Abstract: The present invention discloses a sheath type rotating axle structure with automatic locking mechanism, comprising a sheath device, a retainer, a pivotal axle, a locking fastener, a locking rotator, a resilient body, and a screw nut. The first axle segment of the pivotal axle is pivoted to the sheath of the sheath device to realize the function of “easy opening and firm closing,” and the sheath device is disposed with a retainer on one end to achieve the “anti-shaking” function. The second axle segment of the pivotal axle is pivoted to the through hole of the retainer and embeddingly inserted into a locking fastener and a locking rotator. The locking fastener is disposed with a pin to be securingly fixed with a pin hole formed on the retainer, and a screw nut is used to securingly fix a plurality of resilient discs or a spring. When the pivotal axle is rotated to drive the locking fastener departing from the locked position, the resilient discs (or spring) are compressed by the locking rotator.

Abstract: A method for reducing memory consumption when carrying out edge enhancement in a multiple beam pixel apparatus is provided, wherein Static Random Access Memories and first in first out buffers are employed. When the first to the nth input units read the next bit data, the first rows of the bit data in the first to the nth buffers are removed, and each row of bit data behind the first rows is moved towards left by one bit. The first rows of bit data in the (n+1)th to the (n+4)th buffers are stored in one end of the first to the fourth memories respectively, and a bit data is taken out from the other end of each of the memories, to be sequentially stored in the end of the first to the fourth buffers, and the read next bit data is stored in the fifth to the (n+4)th buffers.

Abstract: The present invention relates to a covered rotation shaft structure having auto locking function, includes: a cover member having a covering end, and one lateral side of the cover member is provided with a bump; a pivotal shaft having a first shaft section and a second shaft section, the first shaft section is pivotally provided on the covering end and the second shaft section is pivotally provided on a through hole of a retaining unit; a cam member composed by the above mentioned retaining unit and a rotating unit, the retaining unit has the above mentioned through hole and a concave slot, and the concave slot is served to mount the bump, so the retaining unit is retained on one side of the cover member, and the through hole is disposed adjacent to the covering end; and the rotating unit is provided on the second shaft section of the pivotal shaft and is provided against the retaining unit; at least one resilient member provided on the second shaft section of the pivotal shaft, and a screw nut is provided at

Abstract: A print control device with an embedded engine simulation module and the test method thereof are disclosed. With the engine simulation module is inserted in the print control device, the print engine signal is directly sent to the video signal processor of the print control device. The video signal processor follows the print engine signal along with the clock and video signals to print data signals, thereby testing the print control device. Therefore, adjustments of the print engine signal can directly simulate the situations of supporting different print engines.

Abstract: A sheath type rotating axle structure is disclosed, comprising an axle receiver disposed with a slanted corner which is further formed to have a notch therein; a sheath part disposed with a sheath end and an extending end, wherein a flute is formed at the sheath end and a rim and an annular groove are disposed between the sheath end and the extending end; and a pivotal axle pivotally connected the sheath end, disposed at its front end with a protruding ring, and embeddingly engaged with an axle hole of a fixed base at its rear end, wherein the extending end of the sheath part may be securingly mounted onto the notch of the axle receiver and the protruding ring of the pivotal axle may be abutted against the rim and the annular groove of the sheath part such that the sheath part may generate frictional torque against the pivotal axle when the axle receiver is rotated with respect to the fixed base With the implementation of the present invention, the pivotal axle, the sheath part, and the axle receiver can be p

Abstract: A semiconductor package substrate includes a main body with a surface having a first circuit layer thereon and a dielectric layer covering the first circuit layer, with a plurality of vias on a portion of the first circuit layer; a plurality of first conductive vias disposed in the vias; a plurality of first electrically connecting pads on the first conductive vias and completely exposed on the dielectric layer having no extending circuits for a semiconductor chip to be mounted thereon, the first electrically connecting pad being electrically connected to the first circuit layer of the first conductive via; and an insulating protective layer disposed on the main body with an opening for completely exposing the first electrically connecting pads, whereby the circuit layout density is increased without disposing circuits between the electrically connecting pads.

Abstract: The present invention discloses an enclosed hinge device with a readily center-aligned mechanism, employing two protruded blocks of a locking retainer engaged into and fastened with two notch grooves of an arresting part to form two positioning points, such that the locking retainer and the arresting part are not slidable therebetween along with the advantage of easy assembly. Further, the securingly connection between the enclosing part, the arresting part, and the locking retainer also enhances the structural strength, thereby reducing the rotational shaking of the pivotal axle.

Abstract: A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically connecting pads are partially electrically connected to the circuits, and are partially electrically connected to the inner-layer circuits via conductive vias. An insulating protective layer is disposed on the circuit board body and is formed with openings therein for exposing the electrically connecting pads. Conductive posts are formed on the electrically connecting pads. Standalone metal pads are formed on the insulating protective layer but are not used for electrical connection.

Abstract: A semiconductor package substrate structure and a manufacturing method thereof are disclosed. The structure includes a substrate having a plurality of electrical connecting pads formed on at least one surface thereof; a plurality of electroplated conductive posts each covering a corresponding one of the electrical connecting pads and an insulating protective layer formed on the surface of the substrate and having a revealing portion for exposing the electroplated conductive posts therefrom. The invention allows the interval between the electroplated conductive posts to be minimized, the generation of concentrated stresses and the overflow of underfill to be avoided, as well as the reduction of the overall height of the fabricated package.

Abstract: A structure of a packaging substrate and a method for making the same are disclosed, wherein the structure comprises: a substrate body having a circuit layer on the surface thereof, wherein the circuit layer has a plurality of conductive pads which are each formed in a flat long shape to enhance the elasticity of circuit layout; a solder mask disposed on the substrate body and having a plurality of openings corresponding to and exposing the conductive pads, wherein the openings are each formed in a flat long shape; and a metal bump disposed in each of the openings of the solder mask and on each of the corresponding conductive pads.

Abstract: The present invention relates to a packaging substrate and a method for manufacturing the same. The packaging substrate includes: a substrate body, having a plurality of conductive pads on the surface thereof, wherein the top surfaces of the conductive pads have a concave each; a solder mask, disposed on the surface of the substrate body and having a plurality of openings to correspondingly expose the concaves of the conductive pads each; and a plurality of metal bumps, disposed correspondingly in the openings of the solder mask and over the concaves of the conductive pads. The present invention increases the joint surface area between the metal bumps and the conductive pads so as to inhibit the joint crack and improve the reliability of the conductive structure of the packaging substrate.

Abstract: A circuit board surface structure includes a circuit board having at least one surface provided with a plurality of electrically connecting pads, an insulating protective layer characterized by photosensitivity and solder resisting and formed on the circuit board, and a plurality of openings formed in the insulating protective layer to expose the electrical connecting pads on the circuit board and tapered upward; and a conductive element formed in the opening, so as to increase the contact area and reinforce bonding between the electrically connecting pads and the conductive element.

Abstract: A method for fabricating a conductive bump structure of a circuit board is disclosed. The circuit board with a plurality of electrical connection pads is provided. An insulating protective layer and a resist layer are successively applied on the circuit board, wherein openings are formed in the layers at positions corresponding to the pads to expose the pads. Then, a conductive layer is formed on surfaces of the resist layer and openings, and a metal layer is formed on the conductive layer via electroplating and filled in the openings. Subsequently, the metal layer and conductive layer formed on the resist layer are removed via thinning, so as to form metal bumps on the pads. After the resist layer is removed, the metal bumps are covered by an adhesive layer to form a conductive bump structure for electrically connecting the circuit board to the external electronic component.

Abstract: The traditional single pole perpendicular writer has two major problems—insufficient field gradient in the down track direction and adjacent track erasure (ATE) caused by side fringing fields. These problems have been overcome by tapering the main pole and then shielding it on all four sides.

Abstract: A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second surfaces of a circuit board; forming a conductive layer on the first insulating protective layer and the openings; forming first and second resist layers on the conductive layer and the second insulating protective layer respectively; forming first electrically connecting structures by electroplating on the exposed conductive layer over a plurality of first and second electrically connecting pads in openings of the first resist layer; removing the first and the second resist layers and the conductive layer covered by the first resist layer; and forming second electrically connecting structures by stencil printing on the conductive layer over the second electrically connecting pads on the first surface and on a plurality of third electrically connecting pads of the second surface of the circuit board.

Abstract: A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure having a plurality of conductive pads is formed on each of the first surface and the second surface, and conductive structures are formed in the circuit board for electrically connecting the circuit structures. Also, an insulating layer having a plurality of openings penetrating therethrough is formed on the circuit board for exposing the conductive pad. Then, a conductive layer is formed on a surface of the insulating layer having the opening formed on the first surface of the circuit board. An electroplating process is performed via the conductive layer and the conductive structure, such that a conductive bump is formed on the conductive pad located on the second surface of the circuit board.

Abstract: The conductive connection structure of the present invention comprises a circuit board, a plurality of conductive pads, a solder mask layer, an electroless plating copper layer, and an electroless plating adhesive layer. The manufacturing method comprises the following steps: providing the circuit board having a plurality of conductive pads thereon; forming the solder mask layer, the electroless plating copper layer, and the electroless plating adhesive layer respectively on the surface of the circuit board, and forming a solder bump on the electroless plating adhesive layer. By the assistance of the conductive connection structure and the manufacturing method thereof, cavity otherwise formed on the conductive pads can be prevented, and the solder bumps therefore are firmly fixed on the conductive pads. Moreover, the stress in the surface between the solder bump and the conductive pad can be reduced as the semiconductor chip and the circuit board are combined.

Abstract: A coin outlet unit is disclosed to include a casing having a coin outlet, and an adjustment structure for adjusting the size of the coin outlet. The adjustment structure positioning spaces arranged in a line perpendicular to the extending direction of the coin outlet, locating holes arranged in parallel to the positioning spaces, an adjustment block, which has a bottom rod selectably inserted into one of the positioning spaces and a plurality of adjustment holes, and a locking member insertable through the adjustment holes into the locating holes to lock the adjustment block.

Abstract: A filtering device and a filtering method and a semiconductor fabricating method thereof. The filtering device is used for filtering a gas had a first temperature. The filtering device includes a casing, a cooling mechanism and at least one adsorbing element. The casing has an input opening, an output opening and a cooling space. The gas enters the cooling space through the input opening and leaves the cooling space through the output opening. The cooling mechanism coupled to the casing is used for maintaining the cooling space at a second temperature that is lower than the first temperature. At least one adsorbing element is disposed inside the cooling space and has a plurality of surface-increasing elements arranged in a direction parallel. The plurality of surface-increasing elements arranged in the direction parallel to that the gas flows inside the cooling space for contacting the gas and adsorbing particles in the gas.

Abstract: A method for cleaning a reactor and a method for manufacturing a chip thereof are provided. The reactor at least includes a reaction cavity and an inner tube. The inner tube is disposed inside the reaction cavity. The wall of the inner tube has a foreign particle. In the cleaning method, firstly, a continuous fluid is induced into and out of the reaction cavity. Next, the pressure of the continuous fluid is adjusted to be within a range from 100 torr to 300 torr for removing and taking the foreign particle out of the reaction cavity.