Abstract: Methods, systems, and devices for wireless communication are described, including techniques for utilizing implicit or explicit signaling to indicate a cancellation of demodulation reference signal (DMRS) bundling. A first user equipment (UE) may perform DMRS bundling across physical sidelink channels transmitted to a second UE to enable the second UE to perform joint channel estimation. In some examples, based on a detected change, either at the first UE or the second UE, the first UE may signal to the second UE that the DMRS bundling is canceled. In some examples, the detected change may be a resource allocation change, a physical channel configuration change, a change in a quasi-colocation (QCL) relationship at the first UE, or a change in a transmission configuration indicator (TCI) state at the first UE. Additionally or alternatively, the first UE or the second UE may request the cancellation based on detected changes.

Abstract: A cooling system includes a tank, a heat exchanger, a separation tank, a first tube, a second tube, a third tube, a gas storage device, a fourth tube, a first valve, a second valve and a third valve. A heating element is immersed in a dielectric liquid in the tank. The heat exchanger condenses dielectric vapor of the dielectric liquid. The separation tank is used for a separation operation. The first tube is connected to the tank and the heat exchanger. The second tube is connected to the heat exchanger and the separation tank. The third tube is connected to the separation tank and the tank. The gas storage device stores the dielectric vapor. The fourth tube is connected to the gas storage device and the separation tank.

Abstract: Methods, systems, and devices for wireless communications are described in which a user equipment (UE) may be configured with periodic uplink grants that provide a number of repetitions and a redundancy version (RV) sequence for the repetitions. Prior to the start of an uplink grant period, the UE may determine a set of slots that are available for uplink transmissions in the uplink grant period. Based on the set of slots, the UE may determine a corresponding RV for repetitions of the uplink communication associated with each slot. The slots with uplink transmissions within the uplink grant period may be non-contiguous. Repetitions of an uplink communication may be configured to be transmitted across multiple uplink grant periods, which may be triggered based on a threshold value associated with the repetitions.

Abstract: A bimetallic faceplate for substrate processing is provided including a plate having a plurality of gas distribution holes and formed of a first metal having a first coefficient of thermal expansion, the plate having at least one groove around a center of the plate and spaced from the center of the plate; and a metallic element disposed in the at least one groove and fixed to the plate in the at least one groove, the metallic element having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, the metallic element being symmetrically arranged on or in the plate. A chamber for substrate processing is provided that includes a bimetallic faceplate. Also, a method of making a bimetallic faceplate is provided.

Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.

Abstract: In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.

Abstract: A mending method for a display includes the steps of making a display device light to make a plurality of light emitting positions thereof shine, searching out a plurality of defect positions among the light emitting positions, providing a transferring device having a transferring surface with a plurality of miniature light emitting elements positioned correspondingly to the light emitting positions, planning a mending procedure which includes in the area the transferring surface corresponds to, choosing in chief the largest number of defect positions able to be mended at a single time according to the positions of the miniature light emitting elements and then in the area the transferring surface corresponds to, planning the rest of the defect positions according to the rest of the miniature light emitting elements, and according to the mending procedure, moving the transferring device to weld the miniature light emitting elements at the defect positions.

Abstract: A condenser includes a casing and pipes. The casing includes an inlet chamber, an outlet chamber, a first inlet, a first outlet, an accommodation space, a second inlet, and a second outlet. The first inlet and the first outlet are respectively in fluid communication with the inlet chamber and the outlet chamber. The accommodation space accommodates a coolant, and the second inlet and the second outlet are in fluid communication with the accommodation space not in fluid communication with the inlet chamber and the outlet chamber. The pipes are in the accommodation space and connect the inlet chamber with the outlet chamber, and a working fluid flows from the inlet chamber to the outlet chamber via the pipes. The first inlet is located closer to the second outlet than the first outlet, and the first outlet is located closer to the second inlet than the first inlet.

Abstract: A cooling system of server includes a tank and a pressure control device. The tank is configured to accommodate a dielectric fluid. The pressure control device is configured to regulate the pressure of the tank. The pressure control device includes a condenser, a dehumidifier, a gas storage chamber, and a valve. The condenser is connected to the tank. The dehumidifier is connected to the condenser. The gas storage chamber is connected to the dehumidifier. The valve is connected between the dehumidifier and the gas storage chamber. The valve is configured to communicate and not to communicate the dehumidifier and the gas storage chamber.

Abstract: A semiconductor chip includes a physical layer and a processing circuit. The physical layer includes an input/output circuit, at least one sequence checking circuit and at least one signal transmission path, wherein the at least one sequence checking circuit is configured to generate at least one test result signal according to a clock signal transmitted through the input/output circuit and at least one test data signal transmitted through the at least one signal transmission path. The processing circuit is electrically coupled to the physical layer and is configured to determine an operation status of the at least one signal transmission path according to a voltage level of the at least one test result signal.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A network node may transmit a first signal to a first radio at a user equipment (UE). The UE may receive the first signal from the network node. The first signal may include a first configuration for a second radio at the UE. The UE may operate the second radio in a first mode based on the first configuration received via the first radio. The first radio may have a lower power consumption than the second radio or the second radio may have the lower power consumption than the first radio. For example, one radio may be a low-power wake-up radio (LP-WUR) having a lower power consumption than a main radio (MR) at the UE. The network node and the UE may communicate with one another via the second radio at the UE based on the first configuration transmitted to the first radio.

Abstract: A method of forming a three-dimensional (3D) memory device includes: forming, over a substrate, a layer stack having alternating layers of a first conductive material and a first dielectric material; forming trenches extending vertically through the layer stack from an upper surface of the layer stack distal from the substrate to a lower surface of the layer stack facing the substrate; lining sidewalls and bottoms of the trenches with a memory film; forming a channel material over the memory film, the channel material including an amorphous material; filling the trenches with a second dielectric material after forming the channel material; forming memory cell isolation regions in the second dielectric material; forming source lines (SLs) and bit lines (BLs) that extend vertically in the second dielectric material on opposing sides of the memory cell isolation regions; and crystallizing first portions of the channel material after forming the SLs and BLs.

Abstract: Various embodiments are disclosed for providing machine learning routines with peripheral device data to infer driver activity and location. Peripheral device data may be collected on a peripheral device having a machine learning routine executing thereon to infer driver activity and perform improved estimation of driver location. Using driver activity and location estimation, contextually relevant delivery workflow assistance may be automatically provided to a delivery driver or other individual without requiring manual input, thereby improving driver safety and operational efficiency.

Abstract: A semiconductor structure includes a substrate with a first surface and a second surface opposite to the first surface, a first and a second shallow trench isolations disposed in the substrate and on the second surface, a deep trench isolation structure in the substrate and coupled to the first shallow trench isolation, a first dielectric layer disposed on the first surface and coupled to the deep trench isolation structure, a second dielectric layer disposed over the first dielectric layer and coupled to the deep trench isolation structure, a third dielectric layer comprising a horizontal portion disposed over the second dielectric layer and a vertical portion coupled to the horizontal portion, and a through substrate via structure penetrating the substrate from the first surface to the second surface and penetrating the second shallow trench isolation.

Abstract: The disclosure provides a control method of a display driver. The control method includes receiving address information and defining an IC address according to the address information. The IC address includes n bits representing k zones, and n and k are positive integers. The control method further includes receiving the IC address, a black frame data signal and a pulse-width modulation (PWM) signal, and turning on or off the plurality of LEDs in the corresponding zone according to toggle of bit in the black frame data signal. Each bit in the black frame data signal indicates that a plurality of LEDs in a zone among the k zones are turned on or off.

Abstract: A server includes a chassis and a storage module. The storage module is disposed in the chassis. The storage module includes a base, a first electrical connector, a storage device, a connecting member and a first fixing member. A first side of the base has a first fixing portion. The first electrical connector is disposed at a second side of the base, wherein the second side is opposite to the first side. The storage device has a second electrical connector. The connecting member is connected to the storage device. The first fixing member is disposed on the connecting member. The second electrical connector is connected to the first electrical connector and the first fixing member is fixed to the first fixing portion, so as to fix the storage device on the base.

Abstract: An accessory interface for an electronic host device includes a digital communication bus including a plurality of communication lines configured to pass data between the electronic host device and an electronic accessory device. The accessory interface further includes detection circuitry selectively coupled to the plurality of communication lines via a multiplexer and configured to detect analog voltage levels across the plurality of communication lines, determine a device type of the electronic accessory device based on the detected analog voltage levels, and control the multiplexer to couple the plurality of communication lines to a host processor of the electronic host device upon determining the device type of the electronic accessory device. The host processor is configured to receive the device type of the electronic accessory device and transmit data via the plurality of communication lines to the electronic accessory device in accordance with the device type of the electronic accessory device.

Abstract: Method, apparatus, and computer-readable medium of wireless communication at a sidelink device include: receiving a configuration of multiple bandwidth parts (BWPs) for sidelink communication, each bandwidth part (BWP) comprising one or more sidelink resource pools; activating a BWP from the multiple BWPs configured for the sidelink communication; and transmitting or receiving sidelink communication in resources from a resource pool in the activated BWP.