display panel disposed in the panel accommodation space.
    Type: Application
    Filed: March 11, 2013
    Publication date: November 14, 2013
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Chiao-Kun Yu, Hung-Chih Chen, Chia-Hsiu Huang
  • Patent number: 8550879
    Abstract: Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: October 8, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Sen-Hou Ko, Shou-Sung Chang
  • Publication number: 20130258642
    Abstract: A back plate for use with a backlight module, a backlight module using the same, and the manufacturing method thereof are provided. The back plate includes a plate body and a side wall. The side wall extends out from the edge of the plate body and includes a wall body and a bending part, wherein the thickness of the wall body is less or equal to 0.12 mm. The bending part is formed by bending a plurality of bending sheets outward from the top of the wall body, wherein the thickness of each bending sheet is less or equal to 0.12 mm. The backlight module includes the back plate and a light source module, wherein the light source module is disposed on the plate body and adjacent to the inner side of the side wall.
    Type: Application
    Filed: February 5, 2013
    Publication date: October 3, 2013
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Chiao-Kun Yu, Hung-Chih Chen, Chih-Shun Fan
  • Publication number: 20130252518
    Abstract: A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. in one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly haying a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.
    Type: Application
    Filed: May 13, 2013
    Publication date: September 26, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hung Chih CHEN, Samuel Chu-Chiang HSU, Gautam Shashank DANDAVATE, Dennis M. KOOSAU
  • Patent number: 8535121
    Abstract: A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: September 17, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Doyle E. Bennett, Andrew J. Nagengast, Hung Chih Chen
  • Publication number: 20130203321
    Abstract: A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.
    Type: Application
    Filed: January 24, 2013
    Publication date: August 8, 2013
    Inventors: Hung Chih Chen, Thomas H. Osterheld, Charles C. Garretson, Jason Garcheung Fung
  • Publication number: 20130196577
    Abstract: Methods, apparatus, and systems are provided for retaining a substrate in a polishing head of a CMP system. The invention includes a flexible inner retaining ring adapted to contour to an edge of a substrate and an inner ring support coupled to the polishing head. The inner support ring is adapted to contact the flexible inner retaining ring in response to a side force load applied to the flexible inner retaining ring by a substrate being polished. Numerous additional aspects are disclosed.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 1, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hung Chih Chen, Jay Gurusamy, Gautam S. Dandavate, Samuel Chu-Chiang Hsu
  • Publication number: 20130157549
    Abstract: A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.
    Type: Application
    Filed: February 15, 2013
    Publication date: June 20, 2013
    Inventors: Doyle E. Bennett, Andrew J. Nagengast, Hung Chih Chen
  • Publication number: 20130149942
    Abstract: An inner ring for a carrier head has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. An outer ring for a carrier head has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad.
    Type: Application
    Filed: February 8, 2013
    Publication date: June 13, 2013
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Yin Yuan, Huanbo Zhang, Gautam Shashank Dandavate
  • Patent number: 8460067
    Abstract: A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: June 11, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate, Denis M. Koosau
  • Patent number: 8454413
    Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: June 4, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
  • Publication number: 20130127730
    Abstract: A portable computer comprises a base, a display module, at least one support element and at least one sliding assembly. The base comprises a first area and a second area. The display module comprises a connect end and a display face. Each support element comprises a first end pivoted on a portion of the display module other than the display face and a second end pivoted on the rear end of the base. Each sliding assembly comprises a rod element disposed at least in the second area and a sleeve sliding element connected with the connect end and moved along the rod element.
    Type: Application
    Filed: September 14, 2012
    Publication date: May 23, 2013
    Applicant: Wistron Corporation
    Inventors: Shang-Mao Lee, Chun-Chien Chen, Hung-Chih Chen, Cheng-Hsiang Chuang, Chia-Lian Yen
  • Publication number: 20130128440
    Abstract: A portable computer comprises a base, a display module, and a support element. The base comprises a first area and a second area, and a sliding assembly disposed at a substantially central position of the second area. The sliding assembly comprises a sliding element and a guiding structure, and the sliding element can move along the guiding structure to slide at least in the second area. The display module comprises a connecting end combined with the sliding element and a support plane. The support element comprises a first area pivotally connected to the support plane and a second end pivotally connected to a rear end of the base. When the display module is opened, the display module further rotates around the first fixed end and moves the connecting end simultaneously; and then the display module is supported by the support element to keep a suitable tilted angle.
    Type: Application
    Filed: July 6, 2012
    Publication date: May 23, 2013
    Applicant: Wistron Corporation
    Inventors: Chun-Chien Chen, Chu-Chia Tsai, Cheng-Shing Liu, Tai-Chuan Chen, Ming-Ju Hsieh, Tien-Chung Tseng, Chien-Yuan Lai, Hung-Chih Chen, Shang-Mao Lee, Cheng-Hsiang Chuang
  • Publication number: 20130128441
    Abstract: A portable computer comprises a base, a display module, at least one support element and at least one sliding assembly. The base comprises a first area and a second area. The display module comprises a connect end and a display face. Each support element comprises a first end pivoted on a portion of the display module other than the display face and a second end pivoted on the rear end of the base. Each sliding assembly comprises a slide rail disposed at least in the second area and a roller sliding element connected with the connect end and moved along the slide rail.
    Type: Application
    Filed: September 14, 2012
    Publication date: May 23, 2013
    Applicant: Wistron Corporation
    Inventors: Shang-Mao Lee, Chun-Chien Chen, Hung-Chih Chen, Cheng-Hsiang Chuang
  • Publication number: 20130115858
    Abstract: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 9, 2013
    Inventors: Steven M. Zuniga, Hung Chih Chen
  • Patent number: 8376813
    Abstract: A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: February 19, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Doyle E. Bennett, Andrew J. Nagengast, Hung Chih Chen
  • Publication number: 20130037295
    Abstract: A fastening mechanism for an electronic device, which has a shell body and a cover having a first fastening structure, includes a press portion adapted to be exposed from the shell body and pressable to extend resiliently into the shell body, and a second fastening structure adapted to engage to and disengage from the first fastening structure to prevent and permit removal of the cover from the shell body, respectively. A resilient component is adapted to be provided in the shell body, stores a restoring force when the cover is coupled to the shell body, and releases the restoring force when the second fastening structure is disengaged from the first fastening structure for biasing the cover away from the shell body.
    Type: Application
    Filed: July 24, 2012
    Publication date: February 14, 2013
    Inventors: Chen-Yi Liang, Hung-Chih Chen