Abstract: A method for fabricating metal gate transistor is disclosed. The method includes the steps of: providing a substrate having a NMOS region and a PMOS region; forming a dummy gate on each of the NMOS region and the PMOS region respectively; removing the dummy gates from each of the NMOS region and the PMOS region; forming a n-type work function layer on the NMOS region and the PMOS region; removing the n-type work function layer in the PMOS region; forming a p-type work function layer on the NMOS region and the PMOS region; and depositing a low resistance metal layer on the p-type work function layer of the NMOS region and the PMOS region.

Abstract: A power supplying device is electrically connected to an alternating current (AC) power supplier and an electronic system. The power supplying device includes a rectifier, a power converter, a controller, a power manager, and a switch component. The power converter is electrically connected to the rectifier and includes a first electric power outputting terminal and a standby electric power outputting terminal. The standby electric power outputting terminal is electrically connected to the electronic system. The controller is electrically connected to the power converter. The power manager is electrically connected to the controller and the electronic system. The switch component is electrically connected to the first electric power outputting terminal, the power manager, and the electronic system. The switch component conducts or cuts-off an electric power outputted form the first electric power outputting terminal and transmitting to the electronic system according to controls of the power manager.

Abstract: A connector assembly includes a female connector and a mal connector. The female connector includes a first main body and a number of slots defined in the first main body, and each slot receives a conductive terminal therein. First and second row conductive terminals are arranged along an opposite direction. A number of cables are attached to the first main body and electrically connected to the conductive terminals. A male connector includes a second main body and a number of conductive pins extend through the second main body. Third row conductive pins are corresponding to the first row conductive terminals. Fourth row conductive pins are corresponding to the second row conductive terminals. The connector assembly can transmit signals normally whatever the male connector is plugged to the female connector.

Abstract: A photoresist removal method is described. A substrate having thereon a positive photoresist layer to be removed is provided. The positive photoresist layer is UV-exposed without using a photomask. A development liquid is used to remove the UV-exposed positive photoresist layer. The substrate as provided may further have thereon a sacrificial masking layer under the positive photoresist layer. The sacrificial masking layer is removed after the UV-exposed positive photoresist layer is removed.

Abstract: A server backplate includes a plate, a power connector, a first connector and a second connector. The plate includes a top surface, a first surface, and a second surface opposing the first surface. The top surface connects the first surface and the second surface. The power connector is arranged on the first surface and configured to couple to a power supply unit. The first connector is arranged on the first surface and configured to couple to a first storage device. The second connector is arranged on the second surface and configured to couple to a second storage device. The power connector is electrically connected to the first connector and the second connector, and the first connector is closer to the top surface than the second connector.

Abstract: A semiconductor process is provided. The prior steps include: a first gate including a first cap layer and a second gate including a second cap layer are formed on a substrate. A hard mask layer is formed to cover the first gate and the second gate. The material of the hard mask layer is different from the material of the first cap layer and the second cap layer. The hard mask layer is removed entirely after a lithography process and an etching process are performed. The following steps include: a material is formed to entirely cover the first gate and the second gate. The material, the first gate and the second gate are etched back to make the first gate and the second gate have the same level and expose layers in both of them.

Abstract: A connector assembly includes a female connector and a mal connector. The female connector includes a first main body and a number of slots defined in the first main body, and each slot receives a conductive terminal therein. First and second row conductive terminals are arranged along an opposite direction. A number of cables are attached to the first main body and electrically connected to the conductive terminals. A male connector includes a second main body and a number of conductive pins extend through the second main body. Third row conductive pins are corresponding to the first row conductive terminals. Fourth row conductive pins are corresponding to the second row conductive terminals. The connector assembly can transmit signals normally whatever the male connector is plugged to the female connector.

Abstract: A 2 unit (U) server includes a 2U chassis, two system modules, and two power supply units. The chassis includes a bottom plate, two side plates, a cover, and a middle plate arranged between the side plates in parallel. A supporting plate is connected between rear ends of the middle plate and each side plate. A distance between each supporting plate and the cover, and a distance between each supporting plate and the bottom plate is the same, being equal to 1U. A space between the middle plate and each side plate receives one of the system modules. A height of a front end of each system module is 2U. A height of a rear end of each system module is 1U. The rear end of each system module is received between the bottom plate and one of the supporting plates. Each supporting plate supports a power supply unit.

Abstract: A front panel assembly includes a front panel body and an identification plate. The identification plate includes a main body marked with a logo and rotatably attached to the panel body, and a weight piece attached to the main body at a bottom of the logo. The main body of the identification plate is made of plastic. The weight piece is made of steel. If the panel body is rotated, gravity acts on the weight piece driving the main body to rotate until the weight piece is toward the ground, thereby making the logo always appear to be upright.

Abstract: A computing device provides a random number table. Formulas for calculating size differences between a first object and a second object are written to the random number table. The random number table is controlled to select random samples which are taken as an actual size of the first object and an actual size of the second object. According to a user's requirement, the random samples are selected many times. The computing device obtains an absolute value of size difference which is the most in the random number table. All actual maximum differences and all actual minimum differences corresponding to the obtained absolute value of size difference are obtained. The computing device selects a maximum value of the all actual maximum differences and a minimum value of the all actual minimum differences as a standard for manufacturing the first object and the second object.

Abstract: A server structure is disclosed including a server cabinet, spaced fixing units, and server groups. Each server unit includes a first server unit and a second server unit fixed to supporting frames of the server cabinet by first fixing plates and the second fixing plates of the fixing units, respectively. The first server unit alternately abuts the second server unit, and the stacked height of each first server unit and the abutting second server unit is equivalent to the height along the supporting frame occupied by the corresponding fixing unit.

Abstract: An apparatus includes a server cabinet configured to receive a plurality of servers therein, and a single heat dissipation device mounted on the server cabinet and positioned outside of the plurality of servers. The heat dissipation device includes a plurality of fans, and each of the plurality of fans is configured to dissipate heat generated in the overall server cabinet.

Abstract: A serial advanced technology attachment (SATA) DIMM device includes a board body. A control chip is arranged on the board body. First and second extending boards extend from an end of the board body and a space is defined between the first and the second extending boards. A first edge connector is set on the first extending board and a second edge connector is set on the bottom edges of the second extending board and the board body. The first edge connector includes a number of signal pins connected to the control chip, and a number of ground pins.

Abstract: A serial advanced technology attachment assembly includes a solid state drive and a serial advanced technology attachment. The solid state drive extends in a first longitudinal direction. The serial advanced technology attachment includes a first connector and a second connector; the first connector electrically connects the serial advanced technology attachment, the second connector extends in a second longitudinal direction parallel to the first longitudinal direction.

Abstract: An attachment mechanism for an electronic component includes a circuit board, an engaging member, and a pivoting member. The circuit board comprises a first connector to be connected to a second connector of the electronic component. The pivoting member is rotatably connected to the engaging member. The first connector is sandwiched by the pivoting member and the engaging member. The pivoting member includes a resilient bar to abut against a first end of a top surface of the electronic component.

Abstract: A photoresist removal method is described. A substrate having thereon a positive photoresist layer to be removed is provided. The positive photoresist layer is UV-exposed without using a photomask. A development liquid is used to remove the UV-exposed positive photoresist layer. The substrate as provided may further have thereon a sacrificial masking layer under the positive photoresist layer. The sacrificial masking layer is removed after the UV-exposed positive photoresist layer is removed.

Abstract: A method for forming photoresist patterns includes providing a substrate, forming a bi-layered photoresist on the substrate, and performing a photolithography process to pattern the bi-layered photoresist. The bi-layered photoresist includes a first photoresist layer and a second photoresist layer positioned between the first photoresist layer and the substrate. The first photoresist layer has a first refraction index and the second photoresist layer has a second refraction index, and the second refraction index is larger than the first refraction index.

Abstract: An attachment mechanism for an electronic component includes a circuit board, an engaging member, and a pivoting member. The circuit board comprises a first connector to be connected to a second connector of the electronic component. The pivoting member is rotatably connected to the engaging member. The first connector is sandwiched by the pivoting member and the engaging member. The pivoting member includes a resilient bar to abut against a first end of a top surface of the electronic component.

Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a circuit board and a cable member. A first edge connector is set on a bottom edge of the circuit board to be connected to a memory slot of a motherboard. A second edge connector is arranged on an end of the circuit board. The cable member includes a cable, a first storage device interface extending from a first end of the cable to be connected to a second storage device interface of the motherboard, and a third edge connector formed on a second end of the cable and soldered to the second edge connector.

Abstract: A semiconductor process is provided. The prior steps include: a first gate including a first cap layer and a second gate including a second cap layer are formed on a substrate. A hard mask layer is formed to cover the first gate and the second gate. The material of the hard mask layer is different from the material of the first cap layer and the second cap layer. The hard mask layer is removed entirely after a lithography process and an etching process are performed. The following steps include: a material is formed to entirely cover the first gate and the second gate. The material, the first gate and the second gate are etched back to make the first gate and the second gate have the same level and expose layers in both of them.