Abstract: A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically connecting pads are partially electrically connected to the circuits, and are partially electrically connected to the inner-layer circuits via conductive vias. An insulating protective layer is disposed on the circuit board body and is formed with openings therein for exposing the electrically connecting pads. Conductive posts are formed on the electrically connecting pads. Standalone metal pads are formed on the insulating protective layer but are not used for electrical connection.

Abstract: A reference voltage generation circuit includes: a bandgap reference circuit, generating a plurality of initial currents with different temperature coefficients; a base voltage generation circuit, combining the initial current into a combined current, and converting the combined current into one or more base voltages; a bias current source circuit, generating one or more bias currents based on at least one of the initial currents; and one or more regulating output circuit, each converting a respective one of the one or more bias currents into an increment voltage and adding the increment voltage to the base voltage to generate a respective output voltage. Each output voltage may have its respective temperature coefficient.

Abstract: A low noise current buffer circuit includes a first transistor, for receiving an input current, a second transistor, for draining a first current from a drain of the second transistor according to the input current received by the first transistor, a third transistor, for outputting first current, a fourth transistor, for outputting a second current to an output resistor, to generate an output voltage, and a feedback capacitor, for eliminating impacts of noise of a system voltage on the output voltage.

Abstract: The present invention provides a bandgap reference circuit. The bandgap reference circuit includes a first bipolar junction transistor, a first resistor, for generating a proportional to absolute temperature current, a second resistor, for generating a complementary to absolute temperature current, a first operational amplifier, coupled with the first bipolar junction transistor and the first resistor, a second operational amplifier, coupled with the first bipolar junction transistor and the second resistor, and a zero temperature correlated current generator, for summing the proportional to absolute temperature current and the complementary to absolute temperature current, to generate a zero temperature correlated current.

Abstract: A circuit board surface structure includes a circuit board having at least one surface provided with a plurality of electrically connecting pads, an insulating protective layer characterized by photosensitivity and solder resisting and formed on the circuit board, and a plurality of openings formed in the insulating protective layer to expose the electrical connecting pads on the circuit board and tapered upward; and a conductive element formed in the opening, so as to increase the contact area and reinforce bonding between the electrically connecting pads and the conductive element.

Abstract: The resilient assembly has an innermost inflatable enclosure, a reinforced fiber layer around the inflatable enclosure, first and second mounting members on top and bottom points of the inflatable enclosure, each mounting member having a threaded shank, a leather layer around the reinforced fiber layer and the first and second mounting members, a first cap having a central through hole, and a second cap having a central through hole so that the threaded shanks are driven through the through holes to releasably secure to the pedestal and the punching bag respectively.

Abstract: The present invention discloses an enclosed hinge device with a readily center-aligned mechanism, employing two protruded blocks of a locking retainer engaged into and fastened with two notch grooves of an arresting part to form two positioning points, such that the locking retainer and the arresting part are not slidable therebetween along with the advantage of easy assembly. Further, the securingly connection between the enclosing part, the arresting part, and the locking retainer also enhances the structural strength, thereby reducing the rotational shaking of the pivotal axle.

Abstract: An adjusting mechanism adjusts a boat to be parallel to a furnace having an opening and a receiving space, which has a first symmetrical line. When the boat having a second symmetrical line is inserted into the space, a first gap area is formed between sidewalls of the space and the boat. The mechanism includes an adjusting element and an adjusting tool, which is removably disposed in the opening and has a wide part, a narrow part and a through hole. The narrow part blocks the opening. When the boat is inserted into the space, a second gap area smaller than the first gap area is formed between the sidewalls of the boat and the through hole at the narrow part. The adjusting element adjusts the first and second symmetrical lines to be parallel to each other according to the second gap area.

Abstract: A package substrate and a manufacturing method thereof are provided, including: forming a solder mask on a package substrate body having a plurality of conductive pads; forming a plurality of first-step openings in the solder mask by exposure and development; forming a plurality of second-step openings in the solder mask by a laser-based or plasma-based drilling process; and removing a solder mask foot from the bottom of each of the first-step openings so as to expose large surface areas of the conductive pads. Hence, the contact area between a conductive element and a corresponding one of the conductive pads is large enough to enhance bonding and electrical connection therebetween.

Abstract: A semiconductor package substrate structure and a manufacturing method thereof are disclosed. The structure includes a substrate having a plurality of electrical connecting pads formed on at least one surface thereof; a plurality of electroplated conductive posts each covering a corresponding one of the electrical connecting pads and an insulating protective layer formed on the surface of the substrate and having a revealing portion for exposing the electroplated conductive posts therefrom. The invention allows the interval between the electroplated conductive posts to be minimized, the generation of concentrated stresses and the overflow of underfill to be avoided, as well as the reduction of the overall height of the fabricated package.

Abstract: An adjusting mechanism adjusts a boat to be parallel to a furnace having an opening and a receiving space, which has a first symmetrical line. When the boat having a second symmetrical line is inserted into the space, a first gap area is formed between sidewalls of the space and the boat. The mechanism includes an adjusting element and an adjusting tool, which is removably disposed in the opening and has a wide part, a narrow part and a through hole. The narrow part blocks the opening. When the boat is inserted into the space, a second gap area smaller than the first gap area is formed between the sidewalls of the boat and the through hole at the narrow part. The adjusting element adjusts the first and second symmetrical lines to be parallel to each other according to the second gap area.

Abstract: A sheath type rotating axle structure is disclosed, comprising an axle receiver disposed with a slanted corner which is further formed to have a notch therein; a sheath part disposed with a sheath end and an extending end, wherein a flute is formed at the sheath end and a rim and an annular groove are disposed between the sheath end and the extending end; and a pivotal axle pivotally connected the sheath end, disposed at its front end with a protruding ring, and embeddingly engaged with an axle hole of a fixed base at its rear end, wherein the extending end of the sheath part may be securingly mounted onto the notch of the axle receiver and the protruding ring of the pivotal axle may be abutted against the rim and the annular groove of the sheath part such that the sheath part may generate frictional torque against the pivotal axle when the axle receiver is rotated with respect to the fixed base.

Abstract: A semiconductor package substrate structure and a manufacturing method thereof are disclosed. The structure includes a substrate having a plurality of electrical connecting pads formed on at least one surface thereof; a plurality of electroplated conductive posts each covering a corresponding one of the electrical connecting pads and an insulating protective layer formed on the surface of the substrate and having a revealing portion for exposing the electroplated conductive posts therefrom. The invention allows the interval between the electroplated conductive posts to be minimized, the generation of concentrated stresses and the overflow of underfill to be avoided, as well as the reduction of the overall height of the fabricated package.

Abstract: An adjusting mechanism adjusts a boat to be parallel to a furnace having an opening and a receiving space, which has a first symmetrical line. When the boat having a second symmetrical line is inserted into the space, a first gap area is formed between sidewalls of the space and the boat. The mechanism includes an adjusting element and an adjusting tool, which is removably disposed in the opening and has a wide part, a narrow part and a through hole. The narrow part blocks the opening. When the boat is inserted into the space, a second gap area smaller than the first gap area is formed between the sidewalls of the boat and the through hole at the narrow part. The adjusting element adjusts the first and second symmetrical lines to be parallel to each other according to the second gap area.

Abstract: A conductive bump structure of a circuit board and a method for forming the same are proposed. A conductive layer is formed on an insulating layer on the surface of the circuit board. A first resist layer is formed on the conductive layer and a plurality of first openings is formed in the first resist layer to expose the conductive layer. Then, a patterned trace layer is electroplated in the first openings and a second resist layer is covered on the circuit board with the patterned trace layer. Second openings are formed in the second resist layer to expose part of the trace layer to be used as electrical connecting pads. Thereafter, metal bumps are electroplated in the second openings and the surface of the circuit board is covered with a solder mask. A thinning process is applied to the solder mask to expose the top surface of the metal bumps. Afterwards, an adhesive layer is formed on the surface of the metal bumps exposing out of the solder mask.

Abstract: A semiconductor package substrate includes a main body with a surface having a first circuit layer thereon and a dielectric layer covering the first circuit layer, with a plurality of vias on a portion of the first circuit layer; a plurality of first conductive vias disposed in the vias; a plurality of first electrically connecting pads on the first conductive vias and completely exposed on the dielectric layer having no extending circuits for a semiconductor chip to be mounted thereon, the first electrically connecting pad being electrically connected to the first circuit layer of the first conductive via; and an insulating protective layer disposed on the main body with an opening for completely exposing the first electrically connecting pads, whereby the circuit layout density is increased without disposing circuits between the electrically connecting pads.

Abstract: A method for fabricating a conductive bump structure of a circuit board is disclosed. The circuit board with a plurality of electrical connection pads is provided. An insulating protective layer and a resist layer are successively applied on the circuit board, wherein openings are formed in the layers at positions corresponding to the pads to expose the pads. Then, a conductive layer is formed on surfaces of the resist layer and openings, and a metal layer is formed on the conductive layer via electroplating and filled in the openings. Subsequently, the metal layer and conductive layer formed on the resist layer are removed via thinning, so as to form metal bumps on the pads. After the resist layer is removed, the metal bumps are covered by an adhesive layer to form a conductive bump structure for electrically connecting the circuit board to the external electronic component.

Abstract: Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first and second conductive layers on the circuit board; forming first and second resist layers respectively on the first and second conductive layers, the resist layers having a plurality of openings for exposing the conductive layers on the pads; forming a metal layer in the openings of the first and second resist layers; and forming a first connecting layer on the metal layer; forming third and fourth resist layers on the first and second resist layers respectively, the third resist layer having a plurality of openings for exposing the first connecting layer on the metal layer on the second electrically.

Abstract: A filtering device and a filtering method and a semiconductor fabricating method thereof. The filtering device is used for filtering a gas had a first temperature. The filtering device includes a casing, a cooling mechanism and at least one adsorbing element. The casing has an input opening, an output opening and a cooling space. The gas enters the cooling space through the input opening and leaves the cooling space through the output opening. The cooling mechanism coupled to the casing is used for maintaining the cooling space at a second temperature that is lower than the first temperature. At least one adsorbing element is disposed inside the cooling space and has a plurality of surface-increasing elements arranged in a direction parallel. The plurality of surface-increasing elements arranged in the direction parallel to that the gas flows inside the cooling space for contacting the gas and adsorbing particles in the gas.

Abstract: An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second resist layer thereon, so as to form electrical connection pads and metal bumps on the electrical connection pads. The first and second resist layers are formed with openings therein at positions corresponding to the electrical connection pads and metal bumps, and the exposed conductive layer is removed. An adhesive layer is formed to cover the exposed surfaces of the electrical connection pads and the metal bumps. Then, the second resist layer, the first resist layer and the conductive layer covered by the first resist layer are removed. Later, an insulating protective layer is formed on a surface of the circuit board, and thinned to expose a portion of the adhesive layer, such that electrical connectors of the circuit board are fabricated.